ES2132830T3 - Lamina termoplastica adhesiva. - Google Patents

Lamina termoplastica adhesiva.

Info

Publication number
ES2132830T3
ES2132830T3 ES96118502T ES96118502T ES2132830T3 ES 2132830 T3 ES2132830 T3 ES 2132830T3 ES 96118502 T ES96118502 T ES 96118502T ES 96118502 T ES96118502 T ES 96118502T ES 2132830 T3 ES2132830 T3 ES 2132830T3
Authority
ES
Spain
Prior art keywords
proportion
adhesive film
contact surfaces
weight
thermoplastic sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES96118502T
Other languages
English (en)
Inventor
Hans-Karl Engeldinger
Albert-Ralf Saucke
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beiersdorf AG
Original Assignee
Beiersdorf AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26015530&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ES2132830(T3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Beiersdorf AG filed Critical Beiersdorf AG
Application granted granted Critical
Publication of ES2132830T3 publication Critical patent/ES2132830T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/699—Insulating or insulated package substrates; Interposers; Redistribution layers for flat cards, e.g. credit cards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2475/00—Presence of polyurethane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

LA INVENCION TRATA DE UNA PELICULA ADHESIVA TERMOPLASTICA PARA IMPLANTAR MODULOS ELECTRICOS EN UNA TARJETA PROVISTA DE UN ESCOTE PRACTICADO PARA COLOCAR UN MODULO ELECTRONICO, QUE EN LA PRIMERA CARA MUESTRA VARIAS SUPERFICIES DE CONTACTO Y EN LA SEGUNDA CARA, SITUADA FRENTE A LA PRIMERA CARA, MUESTRA UN ELEMENTO DE CIRCUITO INTEGRADO, CUYOS PUNTOS DE CONEXION ESTAN CONECTADOS CON LAS SUPERFICIES DE CONTACTO A TRAVES DE CONDUCTORES ELECTRICOS, SIRVIENDO LA PELICULA ADHESIVA PARA UNIR LA SEGUNDA CARA DEL MODULO CON LA TARJETA; LA INVENCION ESTA CARACTERIZADA PORQUE LA PELICULA ADHESIVA MUESTRA LA COMBINACION DE LOS SIGUIENTES COMPONENTES: I) UN POLIMERO TERMOPLASTICO CON UNA PROPORCION DEL 40 AL 100 % EN PESO Y II) UNA O VARIAS RESINAS ADHERENTES CON UNA PROPORCION DEL 5 AL 50 % EN PESO O ALTERNATIVAMENTE III) RESINAS EPOXI CON ENDURECEDORES CON UNA PROPORCION DEL 5 AL 40 % EN PESO.
ES96118502T 1995-05-27 1996-11-19 Lamina termoplastica adhesiva. Expired - Lifetime ES2132830T3 (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19519499A DE19519499B4 (de) 1995-05-27 1995-05-27 Thermoplastische Klebstoffolie und deren Verwendung
EP96118502A EP0842995B1 (de) 1995-05-27 1996-11-19 Thermoplastische Klebstofffolie

Publications (1)

Publication Number Publication Date
ES2132830T3 true ES2132830T3 (es) 1999-08-16

Family

ID=26015530

Family Applications (1)

Application Number Title Priority Date Filing Date
ES96118502T Expired - Lifetime ES2132830T3 (es) 1995-05-27 1996-11-19 Lamina termoplastica adhesiva.

