ES2109045T3 - Metodo y aparato para determinar parametros absolutos de un plasma. - Google Patents
Metodo y aparato para determinar parametros absolutos de un plasma.Info
- Publication number
- ES2109045T3 ES2109045T3 ES95119294T ES95119294T ES2109045T3 ES 2109045 T3 ES2109045 T3 ES 2109045T3 ES 95119294 T ES95119294 T ES 95119294T ES 95119294 T ES95119294 T ES 95119294T ES 2109045 T3 ES2109045 T3 ES 2109045T3
- Authority
- ES
- Spain
- Prior art keywords
- plasma
- reactor
- radio frequency
- digital signals
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title abstract 3
- 210000002381 plasma Anatomy 0.000 abstract 4
- 238000001020 plasma etching Methods 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32917—Plasma diagnostics
- H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/0006—Investigating plasma, e.g. measuring the degree of ionisation or the electron temperature
- H05H1/0012—Investigating plasma, e.g. measuring the degree of ionisation or the electron temperature using electromagnetic or particle radiation, e.g. interferometry
- H05H1/0062—Investigating plasma, e.g. measuring the degree of ionisation or the electron temperature using electromagnetic or particle radiation, e.g. interferometry by using microwaves
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/0006—Investigating plasma, e.g. measuring the degree of ionisation or the electron temperature
- H05H1/0081—Investigating plasma, e.g. measuring the degree of ionisation or the electron temperature by electric means
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Health & Medical Sciences (AREA)
- Analytical Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Electromagnetism (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Plasma Technology (AREA)
- Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
- Discharge Heating (AREA)
- Drying Of Semiconductors (AREA)
Abstract
LA INVENCION SE REFIERE A UN METODO Y APARATO PARA DETERMINAR PARAMETROS ABSOLUTOS DE PLASMA EN PLASMAS DE BAJA PRESION DE RADIOFRECUENCIA (RF) NO SIMETRICA. DE ACUERDO CON EL METODO DE LA PRESENTE INVENCION, LA CORRIENTE DE DESCARGA DE RADIOFRECUENCIA GENERADA EN UN REACTOR DE PLASMA SE MIDE EN FORMA DE SEÑALES ANALOGICAS EN UNA PORCION DEL REACTOR QUE ACTUA COMO ELECTRODO DE TIERRA, LAS SEÑALES ANALOGICAS SE CONVIERTEN EN SEÑALES DIGITALES Y LOS PARAMETROS DE PLASMA DESEADOS SE EVALUAN DESDE LAS SEÑALES DIGITALES POR MEDIO DE UN ALGORITMO MATEMATICO. EL APARATO DE ACUERDO CON LA PRESENTE INVENCION COMPRENDE UN ELECTRODO DE MEDIDA QUE ESTA COLOCADO DE FORMA AISLADA EN UN REBORDE O RECESO DE LA PARED DEL REACTOR QUE ACTUA AL MENOS COMO UNA PARTE DEL ELECTRODO DE TIERRA. LA INVENCION PUEDE UTILIZARSE CON RESPECTO A UN ATAQUE QUIMICO DE PLASMA EN EL CAMPO TECNICO DE LA TECNOLOGIA SEMICONDUCTORA.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE4445762A DE4445762A1 (de) | 1994-12-21 | 1994-12-21 | Verfahren und Vorrichtung zum Bestimmen absoluter Plasmaparameter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES2109045T3 true ES2109045T3 (es) | 1998-01-01 |
Family
ID=6536566
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES95119294T Expired - Lifetime ES2109045T3 (es) | 1994-12-21 | 1995-12-07 | Metodo y aparato para determinar parametros absolutos de un plasma. |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US5705931A (es) |
