ES2075599T3 - Tarjeta de circuito impreso de dos capas o multicapa. - Google Patents

Tarjeta de circuito impreso de dos capas o multicapa.

Info

Publication number
ES2075599T3
ES2075599T3 ES92203266T ES92203266T ES2075599T3 ES 2075599 T3 ES2075599 T3 ES 2075599T3 ES 92203266 T ES92203266 T ES 92203266T ES 92203266 T ES92203266 T ES 92203266T ES 2075599 T3 ES2075599 T3 ES 2075599T3
Authority
ES
Spain
Prior art keywords
hole
conductor pattern
solder
adhesive layer
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES92203266T
Other languages
English (en)
Inventor
Rudolf Drabek
Werner Uggowitzer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electronics NV filed Critical Philips Electronics NV
Application granted granted Critical
Publication of ES2075599T3 publication Critical patent/ES2075599T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/091—Locally and permanently deformed areas including dielectric material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Medicines Containing Material From Animals Or Micro-Organisms (AREA)
  • Hall/Mr Elements (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)
  • Combinations Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

UNA PLACA DE CIRCUITO IMPRESO MULTICAPA O BICAPA (1) COMPRENDE UNA PLACA DE SOPORTE(2) QUE LLEVA UN PRIMER PATRON CONDUCTOR (3) Y UN SEGUNDO PATRON CONDUCTOR (21) QUE ESTA CONECTADO A DICHA PLACA DE SOPORTE (2) POR MEDIO DE UNA CAPA ADHESIVA (13) QUE CONSISTE EN MATERIAL ADHESIVO, UNA CAPA DE DETENCION DE SOLDADURA (30) QUE SE APLICA A DICHO PATRON CONDUCTOR SEGUNDO. SE FORMA UN ORIFICIO (14,15) EN LA CAPA ADHESIVA (13) POR MEDIO DEL CUAL SE PUEDE CONECTAR ELECTRICAMENTE UNA SECCION DE SOLDADURA (4,5) DE PATRON CONDUCTOR PRIMERO (3) A UNA SECCION DE SOLDADURA (22,23) DE UN PATRON CONDUCTOR SEGUNDO (21) POR MEDIO DE UNA JUNTA DE SOLDADURA (37,38), FORMANDOSE UN ORIFICIO ADICIONAL (31,32) EN LA CAPA DE DETENCION DE SOLDADURA (30) COMUNICANDO ESTE ORIFICIO CON EL ORIFICIO (14,15) EN LA CAPA ADHESIVA (13) Y SIENDO EL AREA TRANSVERSAL DE DICHO ORIFICIO ADICIONAL DIVISIBLE EN DOS AREAS DE IGUAL FORMA Y SUPERFICIE, SIENDO UNA DE LAS AREAS COINCIDENTE CON EL AREA TRANSVERSAL DE ORIFICIO (14,15) ENLA CAPA ADHESIVA (13) Y ESTANDO LA OTRA AREA SITUADA COMPLETAMENTE DENTRO DE UN AREA CERRADA DE LA SECCION DE SOLDADURA (22,23) DEL PATRON CONDUCTOR SEGUNDO (21).
ES92203266T 1991-10-31 1992-10-23 Tarjeta de circuito impreso de dos capas o multicapa. Expired - Lifetime ES2075599T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
AT0217191A AT398876B (de) 1991-10-31 1991-10-31 Zwei- oder mehrlagige leiterplatte

Publications (1)

Publication Number Publication Date
ES2075599T3 true ES2075599T3 (es) 1995-10-01

Family

ID=3529249

Family Applications (1)

Application Number Title Priority Date Filing Date
ES92203266T Expired - Lifetime ES2075599T3 (es) 1991-10-31 1992-10-23 Tarjeta de circuito impreso de dos capas o multicapa.

Country Status (8)

Country Link
US (1) US5403978A (es)
EP (1) EP0540101B1 (es)
JP (1) JPH05218627A (es)
AT (2) AT398876B (es)
DE (1) DE69202749T2 (es)
DK (1) DK0540101T3 (es)
ES (1) ES2075599T3 (es)
MY (1) MY110093A (es)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6076726A (en) * 1998-07-01 2000-06-20 International Business Machines Corporation Pad-on-via assembly technique
KR100333612B1 (ko) * 1999-09-21 2002-04-24 구자홍 인쇄회로기판의 회로패턴 노출부 형성방법
US6594153B1 (en) * 2000-06-27 2003-07-15 Intel Corporation Circuit package for electronic systems
DE10361650A1 (de) * 2003-12-30 2005-08-04 Osram Opto Semiconductors Gmbh Optoelektronisches Modul und Verfahren zu dessen Herstellung
TWI355220B (en) 2008-07-14 2011-12-21 Unimicron Technology Corp Circuit board structure
CN102281724B (zh) * 2011-08-26 2013-05-22 广州杰赛科技股份有限公司 双面开窗塞孔的加工方法
JP7381323B2 (ja) * 2019-12-17 2023-11-15 日東電工株式会社 両面配線回路基板の製造方法および両面配線回路基板
CN115038253B (zh) * 2022-06-15 2023-07-14 江门崇达电路技术有限公司 一种线路板上多种类型的pad精准等大的制作方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3739469A (en) * 1971-12-27 1973-06-19 Ibm Multilayer printed circuit board and method of manufacture
FR2296988A1 (fr) * 1974-12-31 1976-07-30 Ibm France Perfectionnement aux procedes de fabrication d'un module de circuits multicouches en ceramique
JPS5441102B2 (es) * 1975-03-04 1979-12-06
DE2716545A1 (de) * 1977-04-14 1978-10-19 Siemens Ag Gedruckte schaltungsplatte mit mindestens zwei verdrahtungslagen
JPS5797970U (es) * 1980-12-08 1982-06-16
US4963697A (en) * 1988-02-12 1990-10-16 Texas Instruments Incorporated Advanced polymers on metal printed wiring board
US5072075A (en) * 1989-06-28 1991-12-10 Digital Equipment Corporation Double-sided hybrid high density circuit board and method of making same

Also Published As

Publication number Publication date
DE69202749D1 (de) 1995-07-06
DE69202749T2 (de) 1996-02-08
US5403978A (en) 1995-04-04
JPH05218627A (ja) 1993-08-27
AT398876B (de) 1995-02-27
MY110093A (en) 1997-12-31
ATE123372T1 (de) 1995-06-15
DK0540101T3 (da) 1995-11-06
EP0540101A1 (en) 1993-05-05
EP0540101B1 (en) 1995-05-31
ATA217191A (de) 1994-06-15

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