ES2146128B1 - Procedimiento de fotoenmascaramiento de poliimidas fotosensibles con compuestos organometalicos para procesos fotolitograficos en tecnologia de silicio. - Google Patents
Procedimiento de fotoenmascaramiento de poliimidas fotosensibles con compuestos organometalicos para procesos fotolitograficos en tecnologia de silicio.Info
- Publication number
- ES2146128B1 ES2146128B1 ES9500645A ES9500645A ES2146128B1 ES 2146128 B1 ES2146128 B1 ES 2146128B1 ES 9500645 A ES9500645 A ES 9500645A ES 9500645 A ES9500645 A ES 9500645A ES 2146128 B1 ES2146128 B1 ES 2146128B1
- Authority
- ES
- Spain
- Prior art keywords
- polyimides
- silicon technology
- photolithographic processes
- photoenmasking
- photosensible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title abstract 7
- 238000005516 engineering process Methods 0.000 title abstract 3
- 239000004642 Polyimide Substances 0.000 title abstract 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title abstract 2
- 229920001721 polyimide Polymers 0.000 title abstract 2
- 229910052710 silicon Inorganic materials 0.000 title abstract 2
- 239000010703 silicon Substances 0.000 title abstract 2
- 150000001875 compounds Chemical class 0.000 title 1
- 239000004952 Polyamide Substances 0.000 abstract 2
- 229920002647 polyamide Polymers 0.000 abstract 2
- 239000002243 precursor Substances 0.000 abstract 2
- 238000002444 silanisation Methods 0.000 abstract 2
- 239000002253 acid Substances 0.000 abstract 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract 1
- 238000005538 encapsulation Methods 0.000 abstract 1
- 239000007789 gas Substances 0.000 abstract 1
- 230000001788 irregular Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 abstract 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M methacrylate group Chemical group C(C(=C)C)(=O)[O-] CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 abstract 1
- 238000004377 microelectronic Methods 0.000 abstract 1
- 150000002902 organometallic compounds Chemical class 0.000 abstract 1
- 239000001301 oxygen Substances 0.000 abstract 1
- 229910052760 oxygen Inorganic materials 0.000 abstract 1
- 239000002356 single layer Substances 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
- 238000012876 topography Methods 0.000 abstract 1
Landscapes
- Formation Of Insulating Films (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Abstract
Procedimiento de fotoenmascaramiento de poliimidas fotosensibles con compuestos organometálicos para procesos fotolitográficos en tecnología de silicio. Es un proceso fotolitográfico monocapa sobre topografías irregulares que se basa en la silanización superficial de los grupos metacrilato del ácido poliámico precursor de la poliimida fotosensible para que actúen como máscara ante el revelado por plasma en modo RIE, con oxígeno como gas reactivo. El proceso permite la obtención de motivos positivos o negativos, con respecto a la máscara, utilizando los mismos precursores fotosensibles ya que esto depende únicamente de la secuencia con que se realicen los pasos de exposición y silanización. Este proceso puede aplicarle a la fotodefinición de capas poliméricas de cualquier espesor. Aplicación en la encapsulación se sensores químicos, módulos multichip, tecnología microelectrónica, sectores electrónicos, óptica integrada.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ES9500645A ES2146128B1 (es) | 1995-03-31 | 1995-03-31 | Procedimiento de fotoenmascaramiento de poliimidas fotosensibles con compuestos organometalicos para procesos fotolitograficos en tecnologia de silicio. |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ES9500645A ES2146128B1 (es) | 1995-03-31 | 1995-03-31 | Procedimiento de fotoenmascaramiento de poliimidas fotosensibles con compuestos organometalicos para procesos fotolitograficos en tecnologia de silicio. |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| ES2146128A1 ES2146128A1 (es) | 2000-07-16 |
| ES2146128B1 true ES2146128B1 (es) | 2001-03-16 |
Family
ID=8289963
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES9500645A Expired - Lifetime ES2146128B1 (es) | 1995-03-31 | 1995-03-31 | Procedimiento de fotoenmascaramiento de poliimidas fotosensibles con compuestos organometalicos para procesos fotolitograficos en tecnologia de silicio. |
Country Status (1)
| Country | Link |
|---|---|
| ES (1) | ES2146128B1 (es) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0131992B1 (en) * | 1983-07-01 | 1988-03-02 | Koninklijke Philips Electronics N.V. | Photosensitive polyamic acid derivative, method of manufacturing polyimide pattern on a substrate, and semiconductor device comprising a polyimide pattern obtained by using the said method |
| EP0176062A3 (en) * | 1984-09-27 | 1987-07-15 | Dow Corning Corporation | Silane bonding agents for high temperature applications and method therefor |
| EP0467516A1 (en) * | 1990-07-20 | 1992-01-22 | Cabot Technology Corporation | Hemostatic stent |
| JP2687751B2 (ja) * | 1991-03-18 | 1997-12-08 | 信越化学工業株式会社 | 感光性重合体材料 |
| EP0568476B1 (en) * | 1992-04-30 | 1995-10-11 | International Business Machines Corporation | Silicon-containing positive resist and method of using the same in thin film packaging technology |
| JP3687988B2 (ja) * | 1993-09-03 | 2005-08-24 | 日立化成工業株式会社 | ｉ線ステッパ用感光性樹脂組成物 |
-
1995
- 1995-03-31 ES ES9500645A patent/ES2146128B1/es not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| ES2146128A1 (es) | 2000-07-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FC2A | Grant refused |
Effective date: 19990107 |
|
| EC2A | Search report published |
Date of ref document: 20000716 Kind code of ref document: A1 Effective date: 20000716 |