ES2080232T3 - Composiciones de resina epoxi para encapsular elementos semiconductores. - Google Patents

Composiciones de resina epoxi para encapsular elementos semiconductores.

Info

Publication number
ES2080232T3
ES2080232T3 ES91200269T ES91200269T ES2080232T3 ES 2080232 T3 ES2080232 T3 ES 2080232T3 ES 91200269 T ES91200269 T ES 91200269T ES 91200269 T ES91200269 T ES 91200269T ES 2080232 T3 ES2080232 T3 ES 2080232T3
Authority
ES
Spain
Prior art keywords
encapsulate
epoxy resin
semiconducting elements
resin compositions
epoxide resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES91200269T
Other languages
English (en)
Inventor
Yasukuki Murata
Isako Yuka Konishi
Yoshinoi Nakanishi
Takuya Kurio
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHELL INT RESEARCH
Shell Internationale Research Maatschappij BV
Original Assignee
SHELL INT RESEARCH
Shell Internationale Research Maatschappij BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SHELL INT RESEARCH, Shell Internationale Research Maatschappij BV filed Critical SHELL INT RESEARCH
Application granted granted Critical
Publication of ES2080232T3 publication Critical patent/ES2080232T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/688—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/50—Phosphorus bound to carbon only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

LOS COMPUESTOS DE RESINA EPOXIDA PARA EL ENCAPSULADO DE ELEMENTOS SEMICONDUCTORES PRESENTAN CUANDO SE SECAN A UNA ALTA TEMPERATURA DE TRANSICION A CRISTAL, UNA EXCELENTE RESISTENCIA A LA FRACTURA CUANDO SE SUELDAN Y UNA BAJA RELACION DE GENERACION DE IONES DE CLORO DESPUES DE SU SECADO. LOS COMPUESTOS COMPRENDEN A) UNA RESINA EPOXIDA B) UN AGENTE SECATIVO FENOLICO C) UNA FOSFINA TRIS(DIALCOXIFENIL) REPRESENTADA POR LA FORMULA GENERAL (I) EN DONDE R ELEVADO 1 Y R (AL CUADRADO) PUEDEN REPRESENTAR CADA UNA UN GRUPO ALQUIL C SUB 1 C SUB 4 Y D) UN EXCIPIENTE INORGANICO.
ES91200269T 1990-02-16 1991-02-08 Composiciones de resina epoxi para encapsular elementos semiconductores. Expired - Lifetime ES2080232T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2033704A JP2767310B2 (ja) 1990-02-16 1990-02-16 半導体封止用エポキシ樹脂組成物

Publications (1)

Publication Number Publication Date
ES2080232T3 true ES2080232T3 (es) 1996-02-01

Family

ID=12393809

Family Applications (1)

Application Number Title Priority Date Filing Date
ES91200269T Expired - Lifetime ES2080232T3 (es) 1990-02-16 1991-02-08 Composiciones de resina epoxi para encapsular elementos semiconductores.

Country Status (9)

Country Link
US (1) US5089543A (es)
EP (1) EP0442568B1 (es)
JP (1) JP2767310B2 (es)
KR (1) KR910015651A (es)
CA (1) CA2036414A1 (es)
DE (1) DE69115074T2 (es)
ES (1) ES2080232T3 (es)
MY (1) MY104619A (es)
TW (1) TW213936B (es)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5362775A (en) * 1991-03-27 1994-11-08 Nippondenso Co., Ltd. Epoxy resin composition and cured product thereof
JP2576726B2 (ja) * 1991-08-29 1997-01-29 信越化学工業株式会社 エポキシ樹脂組成物
JP2626377B2 (ja) * 1991-11-05 1997-07-02 信越化学工業株式会社 エポキシ樹脂組成物及び半導体装置
JPH06199990A (ja) * 1992-11-10 1994-07-19 Sumitomo Chem Co Ltd エポキシ樹脂組成物および樹脂封止型半導体装置
JP2847632B2 (ja) * 1996-02-23 1999-01-20 旭チバ株式会社 耐熱性に優れたエポキシ樹脂の硬化方法およびエポキシ樹脂硬化物
KR100359904B1 (ko) * 2000-09-04 2002-11-07 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물
US6417322B1 (en) * 2000-09-25 2002-07-09 Essilor International Compagnie General D'optique Episulfide based polymerizable composition catalyzed by an (alkoxyphenyl)phosphine, articles made therefrom and process for making same
DE10051051A1 (de) * 2000-10-14 2002-04-18 Bosch Gmbh Robert Silikonmodifizierte Einkomponentenvergußmasse
TWI314153B (en) * 2002-07-12 2009-09-01 Mitsui Chemicals Inc Process for production of oxyalkylene derivative
US8206819B2 (en) * 2010-01-27 2012-06-26 Iteq Corporation Varnish, prepreg, and substrate thereof
JP6221382B2 (ja) * 2013-06-14 2017-11-01 日立化成株式会社 エポキシ樹脂組成物及び電子部品装置
CN107001580A (zh) 2014-12-04 2017-08-01 三菱化学株式会社 四甲基联苯酚型环氧树脂、环氧树脂组合物、固化物和半导体封装材料
JP7595404B2 (ja) * 2019-03-07 2024-12-06 味の素株式会社 樹脂組成物

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4105634A (en) * 1976-08-11 1978-08-08 Celanese Corporation Production of thermosetting resinous polyepoxides
DE3163054D1 (en) * 1980-06-05 1984-05-17 Toshiba Kk Resin encapsulation type semiconductor device

Also Published As

Publication number Publication date
DE69115074T2 (de) 1996-08-29
EP0442568A2 (en) 1991-08-21
US5089543A (en) 1992-02-18
KR910015651A (ko) 1991-09-30
EP0442568A3 (en) 1992-11-25
DE69115074D1 (de) 1996-01-18
JP2767310B2 (ja) 1998-06-18
CA2036414A1 (en) 1991-08-17
JPH03239718A (ja) 1991-10-25
TW213936B (es) 1993-10-01
EP0442568B1 (en) 1995-12-06
MY104619A (en) 1994-04-30

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