ES2119689A1 - Metodo para determinar la distribucion de componentes electronicos y metodo de fabricacion que lo utiliza. - Google Patents

Metodo para determinar la distribucion de componentes electronicos y metodo de fabricacion que lo utiliza.

Info

Publication number
ES2119689A1
ES2119689A1 ES09601482A ES9601482A ES2119689A1 ES 2119689 A1 ES2119689 A1 ES 2119689A1 ES 09601482 A ES09601482 A ES 09601482A ES 9601482 A ES9601482 A ES 9601482A ES 2119689 A1 ES2119689 A1 ES 2119689A1
Authority
ES
Spain
Prior art keywords
electronic
speed
electronic parts
groups
manufacture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
ES09601482A
Other languages
English (en)
Other versions
ES2119689B1 (es
Inventor
Toshinobu Fukukura
Hirokazu Usui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
NipponDenso Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NipponDenso Co Ltd filed Critical NipponDenso Co Ltd
Publication of ES2119689A1 publication Critical patent/ES2119689A1/es
Application granted granted Critical
Publication of ES2119689B1 publication Critical patent/ES2119689B1/es
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y10T29/49137—Different components

Landscapes

  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Management, Administration, Business Operations System, And Electronic Commerce (AREA)
  • Multi-Process Working Machines And Systems (AREA)
  • General Factory Administration (AREA)

Abstract

METODO PARA DETERMINAR LA DISTRIBUCION DE COMPONENTES ELECTRONICOS CON EFICACIA MEJORADA Y EN POCO TIEMPO. PARA TODAS LAS CLASES DE PIEZAS ELECTRONICAS (A-J) SELECCIONADAS PARA LA FABRICACION DE TODOS LOS PRODUCTOS ELECTRONICOS. LAS PIEZAS ELECTRONICAS (A-J) SON DIVIDIDAS EN UNA PLURALIDAD DE GRUPOS DE VELOCIDAD (GRUPOS 1-N) BASANDOSE EN LOS LIMITES DE VELOCIDAD DE GIRO PERMISIBLES DE CABEZAS DE MONTAJE (9) DURANTE LA ROTACION DE UNA MESA GIRATORIA (8). LOS GRUPOS DE VELOCIDAD (GRUPOS 1-N) SON SOMETIDOS A UN PROCESO DE SECUENCIACION. SE CLASIFICAN LUEGO EN GRUPOS UNAS PIEZAS ELECTRONICAS (A-J) UTILIZADAS PARA LA FABRICACION DE CADA TIPO DE PRODUCTO ELECTRONICO. INCLUYENDO CADA GRUPO UNA CLASE DIFERENTE DE PIEZA ELECTRONICA. LOS GRUPOS DE PIEZAS RESULTANTES SE CLASIFICAN ADEMAS EN SUBGRUPOS (U1-UN), CORRESPONDIENDO CADA SUBGRUPO (U1-UN) A UNO DE LOS GRUPOS DE VELOCIDAD (GRUPOS 1-N).
ES09601482A 1995-07-04 1996-07-03 Metodo para determinar la distribucion de componentes electronicos y metodo de fabricacion que lo utiliza. Expired - Fee Related ES2119689B1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16841395A JP3680359B2 (ja) 1995-07-04 1995-07-04 電子部品の配列方法

Publications (2)

Publication Number Publication Date
ES2119689A1 true ES2119689A1 (es) 1998-10-01
ES2119689B1 ES2119689B1 (es) 1999-04-16

Family

ID=15867673

Family Applications (1)

Application Number Title Priority Date Filing Date
ES09601482A Expired - Fee Related ES2119689B1 (es) 1995-07-04 1996-07-03 Metodo para determinar la distribucion de componentes electronicos y metodo de fabricacion que lo utiliza.

Country Status (3)

