ES2099155T3 - Poli(arileno-eteres) fluorados. - Google Patents

Poli(arileno-eteres) fluorados.

Info

Publication number
ES2099155T3
ES2099155T3 ES91902053T ES91902053T ES2099155T3 ES 2099155 T3 ES2099155 T3 ES 2099155T3 ES 91902053 T ES91902053 T ES 91902053T ES 91902053 T ES91902053 T ES 91902053T ES 2099155 T3 ES2099155 T3 ES 2099155T3
Authority
ES
Spain
Prior art keywords
fluorated
poly
arylene
ethers
multichips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES91902053T
Other languages
English (en)
Inventor
Frank W Mercer
Richard C Sovish
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell International Inc
Original Assignee
AlliedSignal Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US07/583,899 external-priority patent/US5115082A/en
Application filed by AlliedSignal Inc filed Critical AlliedSignal Inc
Application granted granted Critical
Publication of ES2099155T3 publication Critical patent/ES2099155T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
    • C08G65/38—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols
    • C08G65/40—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols from phenols (I) and other compounds (II), e.g. OH-Ar-OH + X-Ar-X, where X is halogen atom, i.e. leaving group
    • C08G65/4006—(I) or (II) containing elements other than carbon, oxygen, hydrogen or halogen as leaving group (X)
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
    • C08G75/20—Polysulfones
    • C08G75/23—Polyethersulfones
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
    • C08L81/06—Polysulfones; Polyethersulfones
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/45—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their insulating parts
    • H10W20/48—Insulating materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G2650/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterized by the type of post-polymerisation functionalisation
    • C08G2650/20—Cross-linking
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G2650/28—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type
    • C08G2650/46—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type containing halogen
    • C08G2650/48—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type containing halogen containing fluorine, e.g. perfluropolyethers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2312/00—Crosslinking
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/034—Organic insulating material consisting of one material containing halogen
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Polyethers (AREA)
  • Formation Of Insulating Films (AREA)
  • Paints Or Removers (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

SE PRESENTAN POLI(ETERES DE ARILENO)FLUORADOS QUE TIENEN UNA UNIDAD DE REPETICION TAL COMO (A) Y QUE SON UTILES COMO MATERIALES DIELECTRICOS EN INTERCONEXIONES MULTICAPA PARA CIRCUITOS INTEGRADOS Y MODULOS MULTICHIPS Y COMO MATERIALES DE PROTECCION PARA CIRCUITOS INTEGRADOS.
ES91902053T 1990-04-17 1990-12-07 Poli(arileno-eteres) fluorados. Expired - Lifetime ES2099155T3 (es)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US51035390A 1990-04-17 1990-04-17
US51038690A 1990-04-17 1990-04-17
US07/583,899 US5115082A (en) 1990-04-17 1990-09-17 Fluorinated poly(arylene ether)

Publications (1)

Publication Number Publication Date
ES2099155T3 true ES2099155T3 (es) 1997-05-16

Family

ID=27414455

Family Applications (1)

Application Number Title Priority Date Filing Date
ES91902053T Expired - Lifetime ES2099155T3 (es) 1990-04-17 1990-12-07 Poli(arileno-eteres) fluorados.

Country Status (7)

Country Link
EP (1) EP0524930B1 (es)
JP (1) JP3089032B2 (es)
AT (1) ATE150043T1 (es)
CA (1) CA2080832C (es)
DE (1) DE69030197T2 (es)
ES (1) ES2099155T3 (es)
WO (1) WO1991016369A1 (es)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5235044A (en) * 1992-09-09 1993-08-10 Raychem Corporation Compounds having oxadiazole and triazene moieties, crosslinkable polymers therefrom, and methods therefor
US5250667A (en) * 1992-09-09 1993-10-05 Raychem Corporation 1-[(hydroxyphenoxy)phenylene]triazenes, polymers crosslinked therewith, and methods therefor
KR19990024596A (ko) * 1997-09-04 1999-04-06 윤종용 광통신용 폴리아릴렌에테르
US6143643A (en) * 1998-07-08 2000-11-07 International Business Machines Corporation Process for manufacture of integrated circuit device using organosilicate insulative matrices
US6093636A (en) * 1998-07-08 2000-07-25 International Business Machines Corporation Process for manufacture of integrated circuit device using a matrix comprising porous high temperature thermosets
US6333141B1 (en) 1998-07-08 2001-12-25 International Business Machines Corporation Process for manufacture of integrated circuit device using inorganic/organic matrix comprising polymers of three dimensional architecture
US6399666B1 (en) 1999-01-27 2002-06-04 International Business Machines Corporation Insulative matrix material
JP2001181577A (ja) 1999-12-27 2001-07-03 Sumitomo Chem Co Ltd 多孔質有機膜形成用塗布液および多孔質有機膜の形成方法
CA2487649C (en) * 2002-05-28 2009-09-01 National Research Council Of Canada Techniques for the preparation of highly fluorinated polyethers
JP4501391B2 (ja) * 2003-09-30 2010-07-14 旭硝子株式会社 架橋性含フッ素芳香族プレポリマー及びその用途
WO2005033209A1 (ja) * 2003-09-30 2005-04-14 Nippon Shokubai Co., Ltd. 複合誘電体用樹脂組成物および複合誘電体、該誘電体を使用した電気回路基板
CN103221483B (zh) * 2010-11-24 2015-07-01 Jsr株式会社 树脂组合物、绝缘膜、膜形成方法及电子部件
CN111201265A (zh) * 2017-09-04 2020-05-26 索尔维特殊聚合物意大利有限公司 可交联的氟化聚(亚芳基醚)
CN111471144B (zh) * 2020-03-27 2022-05-31 顺德职业技术学院 丙烯酸改性低介电含氟聚苯醚混合胶及其制备的5g覆铜板
CN111363308B (zh) * 2020-03-27 2022-12-23 顺德职业技术学院 环氧改性低介电含氟聚苯醚涂层及其制备的高频高速覆铜板
TWI740485B (zh) * 2020-05-04 2021-09-21 台灣中油股份有限公司 寡聚（2,6-二甲基苯醚）、其製備方法與固化物