| EP (1) | EP0719077B1 (es) |
| JP (1) | JP2872954B2 (es) |
| AT (1) | ATE158134T1 (es) |
| DE (2) | DE4445762A1 (es) |
| ES (1) | ES2109045T3 (es) |
Families Citing this family (54)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR0179281B1 (ko) * | 1996-02-28 | 1999-10-01 | 문정환 | 챔버를 갖는 베이퍼-에치 장치의 에치-종말점 측정방법 |
| US6046594A (en) * | 1997-02-11 | 2000-04-04 | Advanced Energy Voorhees, Inc. | Method and apparatus for monitoring parameters of an RF powered load in the presence of harmonics |
| DE19722272A1 (de) * | 1997-05-28 | 1998-12-03 | Leybold Systems Gmbh | Vorrichtung zur Erzeugung von Plasma |
| JPH1183907A (ja) * | 1997-09-03 | 1999-03-26 | Mitsubishi Electric Corp | 高周波電流の測定方法 |
| US6043607A (en) * | 1997-12-16 | 2000-03-28 | Applied Materials, Inc. | Apparatus for exciting a plasma in a semiconductor wafer processing system using a complex RF waveform |
| GB9803932D0 (en) * | 1998-02-26 | 1998-04-22 | Matra Bae Dynamics Uk Ltd | Apparatus for the investigation of surface chemistry |
| US6151532A (en) * | 1998-03-03 | 2000-11-21 | Lam Research Corporation | Method and apparatus for predicting plasma-process surface profiles |
| JP3497091B2 (ja) * | 1998-07-23 | 2004-02-16 | 名古屋大学長 | プラズマ生成用高周波パワーの制御方法、およびプラズマ発生装置 |
| JP3497092B2 (ja) | 1998-07-23 | 2004-02-16 | 名古屋大学長 | プラズマ密度情報測定方法、および測定に用いられるプローブ、並びにプラズマ密度情報測定装置 |
| KR100448529B1 (ko) * | 1999-03-17 | 2004-09-13 | 가부시키가이샤 히타치세이사쿠쇼 | 이온전류밀도 측정방법 및 측정장치 및 반도체디바이스제조방법 |
| DE19927063B4 (de) * | 1999-06-15 | 2005-03-10 | Christof Luecking | Verfahren zur Bestimmung der elektrischen Eigenschaften von hochfrequenzangeregten Gasentladungen durch Berechnung mit einer inversen Matrix, die durch einmalige Kalibrierung bestimmt wird |
| DE19961104A1 (de) * | 1999-12-17 | 2001-07-05 | Infineon Technologies Ag | Verfahren und Vorrichtung zur Überwachung von Ätzkammern |
| US6653852B1 (en) * | 2000-03-31 | 2003-11-25 | Lam Research Corporation | Wafer integrated plasma probe assembly array |
| US6447719B1 (en) * | 2000-10-02 | 2002-09-10 | Johnson & Johnson | Power system for sterilization systems employing low frequency plasma |
| US20040262146A1 (en) * | 2000-10-02 | 2004-12-30 | Platt Robert C. | Sterilization system plasma generation control |
| US6852277B2 (en) * | 2000-10-02 | 2005-02-08 | Ethicon, Inc. | Sterilization system employing a switching module adapted to pulsate the low frequency power applied to a plasma |
| US6841124B2 (en) * | 2000-10-02 | 2005-01-11 | Ethicon, Inc. | Sterilization system with a plasma generator controlled by a digital signal processor |
| WO2002054835A2 (en) * | 2001-01-08 | 2002-07-11 | Tokyo Electron Limited | Addition of power at selected harmonics of plasma processor drive frequency |
| CN1249401C (zh) * | 2001-10-24 | 2006-04-05 | 东京电子株式会社 | 用于壁膜监测的方法与设备 |
| US6608446B1 (en) * | 2002-02-25 | 2003-08-19 | Eni Technology, Inc. | Method and apparatus for radio frequency (RF) metrology |
| US20030209518A1 (en) * | 2002-05-08 | 2003-11-13 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method of detecting abnormal chamber conditions in etcher |
| US6894474B2 (en) * | 2002-06-07 | 2005-05-17 | Applied Materials, Inc. | Non-intrusive plasma probe |
| US6707255B2 (en) | 2002-07-10 | 2004-03-16 | Eni Technology, Inc. | Multirate processing for metrology of plasma RF source |
