ES2089701T3 - Instalacion de electrodeposicion con celdas electroliticas opuestas y alimentacion continua de superficie a tratar. - Google Patents

Instalacion de electrodeposicion con celdas electroliticas opuestas y alimentacion continua de superficie a tratar.

Info

Publication number
ES2089701T3
ES2089701T3 ES93203246T ES93203246T ES2089701T3 ES 2089701 T3 ES2089701 T3 ES 2089701T3 ES 93203246 T ES93203246 T ES 93203246T ES 93203246 T ES93203246 T ES 93203246T ES 2089701 T3 ES2089701 T3 ES 2089701T3
Authority
ES
Spain
Prior art keywords
dissolution
installation
cell
electrolytic
supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES93203246T
Other languages
English (en)
Inventor
Sergio Sala
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Application granted granted Critical
Publication of ES2089701T3 publication Critical patent/ES2089701T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0736—Methods for applying liquids, e.g. spraying
    • H05K2203/0746—Local treatment using a fluid jet, e.g. for removing or cleaning material; Providing mechanical pressure using a fluid jet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1518—Vertically held PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • H05K3/0088—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor for treatment of holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

SE DESCRIBE UNA INSTALACION ELECTROPLASTICA (1) PARA LA DEPOSICION ELECTROLITICA DE METALES SOBRE COMPONENTES PLANOS TALES COMO PLANCHAS DE CIRCUITO IMPRESO (3) Y SEMEJANTES, ORIENTADA PARALELAMENTE A LA DIRECCION DE ALIMENTACION Y A LA VIA DE SUMINISTRO CONTINUO DE UN SISTEMA (4) PARA LA TRANSMISION Y ALIMENTACION DE CORRIENTE CATODICA A DICHAS PLANCHAS. LA INSTALACION SE CARACTERIZA PORQUE TIENE AL MENOS UN PAR DE CELULAS ELECTROLITICAS (8) PROVISTAS CADA UNA DE UNA APERTURA DE ALIMENTACION (9C) Y OTRA (9A) PARA LA SALIDA DE FLUJO DE LA DISOLUCION ELECTROLITICA SUMINISTRADA CONTINUAMENTE MEDIANTE ELEMENTOS APROPIADOS (7) PARA EXTRAER EL MISMO DE UN TANQUE DE PROTECCION (6); CADA CELULA ESTA PROVISTA DE ANODOS (10) Y ELEMENTOS (12) PARA REGULAR EL FLUJO DE LA DISOLUCION; CADA CELULA DE AL MENOS UNO DE TALES PARES TIENE LA APERTURA (9A) LOCALIZADA OPUESTA A LA OTRA CELULA PARA PROPORCIONAR UN ESPACIO VACIO A TRAVES DEL CUAL SE REALIZA UNA PLANCHA DE PASO (3) QUE SE SITUA EN CONTACTO CON LADISOLUCION ELECTROLITICA. LOS COMPONENTES (11) ESTAN PROVISTOS TAMBIEN PARA INTERCEPTAR LA CAIDA DE LA DISOLUCION , CAPAZ DE HACER QUE EL FLUJO DE LA DISOLUCION PASE A TRAVES DE UNOS HUECOS (3A) DEL TABLERO (3) PARA LA METALIZACION.
ES93203246T 1992-11-23 1993-11-19 Instalacion de electrodeposicion con celdas electroliticas opuestas y alimentacion continua de superficie a tratar. Expired - Lifetime ES2089701T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ITMI922679A IT1256443B (it) 1992-11-23 1992-11-23 Impianto galvanico a celle elettrolitiche contrapposte con alimentazione in continuo delle superfici da trattare

Publications (1)

Publication Number Publication Date
ES2089701T3 true ES2089701T3 (es) 1996-10-01

Family

ID=11364336

Family Applications (1)

Application Number Title Priority Date Filing Date
ES93203246T Expired - Lifetime ES2089701T3 (es) 1992-11-23 1993-11-19 Instalacion de electrodeposicion con celdas electroliticas opuestas y alimentacion continua de superficie a tratar.

Country Status (5)

Country Link
US (1) US5417828A (es)
EP (1) EP0599416B1 (es)
DE (1) DE69302663T2 (es)
ES (1) ES2089701T3 (es)
IT (1) IT1256443B (es)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114540933A (zh) * 2022-03-03 2022-05-27 常熟市新达模塑成型有限公司 一种无测量装置可连续控制电解液深度的电解池及其调节方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995031590A1 (de) * 1994-05-11 1995-11-23 Siemens S.A. Vorrichtung zur behandlung von leiterplatten
JP3043319B2 (ja) * 1998-09-25 2000-05-22 栄電子工業株式会社 連続メッキ装置
US6153064A (en) * 1998-11-25 2000-11-28 Oliver Sales Company Apparatus for in line plating
US6676820B2 (en) * 2001-03-02 2004-01-13 Ppg Industries Ohio, Inc. Process for electrocoating metal blanks and coiled metal substrates
US7204918B2 (en) * 2003-03-10 2007-04-17 Modular Components National, Inc. High efficiency plating apparatus and method

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4401522A (en) * 1980-09-29 1983-08-30 Micro-Plate, Inc. Plating method and apparatus
US4402800A (en) * 1981-10-02 1983-09-06 Ash James J Apparatus and method of treating tabs of printed circuit boards and the like
US4587000A (en) * 1984-11-19 1986-05-06 Pellegrino Peter P Electroplating method and apparatus for electroplating high aspect ratio thru-holes
DE3528575A1 (de) * 1985-08-06 1987-02-19 Schering Ag Verfahren und einrichtung zur reinigung, aktivierung und/oder metallisierung von bohrloechern in horizontal gefuehrten leiterplatten
JPH0765209B2 (ja) * 1985-12-06 1995-07-12 ヤマハ発動機株式会社 電気めっき装置
US4761213A (en) * 1986-07-28 1988-08-02 Siemens Aktiengesellschaft Treatment facility particularly for printed circuit boards to be treated while in a horizontal plane
US4755271A (en) * 1986-07-28 1988-07-05 Siemens Aktiengesellschaft Electroplating apparatus for plate-shaped workpieces, particularly printed circuit boards
US4871435A (en) * 1988-10-14 1989-10-03 Charles Denofrio Electroplating apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114540933A (zh) * 2022-03-03 2022-05-27 常熟市新达模塑成型有限公司 一种无测量装置可连续控制电解液深度的电解池及其调节方法

Also Published As

Publication number Publication date
EP0599416A1 (en) 1994-06-01
EP0599416B1 (en) 1996-05-15
ITMI922679A0 (it) 1992-11-23
ITMI922679A1 (it) 1994-05-23
DE69302663T2 (de) 1996-12-05
US5417828A (en) 1995-05-23
IT1256443B (it) 1995-12-05
DE69302663D1 (de) 1996-06-20

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