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1795120C3 (de) * 1968-08-14 1978-07-13 Bayer Ag, 5090 Leverkusen Thermoplastische Polyaryläthersulfone und Verfahren zu ihrer Herstellung
US4272429A (en) * 1979-05-01 1981-06-09 E. I. Du Pont De Nemours And Company Thermally stable, flame-retardant polymers and selected oligomers useful therein
US4827054A (en) * 1987-07-31 1989-05-02 Hughes Aircraft Company Method for synthesizing 2,2-bis(4-fluorophenyl)-hexafluoropropane and method for using same to synthesize poly(arylethers) and poly (arylthioethers)

Also Published As

Publication number Publication date
JP3089032B2 (ja) 2000-09-18
EP0524930B1 (en) 1997-03-12
WO1991016369A1 (en) 1991-10-31
CA2080832C (en) 2002-04-02
DE69030197D1 (de) 1997-04-17
EP0524930A1 (en) 1993-02-03
DE69030197T2 (de) 1997-06-19
JPH05506042A (ja) 1993-09-02
ATE150043T1 (de) 1997-03-15
CA2080832A1 (en) 1991-10-18

Similar Documents

Publication Publication Date Title
ES2099155T3 (es) Poli(arileno-eteres) fluorados.
DK0471167T3 (da) Beskyttelseskredsløb og beskyttelsesstik i telekommunikationsanlæg
DK0456624T3 (da) Overspændings- og overstrømsbeskyttelseskredsløb
EP0489570A3 (en) Antifuse programming in an integrated circuit structure
IT8548106A0 (it) Perfezionamento nei moduli di circuiti integrati ad alta densita' eprocedimento di fabbricazione
GB2284114B (en) Multiplexer structures for use in making controllable interconnections in integrated circuits
DK0719548T3 (da) Geleringsmiddel for polyethylenglycol
DE69203048D1 (de) Verbesserungen bei elektrischen Einrichtungen bei Leistungswerkzeugen und Schaltern.
IT1305347B1 (it) Dispositivo di abbrancamento di circuiti integrati modulari permanipolatori di circuiti integrati modulari
IT9004836V0 (it) Portafusibili perfezionato, in particolare per circuiti stampati
ITTO920214A0 (it) Connettore di bloccaggio per circuiti integrati
DE69527453D1 (de) Schutzeinrichtung gegen Überspannungen in integrierten Schaltungen
EP0448119A3 (en) Input protection resistor used in input protection circuit
ITTO910929A0 (it) Procedimento per la fabbricazione di circuiti integrati in tecnologia mos
IT1243186B (it) Procedimento per selezionare materiale plastico eterogeneo proveniente da recupero in frazioni omogenee ed apparecchiatura adatta allo scopo
IT8520951A0 (it) Dispositivo di protezione da scariche elettrostatiche, in particolare per circuiti integrati bipolari.
IT1230289B (it) Dispositivo di protezione contro le sovratensioni per circuiti elettronici integrati, particolarmente per applicazioni in campo automobilistico.
ITMI941088A0 (it) Nuovo poli (pentaeritril difosfonato) e suo utilizzo in composizioni polimeriche termoplastiche autoestinguenti
ITMI911727A1 (it) Procedimento per la realizzazione di strutture di calibrazione particolarmente per la taratura di macchine di misura del disallineamento in circuiti integrati in genere.
AR240342A1 (es) Composicion convertible en un componente conductor reforzado y articulos que los contienen.
IT1243676B (it) Stadio d'ingresso pluricompatibile particolarmente per porte logiche in circuiti integrati
DE69118219D1 (de) ECL-Schaltung in einem integrierten Halbleiterschaltkreis
DE69812755D1 (de) Schutzschaltung gegen Kurzschlüsse
IT1244074B (it) Dispositivo di protezione di circuiti elettrici e/o elettronici di telefoni atto a limitare la potenza dissipata in essi.
ITMI920338A1 (it) Dispositivo di isolamento del substrato, particolarmente per circuiti integrati

Legal Events

Date Code Title Description
FG2A Definitive protection

Ref document number: 524930

Country of ref document: ES