| US6812044B2 (en) * | 2002-12-19 | 2004-11-02 | Taiwan Semiconductor Manufacturing Co., Ltd | Advanced control for plasma process |
| AT502984B8 (de) * | 2003-09-15 | 2008-10-15 | Qasar Technologieentwicklung Gmbh | Verfahren und einrichtung zur erzeugung von alfven-wellen |
| US7288942B2 (en) * | 2003-10-02 | 2007-10-30 | Naoyuki Sato | Plasma potential measuring method and apparatus, and plasma potential measuring probe |
| US20060043063A1 (en) * | 2004-09-02 | 2006-03-02 | Mahoney Leonard J | Electrically floating diagnostic plasma probe with ion property sensors |
| JP2008527378A (ja) * | 2005-01-11 | 2008-07-24 | イノベーション エンジニアリング、エルエルシー | 負荷に供給されたrf電力およびその負荷の複素インピーダンスを検出する方法 |
| US20060171848A1 (en) * | 2005-01-31 | 2006-08-03 | Advanced Energy Industries, Inc. | Diagnostic plasma sensors for endpoint and end-of-life detection |
| US7319316B2 (en) * | 2005-06-29 | 2008-01-15 | Lam Research Corporation | Apparatus for measuring a set of electrical characteristics in a plasma |
| US7479207B2 (en) * | 2006-03-15 | 2009-01-20 | Lam Research Corporation | Adjustable height PIF probe |
| JP4878187B2 (ja) * | 2006-03-20 | 2012-02-15 | 東京エレクトロン株式会社 | 基板処理装置、堆積物モニタ装置、及び堆積物モニタ方法 |
| DE102006014106B3 (de) * | 2006-03-24 | 2007-08-30 | RUHR-UNIVERSITäT BOCHUM | Vorrichtung und Verfahren zur Messung der Dichte eines Plasmas |
| US7829468B2 (en) * | 2006-06-07 | 2010-11-09 | Lam Research Corporation | Method and apparatus to detect fault conditions of plasma processing reactor |
| EP2089894B1 (en) | 2006-11-27 | 2011-06-01 | Dublin City University | A plasma system and measurement method |
| EP2114112B1 (en) | 2008-04-29 | 2015-09-23 | Plasmetrex GmbH | Apparatus for industrial plasma processes |
| GB2459858A (en) * | 2008-05-07 | 2009-11-11 | Univ Dublin City | System for analysing plasma |
| US7970562B2 (en) * | 2008-05-07 | 2011-06-28 | Advanced Energy Industries, Inc. | System, method, and apparatus for monitoring power |
| DE102009038563B4 (de) * | 2009-08-22 | 2013-06-06 | Reinhausen Plasma Gmbh | Vorrichtung und Verfahren zur Überwachung eines Plasmastrahls |
| US8190366B2 (en) * | 2010-10-01 | 2012-05-29 | The United States Of America, As Represented By The Secretary Of The Navy | LC resonance probe for determining local plasma density |
| DE102010055799B3 (de) | 2010-10-06 | 2016-10-06 | RUHR-UNIVERSITäT BOCHUM | Vorrichtung und Verwendung der Vorrichtung zur Messung der Dichte und/oder der Elektronentemperatur und/oder der Stoßfrequenz eines Plasmas |
| RU2515539C1 (ru) * | 2012-12-14 | 2014-05-10 | Федеральное Государственное Бюджетное Образовательное Учреждение Высшего Профессионального Образования "Нижегородский Государственный Университет Им. Н.И. Лобачевского" | Способ модификации ионосферной плазмы |
| US11432732B2 (en) | 2016-06-28 | 2022-09-06 | Chiscan Holdings, Llc | System and method of measuring millimeter wave of cold atmospheric pressure plasma |
| US11166762B2 (en) * | 2016-06-28 | 2021-11-09 | Chiscan Holdings, L.L.C. | Non-thermal plasma generator for detection and treatment of maladies |
| CN106851953B (zh) * | 2017-02-22 | 2018-12-21 | 大连理工大学 | 一种凸凹探针及其等离子体诊断方法 |
| DE102018115389B3 (de) | 2018-06-26 | 2019-08-14 | RUHR-UNIVERSITäT BOCHUM | Sonde zur Messung von Plasmaparametern |
| JP2020136144A (ja) * | 2019-02-22 | 2020-08-31 | 株式会社アルバック | プラズマ状態測定装置、および、成膜装置 |
| CN114025664A (zh) | 2019-05-06 | 2022-02-08 | 智像控股有限责任公司 | 使用非热等离子体阵列的推定的能量场分析 |
