ES2097251T3 - Material substrato para circuito de microcintas y procedimiento para la obtencion de substratos. - Google Patents

Material substrato para circuito de microcintas y procedimiento para la obtencion de substratos.

Info

Publication number
ES2097251T3
ES2097251T3 ES92116873T ES92116873T ES2097251T3 ES 2097251 T3 ES2097251 T3 ES 2097251T3 ES 92116873 T ES92116873 T ES 92116873T ES 92116873 T ES92116873 T ES 92116873T ES 2097251 T3 ES2097251 T3 ES 2097251T3
Authority
ES
Spain
Prior art keywords
substrate material
micro
procedure
tape circuit
well
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES92116873T
Other languages
English (en)
Inventor
Guenther Dr Phys-Chem Krueger
Heinz Dipl-Ing Pfizenmaier
Detlef Stolten
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Application granted granted Critical
Publication of ES2097251T3 publication Critical patent/ES2097251T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/48—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zirconium or hafnium oxides, zirconates, zircon or hafnates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Composite Materials (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

SE PROPONE UNA CERAMICA DE CIRCONATO CALCICO COMO MATERIAL DE SUBSTRATO PARA LA CONEXION DE CONDUCTORES DE MICROBANDAS ASI COMO UN PROCESO PARA LA FABRICACION DE UN SUBSTRATO DE ESTE TIPO. A TRAVES DE LA UTILIZACION DE ACUERDO CON LA INVENCION DE CIRCONATO CALCICO ASI COMO A TRAVES DE LA CUMPLIMENTACION DE LOS PARAMETROS DEL PROCESO PROPUESTOS SEGUN LA INVENCION, SE CONSIGUE UN MATERIAL DE SUBSTRATO CON PROPIEDADES CARACTERISTICAS, EN PARTICULAR BUENA RESISTENCIA MECANICA Y VALOR DIELECTRICO MAS ALTO, ASI COMO PEQUEÑA POROSIDAD.
ES92116873T 1991-10-18 1992-10-02 Material substrato para circuito de microcintas y procedimiento para la obtencion de substratos. Expired - Lifetime ES2097251T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4134462A DE4134462A1 (de) 1991-10-18 1991-10-18 Substratmaterial fuer mikrostreifenleiterschaltungen und verfahren zur herstellung von substraten

Publications (1)

Publication Number Publication Date
ES2097251T3 true ES2097251T3 (es) 1997-04-01

Family

ID=6442938

Family Applications (1)

Application Number Title Priority Date Filing Date
ES92116873T Expired - Lifetime ES2097251T3 (es) 1991-10-18 1992-10-02 Material substrato para circuito de microcintas y procedimiento para la obtencion de substratos.

Country Status (4)

Country Link
EP (1) EP0539756B1 (es)
DE (2) DE4134462A1 (es)
ES (1) ES2097251T3 (es)
FI (1) FI924694A7 (es)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1268811A (en) * 1969-04-22 1972-03-29 Gen Electric Co Ltd Improvements in or relating to microwave devices
JPH064502B2 (ja) * 1988-12-23 1994-01-19 日本碍子株式会社 セラミックスの製造方法

Also Published As

Publication number Publication date
DE4134462A1 (de) 1993-04-22
FI924694L (fi) 1993-04-19
FI924694A7 (fi) 1993-04-19
EP0539756A1 (de) 1993-05-05
DE59207889D1 (de) 1997-02-27
FI924694A0 (fi) 1992-10-16
EP0539756B1 (de) 1997-01-15

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