ES2090568T3 - Composiciones reticulables termicamente. - Google Patents
Composiciones reticulables termicamente.Info
- Publication number
- ES2090568T3 ES2090568T3 ES92810237T ES92810237T ES2090568T3 ES 2090568 T3 ES2090568 T3 ES 2090568T3 ES 92810237 T ES92810237 T ES 92810237T ES 92810237 T ES92810237 T ES 92810237T ES 2090568 T3 ES2090568 T3 ES 2090568T3
- Authority
- ES
- Spain
- Prior art keywords
- anions
- compound
- binders
- initiator
- additive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000203 mixture Substances 0.000 title abstract 3
- 150000001450 anions Chemical class 0.000 abstract 4
- 239000011230 binding agent Substances 0.000 abstract 3
- 150000001875 compounds Chemical class 0.000 abstract 3
- 239000000654 additive Substances 0.000 abstract 2
- 230000000996 additive effect Effects 0.000 abstract 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract 2
- 238000010538 cationic polymerization reaction Methods 0.000 abstract 2
- 239000003999 initiator Substances 0.000 abstract 2
- 229910052760 oxygen Inorganic materials 0.000 abstract 2
- 239000001301 oxygen Substances 0.000 abstract 2
- -1 HYDROXYL GROUP Chemical group 0.000 abstract 1
- 150000001768 cations Chemical class 0.000 abstract 1
- 239000002131 composite material Substances 0.000 abstract 1
- 230000001143 conditioned effect Effects 0.000 abstract 1
- 239000003112 inhibitor Substances 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 239000011368 organic material Substances 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/38—Polymerisation using regulators, e.g. chain terminating agents, e.g. telomerisation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/687—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing sulfur
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Epoxy Resins (AREA)
- Polymerization Catalysts (AREA)
- Paints Or Removers (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polymerisation Methods In General (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Abstract
COMPOSICIONES TERMICAMENTE ENDURECIBLES. ESTE DOCUMENTO DESCRIBE LA UTILIZACION DE UN INHIBIDOR PARA LA POLIMERIZACION CATIONICA, COMO ADITIVO PARA UNA COMPOSICION TERMICAMENTE ENDURECIBLE, A BASE DE AL MENOS UN MATERIAL ORGANICO CATIONICO POLIMERIZABLE, Y DE UN INICIADOR PARA LA POLIMERIZACION CATIONICA EN FORMA DE UN COMPUESTO DE ONIO O DE UN COMPUESTO DE LA FORMULA (I) EN DONDE N ES IGUAL A 2 O 3, M EQUIVALE A UN CATION METALICO ESCOGIDO DEL GRUPO COMPUESTO POR ZN2+, MG2+, FE2+, CO2+, NI2+, CR2+, RU2+, MN2+, SN2+, VO2+, FE3+, AL3+, Y CO3+, XPF6-, ASF6-, SBF6-, BIF6-, DE LOS DERIVADOS DE ESTOS ANIONES, DONDE AL MENOS SE HA SUSTITUIDO UN ATOMO DE FLUOR POR UN GRUPO HIDROXILO, Y CF3SO3 -, O DONDE HASTA EL 50% DE LOS ANIONES X-, REFERIDOS AL CONJUNTO DE LOS ANIONES, TAMBIEN PUEDE SER CUALQUIER ANION, L ES AGUA O UN LIGANTE ORGANICO DONOR O, QUE PRESENTA COMO LUGARES DE LIGANTES A UNO O MAS RESTOS FUNCIONALES ELEGIDOS DEL GRUPO COMPUESTO POR CO -, O - O -, Y QUE FORMA MEDIANTE EL ATOMO DE OXIGENO O MEDIANTE LOS ATOMOS DE OXIGENO CON EL ATOMO CENTRAL ENLACES O, Y X SIGNIFICA UN NUMERO ENTERO ENTRE 0 Y 6, Y DONDE LOS LIGANTES L, EN EL MARCO DE LA DEFINICION DADA, PUEDEN SER DIFERENTES, O COMO ADITIVO A LOS COMPONENTES PARA LA OBTENCION DE UN COMPUESTO SIMILAR, PARA EVITAR LOS PRODUCTOS DE DISGREGACION DEL INICIADOR CONDICIONADOS POR LA HUMEDAD QUE REDUCEN LA ESTABILIDAD TERMICA DEL COMPUESTO Y/O PARA UNA ELEVACION DE LA ESTABILIDAD TERMICA DEL COMPUESTO, QUE ESTA LIMITADA A UN MARGEN DE TIEMPO ANTES DEL ENDURECIMIENTO
