ES2108779T3 - Paso de vidrio comprimido. - Google Patents

Paso de vidrio comprimido.

Info

Publication number
ES2108779T3
ES2108779T3 ES93109163T ES93109163T ES2108779T3 ES 2108779 T3 ES2108779 T3 ES 2108779T3 ES 93109163 T ES93109163 T ES 93109163T ES 93109163 T ES93109163 T ES 93109163T ES 2108779 T3 ES2108779 T3 ES 2108779T3
Authority
ES
Spain
Prior art keywords
glass
holes
alloys
integrated connection
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES93109163T
Other languages
English (en)
Spanish (es)
Inventor
Wolfgang Dr Hornig
Walter Dipl-Ing Findl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Electrovac AG
Diehl Verwaltungs Stiftung
Original Assignee
Electrovac AG
Diehl GmbH and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electrovac AG, Diehl GmbH and Co filed Critical Electrovac AG
Application granted granted Critical
Publication of ES2108779T3 publication Critical patent/ES2108779T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B5/00—Melting in furnaces; Furnaces so far as specially adapted for glass manufacture
    • C03B5/16—Special features of the melting process; Auxiliary means specially adapted for glass-melting furnaces
    • C03B5/23—Cooling the molten glass
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C29/00—Joining metals with the aid of glass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Glass Compositions (AREA)
  • Continuous Casting (AREA)
  • Connections Arranged To Contact A Plurality Of Conductors (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Insulators (AREA)
  • Insulating Bodies (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Gas-Filled Discharge Tubes (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
ES93109163T 1992-06-18 1993-06-08 Paso de vidrio comprimido. Expired - Lifetime ES2108779T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4219953A DE4219953C2 (de) 1992-06-18 1992-06-18 Herstellung von Druckglasdurchführungen mit Fassungen aus ausscheidungshärtbaren Legierungen

Publications (1)

Publication Number Publication Date
ES2108779T3 true ES2108779T3 (es) 1998-01-01

Family

ID=6461286

Family Applications (1)

Application Number Title Priority Date Filing Date
ES93109163T Expired - Lifetime ES2108779T3 (es) 1992-06-18 1993-06-08 Paso de vidrio comprimido.

Country Status (11)

Country Link
US (1) US5633531A (de)
EP (1) EP0574797B1 (de)
JP (1) JPH06234550A (de)
KR (1) KR940005503A (de)
AT (1) ATE157815T1 (de)
AU (1) AU659017B2 (de)
CA (1) CA2098699A1 (de)
DE (2) DE4219953C2 (de)
ES (1) ES2108779T3 (de)
MY (1) MY109226A (de)
TW (1) TW235955B (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6084296A (en) * 1998-07-09 2000-07-04 Satcon Technology Corporation Low cost high power hermetic package with electrical feed-through bushings
DE19842943C2 (de) 1998-09-18 2001-09-20 Schott Glas Biokompatible Glas-Metall-Durchführungen und ihre Verwendung
DE10128301A1 (de) * 2001-06-12 2003-01-16 Siemens Ag Verfahren zur Herstellung einer gasdichten Durchführung eines Kontaktes durch eine Wandung und Einrichtuung zur Durchführung eines elektrischen Kontaktes duch eine Wandung
DE102005013661B4 (de) * 2005-03-24 2007-06-28 Eichenauer Heizelemente Gmbh & Co. Kg Heizeinsatz
DE102008042716A1 (de) 2008-10-09 2010-04-15 Cube Optics Ag Kompakter Multiplexer/Demultiplexer
DE102008042719A1 (de) 2008-10-09 2010-04-15 Cube Optics Ag Kompakter Multiplexer/Demultiplexer
DE102021122596A1 (de) * 2021-09-01 2023-03-02 Schott Ag Durchführung

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3685005A (en) * 1969-07-22 1972-08-15 Bunker Ramo Hermetically sealed connector
FR2119863B1 (de) * 1970-12-30 1974-07-05 Radiotechnique Compelec
US4128697A (en) * 1977-04-22 1978-12-05 Corning Glass Works Hermetic glass-metal compression seal
US4142918A (en) * 1978-01-23 1979-03-06 Bell Telephone Laboratories, Incorporated Method for making fine-grained Cu-Ni-Sn alloys
US4309507A (en) * 1981-02-23 1982-01-05 Motorola, Inc. Glass and hermetic seal
US4349635A (en) * 1981-10-26 1982-09-14 Motorola, Inc. Lower temperature glass and hermetic seal means and method
JPS59117144A (ja) * 1982-12-23 1984-07-06 Toshiba Corp リ−ドフレ−ムおよびその製造方法
US4524238A (en) * 1982-12-29 1985-06-18 Olin Corporation Semiconductor packages
EP0163510B1 (de) * 1984-05-28 1989-03-29 Koto Electric Co. Ltd. Packung mit hermetischer Abdichtungsmöglichkeit für elektronisches Bauelement
DE3587085T2 (de) * 1984-09-19 1993-09-16 Olin Corp Hermetisch verschlossenes halbleitergehaeuse.
US4805009A (en) * 1985-03-11 1989-02-14 Olin Corporation Hermetically sealed semiconductor package
US4678358A (en) * 1985-07-15 1987-07-07 National Semiconductor Corporation Glass compression seals using low temperature glass
WO1988005254A1 (en) * 1987-01-12 1988-07-14 Olin Corporation Process for producing formable and high strength leadframes in semiconductor packages
US5047371A (en) * 1988-09-02 1991-09-10 Olin Corporation Glass/ceramic sealing system

Also Published As

Publication number Publication date
DE4219953C2 (de) 1996-05-30
US5633531A (en) 1997-05-27
AU659017B2 (en) 1995-05-04
AU4120393A (en) 1993-12-23
DE59307237D1 (de) 1997-10-09
TW235955B (de) 1994-12-11
EP0574797B1 (de) 1997-09-03
ATE157815T1 (de) 1997-09-15
EP0574797A2 (de) 1993-12-22
CA2098699A1 (en) 1993-12-19
KR940005503A (ko) 1994-03-21
JPH06234550A (ja) 1994-08-23
EP0574797A3 (de) 1994-01-05
DE4219953A1 (de) 1994-01-05
MY109226A (en) 1996-12-31

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