| TW202536923A (zh) | 2019-07-12 | 2025-09-16 | 新加坡商Aes 全球公司 | 具有控制開關之偏壓供應器 |
| US20210217588A1 (en) * | 2020-01-10 | 2021-07-15 | COMET Technologies USA, Inc. | Azimuthal sensor array for radio frequency plasma-based wafer processing systems |
| CN113648051B (zh) * | 2021-08-13 | 2022-08-02 | 卡本(深圳)医疗器械有限公司 | 一种基于emc-emi的自适应射频信号数据处理设备 |
| US12567572B2 (en) * | 2023-07-11 | 2026-03-03 | Advanced Energy Industries, Inc. | Plasma behaviors predicted by current measurements during asymmetric bias waveform application |
| CN117545157B (zh) * | 2024-01-09 | 2024-03-12 | 西南交通大学 | 一种用于测量等离子体电势和电场的诊断方法及系统 |
| US12255056B2 (en) | 2024-01-09 | 2025-03-18 | Southwest Jiaotong University | Diagnostic method and system for measuring potential and electric field of plasma |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4475063A (en) * | 1981-06-22 | 1984-10-02 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Hollow cathode apparatus |
| US5053343A (en) * | 1985-02-15 | 1991-10-01 | Environmental Technologies Group, Inc. | Selective ionization of gas constituents using electrolytic reactions |
| GB2211244A (en) * | 1987-10-16 | 1989-06-28 | Ford Motor Co | I.c. engine combustion chamber ionisation sensor |
| US5274306A (en) * | 1990-08-31 | 1993-12-28 | Kaufman & Robinson, Inc. | Capacitively coupled radiofrequency plasma source |
| US5394092A (en) * | 1991-02-28 | 1995-02-28 | Valco Instruments Co., Inc. | System for identifying and quantifying selected constituents of gas samples using selective photoionization |
| ATE170289T1 (de) * | 1991-07-19 | 1998-09-15 | Secr Defence Brit | Vorrichtung und verfahren zum gasnachweis |
| US5175472A (en) * | 1991-12-30 | 1992-12-29 | Comdel, Inc. | Power monitor of RF plasma |
| JP3292531B2 (ja) * | 1993-01-15 | 2002-06-17 | 忠弘 大見 | 高周波励起プラズマの計測装置 |
| JPH07169590A (ja) * | 1993-09-16 | 1995-07-04 | Fujitsu Ltd | 電子密度の測定方法及びその装置及び電子密度の制御装置及びプラズマ処理装置 |
| US5576629A (en) * | 1994-10-24 | 1996-11-19 | Fourth State Technology, Inc. | Plasma monitoring and control method and system |
| US5565737A (en) * | 1995-06-07 | 1996-10-15 | Eni - A Division Of Astec America, Inc. | Aliasing sampler for plasma probe detection |
-
1994
- 1994-12-21 DE DE4445762A patent/DE4445762A1/de not_active Withdrawn
-
1995
- 1995-09-15 US US08/529,020 patent/US5705931A/en not_active Expired - Lifetime
- 1995-11-28 JP JP7332746A patent/JP2872954B2/ja not_active Expired - Lifetime
- 1995-12-07 DE DE69500694T patent/DE69500694T2/de not_active Expired - Lifetime
- 1995-12-07 ES ES95119294T patent/ES2109045T3/es not_active Expired - Lifetime
- 1995-12-07 AT AT95119294T patent/ATE158134T1/de active IP Right Revival
- 1995-12-07 EP EP95119294A patent/EP0719077B1/en not_active Expired - Lifetime
-
1997
- 1997-04-15 US US08/842,564 patent/US5861752A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| EP0719077A1 (en) | 1996-06-26 |
| JPH08222396A (ja) | 1996-08-30 |
| DE69500694D1 (de) | 1997-10-16 |
| EP0719077B1 (en) | 1997-09-10 |
| DE4445762A1 (de) | 1996-06-27 |
| JP2872954B2 (ja) | 1999-03-24 |
| US5861752A (en) | 1999-01-19 |
| ATE158134T1 (de) | 1997-09-15 |
| DE69500694T2 (de) | 1998-03-26 |
| US5705931A (en) | 1998-01-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FG2A | Definitive protection |
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