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH102991 | 1991-04-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES2090568T3 true ES2090568T3 (es) | 1996-10-16 |
Family
ID=4200791
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES92810237T Expired - Lifetime ES2090568T3 (es) | 1991-04-08 | 1992-03-31 | Composiciones reticulables termicamente. |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US5296567A (es) |
| EP (1) | EP0508951B1 (es) |
| JP (1) | JP2704690B2 (es) |
| KR (1) | KR100216155B1 (es) |
| DE (1) | DE59206930D1 (es) |
| DK (1) | DK0508951T3 (es) |
| ES (1) | ES2090568T3 (es) |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH055006A (ja) * | 1990-11-16 | 1993-01-14 | Nippon Kayaku Co Ltd | カチオン重合性有機材料組成物および当該組成物の安定化法 |
| TW237466B (es) * | 1992-07-21 | 1995-01-01 | Giba Gerigy Ag | |
| US5494943A (en) * | 1993-06-16 | 1996-02-27 | Minnesota Mining And Manufacturing Company | Stabilized cationically-curable compositions |
| US5362421A (en) * | 1993-06-16 | 1994-11-08 | Minnesota Mining And Manufacturing Company | Electrically conductive adhesive compositions |
| JP3907217B2 (ja) * | 1993-07-29 | 2007-04-18 | 日立化成工業株式会社 | 回路接続材料とその接続材料を用いた回路の接続方法 |
| JP4539644B2 (ja) * | 1993-07-29 | 2010-09-08 | 日立化成工業株式会社 | 回路接続材料とその接続材料を用いた回路の接続方法 |
| DE4340949A1 (de) * | 1993-12-01 | 1995-06-08 | Thera Ges Fuer Patente | Lichtinitiiert kationisch härtende Epoxidmasse und ihre Verwendung |
| KR100399332B1 (ko) | 1994-12-26 | 2003-09-26 | 히다치 가세고교 가부시끼가이샤 | 필름 형상의 유기 다이본딩재의 라미네이트 방법,다이본딩 방법, 라미네이트 장치, 다이본딩 장치, 반도체장치 및 반도체장치의 제조방법 |
| TW310481B (es) * | 1995-07-06 | 1997-07-11 | Hitachi Chemical Co Ltd | |
| US6717242B2 (en) * | 1995-07-06 | 2004-04-06 | Hitachi Chemical Company, Ltd. | Semiconductor device and process for fabrication thereof |
| EP0799682A3 (de) * | 1996-04-04 | 1998-01-21 | Ciba SC Holding AG | Herstellung von Formkörpern aus Epoxidharzen mit Hilfe der automatischen Druckgeliertechnik |
| TW460509B (en) * | 1996-07-12 | 2001-10-21 | Ciba Sc Holding Ag | Curing process for cationically photocurable formulations |
| JP3626302B2 (ja) * | 1996-12-10 | 2005-03-09 | Jsr株式会社 | 光硬化性樹脂組成物 |
| AU5623798A (en) * | 1997-01-06 | 1998-08-03 | Quantum Materials, Inc. | Reducing void formation in curable adhesive formulations |
| WO1999020702A1 (en) * | 1997-10-20 | 1999-04-29 | Kansai Paint Co., Ltd. | Coating composition and method for coating therewith |
| DE19810549A1 (de) * | 1998-03-11 | 1999-09-16 | Delo Industrieklebstoffe Gmbh | Polymerisierbare fluorhaltige Zubereitung, ihre Verwendung und Verfahren zur Herstellung ausgehärteter Polymermassen aus dieser Zubereitung |
| US6187965B1 (en) | 1998-11-06 | 2001-02-13 | International Business Machines Corporation | Process for recovering high boiling solvents from a photolithographic waste stream comprising at least 10 percent by weight of monomeric units |
| US5994597A (en) * | 1998-11-06 | 1999-11-30 | International Business Machines Corporation | Process for recovering high boiling solvents from a photolithographic waste stream comprising less than 10 percent by weight monomeric units |
| JP2004323642A (ja) * | 2003-04-23 | 2004-11-18 | Riso Kagaku Corp | カチオン重合性組成物及びインク |
| JP4569095B2 (ja) * | 2003-11-11 | 2010-10-27 | コニカミノルタエムジー株式会社 | カチオン重合性組成物、活性エネルギー線硬化型インクジェットインク、カチオン重合性組成物の製造方法及び活性エネルギー線硬化型インクジェットインクの製造方法 |
| JP2005325312A (ja) * | 2004-05-17 | 2005-11-24 | Hitachi Chem Co Ltd | 接着剤組成物、それを用いたフィルム状接着剤及び回路接続材料、並びに回路部材の接続構造及びその製造方法 |
| JP2006089722A (ja) * | 2004-08-26 | 2006-04-06 | Konica Minolta Medical & Graphic Inc | カチオン重合性組成物、活性エネルギー線硬化型インクジェットインク及びカチオン重合性組成物の製造方法 |