Country Link
US (1) US6006425A (es)
JP (1) JP3680359B2 (es)
ES (1) ES2119689B1 (es)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3504394B2 (ja) * 1995-09-08 2004-03-08 松下電器産業株式会社 部品配列のデータ作成方法
EP1054584B1 (en) * 1997-11-10 2006-08-23 Matsushita Electric Industrial Co., Ltd. Part mounting apparatus and part supply apparatus
US6571462B1 (en) * 1999-04-27 2003-06-03 Matsushita Electric Industrial Co., Ltd Electronic component mounting apparatus using duplicate sources of components
US6606790B2 (en) * 2000-06-21 2003-08-19 Matsushita Electric Industrial Co., Ltd. Component mounter and mounting method
WO2002013590A2 (en) * 2000-08-04 2002-02-14 Matsushita Electric Industrial Co., Ltd. Method for optimization of an order of component mounting, apparatus using the same, and mounter
JP2002204096A (ja) * 2000-12-28 2002-07-19 Fuji Mach Mfg Co Ltd 電気部品装着システムおよび電気部品装着方法
JP4582963B2 (ja) * 2001-06-14 2010-11-17 パナソニック株式会社 電子部品装着装置
FR2833098A1 (fr) * 2001-12-03 2003-06-06 L4 Logistics Procede et dispositif permettant de realiser rapidement une pluralite de commandes
JP3934002B2 (ja) * 2002-07-23 2007-06-20 松下電器産業株式会社 部品実装順序最適化方法、部品実装順序最適化プログラム、及び部品実装装置
KR101062511B1 (ko) * 2003-09-01 2011-09-06 파나소닉 주식회사 부품 장착 순서의 최적화 방법 및 부품 장착 순서의 최적화장치
JP2006049336A (ja) * 2004-07-30 2006-02-16 Hitachi High-Tech Instruments Co Ltd 電子部品装着装置
KR101113838B1 (ko) * 2004-11-30 2012-02-29 삼성테크윈 주식회사 전자부품 실장 방법 및 이를 채택한 부품 실장기
US8407889B2 (en) 2006-03-07 2013-04-02 Panasonic Corporation Component mounting condition determination method
JP4829145B2 (ja) * 2006-03-15 2011-12-07 パナソニック株式会社 最大部品吸着数を決定する方法
CN102573441B (zh) * 2010-12-22 2016-08-10 韩华泰科株式会社 旋转安装的头单元以及用于安装部件的设备和方法
JP2023067567A (ja) * 2021-11-01 2023-05-16 Juki株式会社 部品実装装置及びフィーダの配置決定方法
CN116266295A (zh) * 2021-12-16 2023-06-20 华晨宝马汽车有限公司 对车辆零件的存储进行管理的方法和设备

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4127432A (en) * 1976-04-12 1978-11-28 Matsushita Electric Industrial Co., Ltd. Method for mounting chip type circuit elements on a printed circuit board and apparatus for performing the same
US4598459A (en) * 1984-03-22 1986-07-08 Siemens Aktiengesellschaft Installation for manual assemblying of components on a printed circuit board
US4951388A (en) * 1988-06-21 1990-08-28 Matsushita Electric Industrial Co., Ltd. Method of mounting electronic components
US5285946A (en) * 1991-10-11 1994-02-15 Sanyo Electric Co., Ltd. Apparatus for mounting components

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6215028A (ja) * 1985-07-10 1987-01-23 Hitachi Ltd 自動組立機における部品配置決定方法
JPH0297099A (ja) * 1988-10-03 1990-04-09 Sanyo Electric Co Ltd 電子部品装着方法
JP2966082B2 (ja) * 1990-11-06 1999-10-25 株式会社日立製作所 実装順序決定方法及びその実装方法
JPH04262596A (ja) * 1991-02-18 1992-09-17 Matsushita Electric Ind Co Ltd 部品実装装置
JPH05304396A (ja) * 1991-07-12 1993-11-16 Canon Inc 部品の実装順序の決定方法及びその装置
JPH0523932A (ja) * 1991-07-17 1993-02-02 Toshiba Corp 部品装着装置
JP2957778B2 (ja) * 1991-10-11 1999-10-06 三洋電機株式会社 部品装着順序最適化方法
JP3229675B2 (ja) * 1992-11-06 2001-11-19 三洋電機株式会社 部品供給カセットの配列順序最適化方法
JPH06216581A (ja) * 1993-01-13 1994-08-05 Matsushita Electric Ind Co Ltd 電子部品実装装置
JPH0722774A (ja) * 1993-06-22 1995-01-24 Matsushita Electric Ind Co Ltd 実装ラインの部品配列方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4127432A (en) * 1976-04-12 1978-11-28 Matsushita Electric Industrial Co., Ltd. Method for mounting chip type circuit elements on a printed circuit board and apparatus for performing the same
US4598459A (en) * 1984-03-22 1986-07-08 Siemens Aktiengesellschaft Installation for manual assemblying of components on a printed circuit board
US4951388A (en) * 1988-06-21 1990-08-28 Matsushita Electric Industrial Co., Ltd. Method of mounting electronic components
US5285946A (en) * 1991-10-11 1994-02-15 Sanyo Electric Co., Ltd. Apparatus for mounting components

Also Published As

Publication number Publication date
JP3680359B2 (ja) 2005-08-10
US6006425A (en) 1999-12-28
ES2119689B1 (es) 1999-04-16
JPH0923089A (ja) 1997-01-21

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