Country Status (3)

Country Link
EP (1) EP0842995B1 (es)
DE (2) DE19519499B4 (es)
ES (1) ES2132830T3 (es)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19519499B4 (de) * 1995-05-27 2005-05-25 Tesa Ag Thermoplastische Klebstoffolie und deren Verwendung
EP0846743A1 (de) * 1996-12-03 1998-06-10 Beiersdorf Aktiengesellschaft Thermoplastische härtbare Selbstklebefolie
DE19700254A1 (de) * 1996-12-03 1998-06-04 Beiersdorf Ag Thermoplastische härtbare Selbstklebefolie
DE19708325B4 (de) * 1997-03-03 2007-06-14 Sokymat Gmbh Klebeverbindung von elektrisch leitenden Fügeteilen
WO2000001782A1 (de) * 1998-07-04 2000-01-13 Beiersdorf Ag Elektrisch leitfähige, thermoplastische und hitzeaktivierbare klebstofffolie
DE19848712A1 (de) * 1998-10-22 2000-04-27 Henkel Kgaa Komponentenschicht für Smart Cards aus Schmelzklebstoffen
DE19853805B4 (de) * 1998-11-21 2005-05-12 Tesa Ag Elektrisch leitfähige, thermoplastische und hitzeaktivierbare Klebstofffolie und deren Verwendung
DE10016135A1 (de) * 2000-03-31 2001-10-18 Infineon Technologies Ag Gehäusebaugruppe für ein elektronisches Bauteil
DE10031139C2 (de) * 2000-06-27 2003-04-17 Wacker Siltronic Halbleitermat Verfahren und Stoffmischung zur Montage und Demontage von Halbleiterscheiben
DE10248382B4 (de) * 2002-10-17 2010-09-30 Giesecke & Devrient Gmbh Verfahren zum Laminieren von Folien und Folienanordnung
ES2324218T3 (es) 2003-08-22 2009-08-03 Tesa Se Utilizacion de una pelicula de adhesivo para implantar modulos electricos en el cuerpo de una tarjeta.
DE10361538A1 (de) * 2003-12-23 2005-07-28 Tesa Ag Schmelzkleber zur Implantierung von elektrischen Modulen in einen Kartenkörper
JP2011207086A (ja) * 2010-03-30 2011-10-20 Three M Innovative Properties Co 複合部品、複合部品前駆体、及び接着剤
DE102016207550A1 (de) 2016-05-02 2017-11-02 Tesa Se Funktionalisierte (Co)Polymere für Klebesysteme und Klebebänder
DE102016207540A1 (de) 2016-05-02 2017-11-02 Tesa Se Wasserdampfsperrende Klebemasse mit hochfunktionalisiertem Poly(meth)acrylat
DE102016207548A1 (de) 2016-05-02 2017-11-02 Tesa Se Härtbare Klebemasse und darauf basierende Reaktivklebebänder
DE102016220237A1 (de) 2016-10-17 2018-04-19 Tesa Se Verfahren zur Herstellung einer versiegelten Falzverbindung
DE102018213824A1 (de) 2018-08-16 2020-02-20 Tesa Se Verfahren zur Herstellung einer versiegelten Falzverbindung
DE102022113506A1 (de) 2022-05-30 2023-11-30 Tesa Se Verfahren zum Verbinden, Ablösen und Wiederverbinden von Substraten

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2629236B1 (fr) * 1988-03-22 1991-09-27 Schlumberger Ind Sa Procede de realisation d'une carte a memoire electronique et carte telle qu'obtenue par la mise en oeuvre dudit procede
DE4040770C2 (de) 1990-12-19 1999-11-11 Gao Ges Automation Org Datenträger mit integriertem Schaltkreis
DE4122049A1 (de) * 1991-07-03 1993-01-07 Gao Ges Automation Org Verfahren zum einbau eines traegerelements
JPH05144855A (ja) * 1991-11-22 1993-06-11 Toshiba Chem Corp 半導体装置
JPH08250522A (ja) * 1995-03-10 1996-09-27 Toshiba Chem Corp 半導体装置
DE19519499B4 (de) * 1995-05-27 2005-05-25 Tesa Ag Thermoplastische Klebstoffolie und deren Verwendung

Also Published As

Publication number Publication date
DE19519499B4 (de) 2005-05-25
EP0842995A1 (de) 1998-05-20
DE19519499A1 (de) 1996-11-28
DE59601784D1 (de) 1999-06-02
EP0842995B1 (de) 1999-04-28

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