| DE102005040126A1 (de) * | 2005-08-25 | 2007-03-01 | Altana Electrical Insulation Gmbh | Überzugsmasse |
| JP5685189B2 (ja) * | 2008-08-12 | 2015-03-18 | ハンツマン・アドヴァンスト・マテリアルズ・(スイッツランド)・ゲーエムベーハー | 熱硬化性組成物 |
| JP2011080017A (ja) * | 2009-10-09 | 2011-04-21 | Denso Corp | カチオン重合性組成物 |
| JP2015209492A (ja) * | 2014-04-25 | 2015-11-24 | 旭化成イーマテリアルズ株式会社 | 液状硬化剤、硬化性樹脂組成物、ファイン化学品及び組成物 |
| BR112021019660A2 (pt) | 2019-04-02 | 2021-12-07 | Ecolab Usa Inc | Métodos para produzir dióxido de cloro e para tratar água de processo |
| DE102022102650A1 (de) | 2022-02-04 | 2023-08-10 | Delo Industrie Klebstoffe Gmbh & Co. Kgaa | Kationisch polymerisierbare flammgeschützte Massen |
| DE102022106647A1 (de) | 2022-03-22 | 2023-09-28 | Delo Industrie Klebstoffe Gmbh & Co. Kgaa | Niedertemperaturhärtende Massen auf Basis von Glycidylethern |
| TW202348787A (zh) | 2022-04-01 | 2023-12-16 | 美商藝康美國公司 | 用於乙烯系單體流之高苛刻度加工的防汙劑組成物 |
| TW202404930A (zh) | 2022-04-01 | 2024-02-01 | 美商藝康美國公司 | 在共軛二烯單體之萃取蒸餾期間減少非所要之乳化聚合 |
| TW202348786A (zh) | 2022-04-01 | 2023-12-16 | 美商藝康美國公司 | 用於蒸氣空間應用之防汙劑組成物 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3677978A (en) * | 1971-08-23 | 1972-07-18 | Ppg Industries Inc | Metal salt complexes of imidazoles as curing agents for one-part epoxy resins |
| US4058401A (en) * | 1974-05-02 | 1977-11-15 | General Electric Company | Photocurable compositions containing group via aromatic onium salts |
| GB1512981A (en) * | 1974-05-02 | 1978-06-01 | Gen Electric | Curable epoxide compositions |
| US4058400A (en) * | 1974-05-02 | 1977-11-15 | General Electric Company | Cationically polymerizable compositions containing group VIa onium salts |
| US4473674A (en) * | 1983-11-03 | 1984-09-25 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Process for improving mechanical properties of epoxy resins by addition of cobalt ions |
| US4554342A (en) * | 1984-07-30 | 1985-11-19 | Shell Oil Company | Heat-curable compositions comprising an epoxy resin, an amine and a sulfonium salt |
| DE59000858D1 (de) * | 1989-01-16 | 1993-03-25 | Ciba Geigy Ag | Araliphatische sulfoniumsalze und deren verwendung. |
| ES2085294T3 (es) * | 1989-03-21 | 1996-06-01 | Ciba Geigy Ag | Iniciadores para materiales de polimerizacion cationica. |
| SE8901048D0 (sv) * | 1989-03-23 | 1989-03-23 | Becker Wilhelm Ab | Polymerisationsinitiator |
-
1992
- 1992-03-31 ES ES92810237T patent/ES2090568T3/es not_active Expired - Lifetime
- 1992-03-31 DK DK92810237.5T patent/DK0508951T3/da not_active Application Discontinuation
- 1992-03-31 DE DE59206930T patent/DE59206930D1/de not_active Expired - Lifetime
- 1992-03-31 EP EP92810237A patent/EP0508951B1/de not_active Expired - Lifetime
- 1992-04-06 US US07/863,638 patent/US5296567A/en not_active Expired - Fee Related
- 1992-04-08 JP JP4115435A patent/JP2704690B2/ja not_active Expired - Lifetime
- 1992-04-08 KR KR1019920005945A patent/KR100216155B1/ko not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP0508951B1 (de) | 1996-08-21 |
| EP0508951A2 (de) | 1992-10-14 |
| DE59206930D1 (de) | 1996-09-26 |
| JPH05132505A (ja) | 1993-05-28 |
| DK0508951T3 (da) | 1996-09-09 |
| JP2704690B2 (ja) | 1998-01-26 |
| US5296567A (en) | 1994-03-22 |
| KR920019823A (ko) | 1992-11-20 |
| KR100216155B1 (ko) | 1999-08-16 |
| EP0508951A3 (en) | 1993-10-06 |
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Legal Events
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|---|---|---|---|
| FG2A | Definitive protection |
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