ES2171271T3 - Metodo para añadir capas a una tarjeta de circuito impreso que produce altos niveles de adhesion del cobre al material dielectrico. - Google Patents

Metodo para añadir capas a una tarjeta de circuito impreso que produce altos niveles de adhesion del cobre al material dielectrico.

Info

Publication number
ES2171271T3
ES2171271T3 ES97940890T ES97940890T ES2171271T3 ES 2171271 T3 ES2171271 T3 ES 2171271T3 ES 97940890 T ES97940890 T ES 97940890T ES 97940890 T ES97940890 T ES 97940890T ES 2171271 T3 ES2171271 T3 ES 2171271T3
Authority
ES
Spain
Prior art keywords
dielectric
printed circuit
copper
adhesion
circuit boards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES97940890T
Other languages
English (en)
Inventor
Jay B Conrod
Van K Chiem
Paul Menkin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Enthone Inc
Original Assignee
Enthone Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Enthone Inc filed Critical Enthone Inc
Application granted granted Critical
Publication of ES2171271T3 publication Critical patent/ES2171271T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
  • Optical Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Organic Insulating Materials (AREA)

Abstract

SE EXPONE UN POLIMERO DIELECTRICO LIQUIDO FOTOSENSIBLE, PERMANENTE Y ENDURECIBLE, PARA REALIZAR PLACAS DE CIRCUITOS IMPRESOS DE COBRE QUE TENGAN AL MENOS UNA CAPA DE POLIMERO DIELECTRICO FOTOSENSIBLE QUE INCLUYA EN LA MISMA VIAS Y CIRCUITOS, CARACTERIZADA PORQUE LA CAPA POLIMERICA TIENE UNA MEJOR ADHERENCIA ENTRE EL COBRE Y EL MATERIAL DIELECTRICO. LA COMPOSICION DIELECTRICA COMPRENDE PREFERENTEMENTE UN EPOXIDO ACRILATADO Y UNA CANTIDAD EFECTIVA DE SILICE AMORFA PARA LA ADHERENCIA AL METAL. SE EXPONEN IGUALMENTE PLACAS DE CIRCUITOS IMPRESOS REALIZADAS CON EL USO DEL POLIMERO DIELECTRICO FOTODEFINIBLE Y UN PROCEDIMIENTO PARA REALIZAR LAS PLACAS DE CIRCUITOS IMPRESOS. PARA MEJORAR AUN MAS LA ADHERENCIA ENTRE EL COBRE Y EL MATERIAL DIELECTRICO SE UTILIZA TAMBIEN PREFERENTEMENTE UN PROCEDIMIENTO DE TEXTURADO DE LA SUPERFICIE DIELECTRICA POR MEDIO DE ATAQUE CON PERMANGANATO, QUE SE REALIZA DOS VECES.
ES97940890T 1996-09-17 1997-09-08 Metodo para añadir capas a una tarjeta de circuito impreso que produce altos niveles de adhesion del cobre al material dielectrico. Expired - Lifetime ES2171271T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/718,634 US5998237A (en) 1996-09-17 1996-09-17 Method for adding layers to a PWB which yields high levels of copper to dielectric adhesion

Publications (1)

Publication Number Publication Date
ES2171271T3 true ES2171271T3 (es) 2002-09-01

Family

ID=24886868

Family Applications (1)

Application Number Title Priority Date Filing Date
ES97940890T Expired - Lifetime ES2171271T3 (es) 1996-09-17 1997-09-08 Metodo para añadir capas a una tarjeta de circuito impreso que produce altos niveles de adhesion del cobre al material dielectrico.

Country Status (11)

Country Link
US (1) US5998237A (es)
EP (1) EP0947124B1 (es)
JP (1) JP2001503200A (es)
KR (1) KR100417544B1 (es)
CN (1) CN1113585C (es)
AT (1) ATE215298T1 (es)
AU (1) AU4256897A (es)
CA (1) CA2265992A1 (es)
DE (1) DE69711431T2 (es)
ES (1) ES2171271T3 (es)
WO (1) WO1998012903A1 (es)

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US6141870A (en) 1997-08-04 2000-11-07 Peter K. Trzyna Method for making electrical device
US8105690B2 (en) 1998-03-03 2012-01-31 Ppg Industries Ohio, Inc Fiber product coated with particles to adjust the friction of the coating and the interfilament bonding
US6593255B1 (en) 1998-03-03 2003-07-15 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
US6419981B1 (en) 1998-03-03 2002-07-16 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
US6949289B1 (en) 1998-03-03 2005-09-27 Ppg Industries Ohio, Inc. Impregnated glass fiber strands and products including the same
DE10015214C1 (de) * 2000-03-27 2002-03-21 Infineon Technologies Ag Verfahren zur Metallisierung eines Isolators und/oder eines Dielektrikums
TW461234B (en) * 2000-03-27 2001-10-21 Lin Hung Ming Forming method of via hole for printed circuit baseboard
FR2819144B1 (fr) * 2000-12-29 2003-06-20 Kermel Procede de fabrication d'une circuiterie a plusieurs niveaux comportant pistes et microtraversees
US8062746B2 (en) 2003-03-10 2011-11-22 Ppg Industries, Inc. Resin compatible yarn binder and uses thereof
US20040249364A1 (en) * 2003-06-03 2004-12-09 Ilya Kaploun Device and method for dispensing medication to tissue lining a body cavity
WO2006011299A1 (ja) * 2004-07-29 2006-02-02 Mitsui Mining & Smelting Co., Ltd. プリント配線基板、その製造方法および半導体装置
US7354641B2 (en) 2004-10-12 2008-04-08 Ppg Industries Ohio, Inc. Resin compatible yarn binder and uses thereof
TWI270965B (en) * 2004-10-14 2007-01-11 Advanced Semiconductor Eng Manufacturing method of passivation layer on wafer and manufacturing method of bumps on wafer
CN106102334A (zh) * 2016-06-21 2016-11-09 海弗斯（深圳）先进材料科技有限公司 一种圆极化卫星天线电路板的制作方法

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US4042729A (en) * 1972-12-13 1977-08-16 Kollmorgen Technologies Corporation Process for the activation of resinous bodies for adherent metallization
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US4054693A (en) * 1974-11-07 1977-10-18 Kollmorgen Technologies Corporation Processes for the preparation of resinous bodies for adherent metallization comprising treatment with manganate/permanganate composition
US4086128A (en) * 1976-03-04 1978-04-25 Mitsubishi Gas Chemical Company, Inc. Process for roughening surface of epoxy resin
DE2836911C2 (de) * 1978-08-23 1986-11-06 Siemens AG, 1000 Berlin und 8000 München Passivierungsschicht für Halbleiterbauelemente
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Also Published As

Publication number Publication date
EP0947124B1 (en) 2002-03-27
AU4256897A (en) 1998-04-14
EP0947124A4 (en) 1999-12-22
KR100417544B1 (ko) 2004-02-05
DE69711431D1 (de) 2002-05-02
CN1113585C (zh) 2003-07-02
ATE215298T1 (de) 2002-04-15
JP2001503200A (ja) 2001-03-06
EP0947124A1 (en) 1999-10-06
WO1998012903A1 (en) 1998-03-26
DE69711431T2 (de) 2002-11-21
HK1023030A1 (en) 2000-08-25
US5998237A (en) 1999-12-07
CA2265992A1 (en) 1998-03-26
CN1238899A (zh) 1999-12-15
KR20000036165A (ko) 2000-06-26

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