ES2133751T3 - Procedimiento para la deposicion electrolitica de metales a partir de electrolitos que contienen aditivos organicos. - Google Patents
Procedimiento para la deposicion electrolitica de metales a partir de electrolitos que contienen aditivos organicos.Info
- Publication number
- ES2133751T3 ES2133751T3 ES95912124T ES95912124T ES2133751T3 ES 2133751 T3 ES2133751 T3 ES 2133751T3 ES 95912124 T ES95912124 T ES 95912124T ES 95912124 T ES95912124 T ES 95912124T ES 2133751 T3 ES2133751 T3 ES 2133751T3
- Authority
- ES
- Spain
- Prior art keywords
- additives
- organic additives
- electrolyte
- organic
- containing organic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
- C25D21/14—Controlled addition of electrolyte components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing of the conductive pattern
- H05K3/241—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Automation & Control Theory (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electrolytic Production Of Metals (AREA)
Abstract
LA INVENCION TRATA DE UN PROCEDIMIENTO PARA LA DEPOSICION ELECTROLITICA DE METALES A PARTIR DE ELECTROLITOS, QUE CONTIENEN ADITIVOS ORGANICOS QUE DAN PROPIEDADES FISICAS PARTICULARES. TALES ADITIVOS SE PIERDEN CONTINUAMENTE DURANTE LA GALVANIZACION, FORMANDOSE PRODUCTOS DE DESCOMPOSICION QUE SE EXTIENDEN POR TODA LA PLANTA GALVANIZACION, Y SE DEPOSITAN EN LOS OBJETOS QUE SE VAN A GALVANIZAR. POR TANTO EL OBJETO DE LA PRESENTE INVENCION ES EL EVITAR DEFECTOS EN LAS CAPAS DE DEPOSICION CAUSADOS POR LOS RESIDUOS ORGANICOS, ASEGURANDO UNA DEPOSICION CONTINUA DE METAL Y UNA CALIDAD UNIFORME DE LAS CAPAS METALICAS OBTENIDAS. EL OBJETO SE CONSIGUE LIMITANDO FISICAMENTE LOS ADITIVOS ORGANICOS A LA PARTE DEL ELECTROLITO EN LA CUAL SON IMPORTANTES. EL ELECTROLITO SE RECICLA A TRAVES DE UN FILTRO PARA QUE ESTE LIBRE DE ADITIVOS ORGANICOS. LA NUEVA DOSIFICACION DE ADITIVOS ORGANICOS SE REALIZA CON DEPENDENCIA DE SU GASTO JUSTO ANTES DE LA ZONA IMPORTANTE DEL PROCESO.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE4405741A DE4405741C1 (de) | 1994-02-23 | 1994-02-23 | Verfahren zur elektrolytischen Abscheidung von Metallen aus Elektrolyten mit Prozeßorganik |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES2133751T3 true ES2133751T3 (es) | 1999-09-16 |
Family
ID=6510942
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES95912124T Expired - Lifetime ES2133751T3 (es) | 1994-02-23 | 1995-02-23 | Procedimiento para la deposicion electrolitica de metales a partir de electrolitos que contienen aditivos organicos. |
Country Status (7)
| Country | Link |
|---|---|
| EP (1) | EP0746640B1 (es) |
| JP (1) | JP3454829B2 (es) |
| AT (1) | ATE181118T1 (es) |
| CA (1) | CA2179904C (es) |
| DE (2) | DE4405741C1 (es) |
| ES (1) | ES2133751T3 (es) |
| WO (1) | WO1995023247A2 (es) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19539865A1 (de) * | 1995-10-26 | 1997-04-30 | Lea Ronal Gmbh | Durchlauf-Galvanikanlage |
| EP0802990A1 (de) * | 1995-10-26 | 1997-10-29 | Lea Ronal GmbH | Vorrichtung zur chemischen oder elektrolytischen oberflächenbehandlung plattenförmiger gegenstände |
| DE19539866C2 (de) * | 1995-10-26 | 1997-09-18 | Lea Ronal Gmbh | Vorrichtung zur chemischen oder elektrolytischen Oberflächenbehandlung plattenförmiger Gegenstände |
| AU3778999A (en) * | 1998-05-01 | 1999-11-23 | Dj Parker Company, Inc. | Chemical mixing, replenishment, and waste management system |
| DE10314279A1 (de) * | 2003-03-29 | 2004-10-14 | Daimlerchrysler Ag | Verfahren und Vorrichtung zum Steuern mindestens einer Betriebsgröße eines elektrolytischen Bades |
| US7851222B2 (en) | 2005-07-26 | 2010-12-14 | Applied Materials, Inc. | System and methods for measuring chemical concentrations of a plating solution |
| US9303329B2 (en) | 2013-11-11 | 2016-04-05 | Tel Nexx, Inc. | Electrochemical deposition apparatus with remote catholyte fluid management |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2729387A1 (de) * | 1977-06-27 | 1979-01-18 | Schering Ag | Verfahren zur kontinuierlichen aufbereitung eines galvanischen nickelbades sowie vorrichtung zur durchfuehrung des verfahrens |
| DD215589B5 (de) * | 1983-05-11 | 1994-06-01 | Heinz Dr Rer Nat Liebscher | Verfahren zur elektrolytischen Metallabscheidung bei erzwungener Konvektion |
| DE4031979A1 (de) * | 1990-09-26 | 1992-04-02 | Huang Yun Fu | Vorrichtung zum entfernen von verunreinigungen, die in chrom-galvanisierbaedern enthalten sind |
| DE4137377A1 (de) * | 1991-11-13 | 1993-05-19 | Jatzke Rudolf Fa | Verfahren, mittel und vorrichtung zum elektrodialytischen regenerieren des elektrolyten eines galvanischen bades oder dergl. |
| JP5232332B2 (ja) | 2011-03-31 | 2013-07-10 | AvanStrate株式会社 | ガラス板の製造方法 |
-
1994
- 1994-02-23 DE DE4405741A patent/DE4405741C1/de not_active Expired - Fee Related
-
1995
- 1995-02-23 DE DE59506171T patent/DE59506171D1/de not_active Expired - Fee Related
- 1995-02-23 EP EP95912124A patent/EP0746640B1/de not_active Expired - Lifetime
- 1995-02-23 ES ES95912124T patent/ES2133751T3/es not_active Expired - Lifetime
- 1995-02-23 WO PCT/DE1995/000297 patent/WO1995023247A2/de not_active Ceased
- 1995-02-23 AT AT95912124T patent/ATE181118T1/de not_active IP Right Cessation
- 1995-02-23 JP JP52207195A patent/JP3454829B2/ja not_active Expired - Fee Related
- 1995-02-23 CA CA002179904A patent/CA2179904C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| WO1995023247A3 (de) | 1996-01-11 |
| CA2179904C (en) | 2006-01-31 |
| EP0746640B1 (de) | 1999-06-09 |
| DE59506171D1 (de) | 1999-07-15 |
| DE4405741C1 (de) | 1995-06-01 |
| EP0746640A1 (de) | 1996-12-11 |
| JPH09509222A (ja) | 1997-09-16 |
| JP3454829B2 (ja) | 2003-10-06 |
| WO1995023247A2 (de) | 1995-08-31 |
| CA2179904A1 (en) | 1995-08-31 |
| ATE181118T1 (de) | 1999-06-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FG2A | Definitive protection |
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