ES2106851T3 - Nuevo sistema de resinas con baja temperatura de moldeo. - Google Patents

Nuevo sistema de resinas con baja temperatura de moldeo.

Info

Publication number
ES2106851T3
ES2106851T3 ES92810447T ES92810447T ES2106851T3 ES 2106851 T3 ES2106851 T3 ES 2106851T3 ES 92810447 T ES92810447 T ES 92810447T ES 92810447 T ES92810447 T ES 92810447T ES 2106851 T3 ES2106851 T3 ES 2106851T3
Authority
ES
Spain
Prior art keywords
substituted
resin system
molding temperature
new resin
low molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES92810447T
Other languages
English (en)
Inventor
Kurt Dr Munk
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Novartis AG
BASF Schweiz AG
Original Assignee
Ciba Geigy AG
Ciba Spezialitaetenchemie Holding AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ciba Geigy AG, Ciba Spezialitaetenchemie Holding AG filed Critical Ciba Geigy AG
Application granted granted Critical
Publication of ES2106851T3 publication Critical patent/ES2106851T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/66—Mercaptans
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/687—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
    • C08G65/08—Saturated oxiranes
    • C08G65/10—Saturated oxiranes characterised by the catalysts used
    • C08G65/105—Onium compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)

Abstract

LA INVENCION SE REFIERE A COMPOSICIONES ENDURECIBLES CONTENIENDO, A) UN MATERIAL ORGANICO CATIONICO POLIMERIZABLE, B) AL MENOS UN COMPUESTO ORGANICO, EL CUAL CONTIENE AL MENOS UN GRUPO HIDROXILO O UN GRUPO TIOL, Y C) COMO CATALIZADOR DE ENDURECIMIENTO AL MENOS UNA SAL DE SULFONIO, DE LAS FORMULAS (I),(II),(III) O (IV): DONDE EN LAS FORMULAS DE (I) A (IV), A EQUIVALE A UN C1 LOALQUILALQUILO, FENILO NO SUSTITUIDO O SUSTITUIDO, AR, AR1 Y AR2 EQUIVALEN INDEPENDIENTEMENTE UNO DE OTRO A UN FENILO O NAFTILO NO SUSTITUIDO O SUSTITUIDO, ARILENO EQUIVALE A UN FENILENO O NAFTILENO NO SUSTITUIDO O SUSTITUIDO RESPECTIVAMENTE, Y QEQUIVALE A SBF6 -, ASF6 LAS COMPOSICIONES COMO RESINAS DE IMPREGNACION Y FUNDIBLES.
ES92810447T 1991-06-19 1992-06-10 Nuevo sistema de resinas con baja temperatura de moldeo. Expired - Lifetime ES2106851T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH181191 1991-06-19

Publications (1)

Publication Number Publication Date
ES2106851T3 true ES2106851T3 (es) 1997-11-16

Family

ID=4219159

Family Applications (1)

Application Number Title Priority Date Filing Date
ES92810447T Expired - Lifetime ES2106851T3 (es) 1991-06-19 1992-06-10 Nuevo sistema de resinas con baja temperatura de moldeo.

Country Status (4)

Country Link
EP (1) EP0527107B1 (es)
JP (1) JP3203438B2 (es)
DE (1) DE59208790D1 (es)
ES (1) ES2106851T3 (es)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19629082A1 (de) * 1996-07-18 1998-01-22 Siemens Ag Thermisch härtbares einkomponentiges Low viskosity Adhesive-Klebstoffsystem für Verklebungen im Mikrobereich
DE19629750A1 (de) * 1996-07-23 1998-01-29 Siemens Ag Thermisch härtbares einkomponentiges Low Viskosity Adhesive-Klebstoffsystem mit verbesserten Lagerungseigenschaften
DE19804595A1 (de) * 1998-02-05 1999-08-12 Siemens Ag Thermisch härtbare Ein-Komponenten-Underfill-Masse
US7255926B2 (en) 2002-02-01 2007-08-14 Shell Oil Company Barrier layer made of a curable resin containing polymeric polyol
DE102005040126A1 (de) * 2005-08-25 2007-03-01 Altana Electrical Insulation Gmbh Überzugsmasse
JPWO2011040531A1 (ja) 2009-10-01 2013-02-28 日立化成株式会社 有機エレクトロニクス用材料、有機エレクトロニクス素子、有機エレクトロルミネセンス素子、及びそれを用いた表示素子、照明装置、表示装置
KR101537654B1 (ko) 2010-04-22 2015-07-17 히타치가세이가부시끼가이샤 유기 일렉트로닉스 재료, 중합 개시제 및 열중합 개시제, 잉크 조성물, 유기 박막 및 그 제조 방법, 유기 일렉트로닉스 소자, 유기 일렉트로 루미네센스 소자, 조명 장치, 표시 소자, 및 표시 장치
US10665786B2 (en) 2013-03-08 2020-05-26 Hitachi Chemical Company, Ltd. Treatment liquid containing ionic compound, organic electronic element, and method for producing organic electronic element

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4318766A (en) * 1975-09-02 1982-03-09 Minnesota Mining And Manufacturing Company Process of using photocopolymerizable compositions based on epoxy and hydroxyl-containing organic materials
EP0379464B1 (de) * 1989-01-16 1993-02-10 Ciba-Geigy Ag Araliphatische Sulfoniumsalze und deren Verwendung

Also Published As

Publication number Publication date
EP0527107A1 (de) 1993-02-10
EP0527107B1 (de) 1997-08-13
DE59208790D1 (de) 1997-09-18
JPH05222167A (ja) 1993-08-31
JP3203438B2 (ja) 2001-08-27

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