ES2159084T3 - Dispositivo para el tratamiento superficial por plasma de piezas de trabajo. - Google Patents

Dispositivo para el tratamiento superficial por plasma de piezas de trabajo.

Info

Publication number
ES2159084T3
ES2159084T3 ES97123034T ES97123034T ES2159084T3 ES 2159084 T3 ES2159084 T3 ES 2159084T3 ES 97123034 T ES97123034 T ES 97123034T ES 97123034 T ES97123034 T ES 97123034T ES 2159084 T3 ES2159084 T3 ES 2159084T3
Authority
ES
Spain
Prior art keywords
treatment
plasma
machining
chamber
chambers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES97123034T
Other languages
English (en)
Inventor
Siegfried Dr Stramke
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE29712960U external-priority patent/DE29712960U1/de
Application filed by Individual filed Critical Individual
Application granted granted Critical
Publication of ES2159084T3 publication Critical patent/ES2159084T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/58—After-treatment
    • C23C14/5886—Mechanical treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • C23C14/566—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases using a load-lock chamber
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/02—Pretreatment of the material to be coated
    • C23C16/0254—Physical treatment to alter the texture of the surface, e.g. scratching or polishing
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/56—After-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C8/00—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C8/06—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases
    • C23C8/36—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases using ionised gases, e.g. ionitriding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Drying Of Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
  • Arc Welding In General (AREA)

Abstract

EN UN DISPOSITIVO PARA MECANIZAR Y TRATAR SUPERFICIALMENTE CON PLASMA PIEZAS DE TRABAJO SE HAN REUNIDO EN UN APARATO UNA CAMARA DE MECANIZACION (1) PARA MECANIZAR PIEZAS DE TRABAJO Y UNA CAMARA DE TRATAMIENTO (10) PARA EL TRATAMIENTO SUPERFICIAL CON PLASMA DE LAS PIEZAS DE TRABAJO. LAS DOS CAMARAS (10, 11) SON ESTANCAS AL GAS FRENTE AL ENTORNO Y ESTAN SEPARADAS ENTRE SI MEDIANTE UNA PUERTA (12) ESTANCA AL GAS. DE ESTA FORMA PUEDEN MECANIZARSE PIEZAS DE TRABAJO (15) EN LA CAMARA DE MECANIZACION (11) POR MEDIO DE UNA HERRAMIENTA (20) CON EXTRACCION DE VIRUTAS, MIENTRAS LA PUERTA (12) ESTA CERRADA. DESPUES DE LA MECANIZACION SE IGUALAN LOS ESTADOS EN LAS DOS CAMARAS (10, 11), POR MEDIO POR EJEMPLO DE INTRODUCIR EN LA CAMARA DE MECANIZACION (11) EL MISMO GAS QUE EN LA CAMARA DE TRATAMIENTO (10). DESPUES DE ALCANZARSE UN EQUILIBRIO DE PRESION ENTRE LAS DOS CAMARAS (10, 11), SE ABRE LA PUERTA (12) POR DESPLAZAMIENTO Y SE INTRODUCEN LAS PIEZAS DE TRABAJO (15) EN LA CAMARA DE TRATAMIENTO (10).
ES97123034T 1997-01-07 1997-12-31 Dispositivo para el tratamiento superficial por plasma de piezas de trabajo. Expired - Lifetime ES2159084T3 (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE29700113 1997-01-07
DE29712960U DE29712960U1 (de) 1997-01-07 1997-07-22 Vorrichtung zur Plasma-Oberflächenbehandlung von Werkstücken

Publications (1)

Publication Number Publication Date
ES2159084T3 true ES2159084T3 (es) 2001-09-16

Family

ID=26059816

Family Applications (1)

Application Number Title Priority Date Filing Date
ES97123034T Expired - Lifetime ES2159084T3 (es) 1997-01-07 1997-12-31 Dispositivo para el tratamiento superficial por plasma de piezas de trabajo.

Country Status (3)

Country Link
US (1) US6056849A (es)
EP (1) EP0856594B1 (es)
ES (1) ES2159084T3 (es)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000057986A (ja) * 1998-08-10 2000-02-25 Hitachi Ltd イオンビーム加工装置
US6350321B1 (en) * 1998-12-08 2002-02-26 International Business Machines Corporation UHV horizontal hot wall cluster CVD/growth design
US20020195056A1 (en) * 2000-05-12 2002-12-26 Gurtej Sandhu Versatile atomic layer deposition apparatus
US6541353B1 (en) * 2000-08-31 2003-04-01 Micron Technology, Inc. Atomic layer doping apparatus and method
KR100441875B1 (ko) * 2003-06-02 2004-07-27 주성엔지니어링(주) 분리형 이송 챔버
US20080292433A1 (en) * 2007-05-11 2008-11-27 Bachrach Robert Z Batch equipment robots and methods of array to array work-piece transfer for photovoltaic factory
US20080279672A1 (en) * 2007-05-11 2008-11-13 Bachrach Robert Z Batch equipment robots and methods of stack to array work-piece transfer for photovoltaic factory
DE102019116297A1 (de) 2019-05-08 2020-11-12 Ecoclean Gmbh Behandlungssystem und Verfahren zum Behandeln von Werkstücken
JP7264469B2 (ja) * 2019-08-02 2023-04-25 株式会社フロロテクノロジー 基油拡散防止剤及びそれを含有するグリース

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2900724C2 (de) * 1979-01-10 1986-05-28 Siemens AG, 1000 Berlin und 8000 München Vorrichtung zur Beschichtung von Substraten im Vakuum
JPH0353063A (ja) * 1989-07-18 1991-03-07 Dainippon Printing Co Ltd スパッタリング装置
US5766360A (en) * 1992-03-27 1998-06-16 Kabushiki Kaisha Toshiba Substrate processing apparatus and substrate processing method
JPH0613361A (ja) * 1992-06-26 1994-01-21 Tokyo Electron Ltd 処理装置
DE4336919A1 (de) * 1993-05-12 1994-11-17 Markus Anliker Steinsäge, insbesondere für Mauerziegel
KR0149392B1 (ko) * 1994-02-28 1998-12-01 이노우에 아끼라 마그네트론 플라스마 처리 시스템
JPH07245332A (ja) * 1994-03-04 1995-09-19 Hitachi Ltd 半導体製造装置および半導体装置の製造方法ならびに半導体装置
JP3270852B2 (ja) * 1995-04-20 2002-04-02 東京エレクトロン株式会社 圧力調整装置及びこれを用いた部屋の連通方法
JP2665202B2 (ja) * 1995-05-31 1997-10-22 九州日本電気株式会社 半導体ウェハ処理装置
US5667592A (en) * 1996-04-16 1997-09-16 Gasonics International Process chamber sleeve with ring seals for isolating individual process modules in a common cluster

Also Published As

Publication number Publication date
EP0856594B1 (de) 2001-06-13
US6056849A (en) 2000-05-02
EP0856594A1 (de) 1998-08-05

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