ES2172026T3 - Dispositivo de soldar/desoldar. - Google Patents

Dispositivo de soldar/desoldar.

Info

Publication number
ES2172026T3
ES2172026T3 ES97950182T ES97950182T ES2172026T3 ES 2172026 T3 ES2172026 T3 ES 2172026T3 ES 97950182 T ES97950182 T ES 97950182T ES 97950182 T ES97950182 T ES 97950182T ES 2172026 T3 ES2172026 T3 ES 2172026T3
Authority
ES
Spain
Prior art keywords
opening
welding
hot gas
nozzle
disolding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES97950182T
Other languages
English (en)
Inventor
Jurgen Straub
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Weller Tools GmbH
Original Assignee
Cooper Tools GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cooper Tools GmbH filed Critical Cooper Tools GmbH
Application granted granted Critical
Publication of ES2172026T3 publication Critical patent/ES2172026T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/018Unsoldering; Removal of melted solder or other residues
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0486Replacement and removal of components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

LA INVENCION SE REFIERE A UN DISPOSITIVO (1) PARA SOLDAR/DESOLDAR, EN PARTICULAR PARA CIRCUITOS INTEGRADOS (2) CON COMPONENTES ELECTRICOS/ELECTRONICOS (3). EL DISPOSITIVO (1) PARA SOLDAR/DESOLDAR COMPRENDE UNA BOQUILLA CALENTADORA (6) CON UN ALOJAMIENTO (5) PRACTICAMENTE EN FORMA DE CAMPANA, FORMADO CON UNA ABERTURA DE BOQUILLA INFERIOR (4). EN LA BOQUILLA DEL CALENTADOR (6) SE ENCUENTRA DISPUESTA UNA PLACA DE DISTRIBUCION DE CALOR (8), SOBRE LA QUE PUEDE ACTUAR UN GAS CALIENTE (7). ENTRE UN BORDE (9) DE LA PLACA DE DISTRIBUCION DE CALOR (8) Y EL ALOJAMIENTO (5) SE FORMA AL MENOS UNA ABERTURA PASANTE (10) PARA EL GAS CALIENTE (7) QUE FLUYE EN LA DIRECCION DE LA ABERTURA DE LA BOQUILLA. PARA PODER CONSEGUIR UNA DISTRIBUCION UNIFORME DEL CALOR PARA FINES DE SOLDADURA O DESOLDADURA, Y REDUCIR SIMULTANEAMENTE LA DESCARGA DE GAS CALIENTE (7) DESDE LA BOQUILLA DEL CALENTADOR (6), SE DISPONE AL MENOS UNA ABERTURA DE RETORNO (11) PARA EL GAS CALIENTE (7) QUE FLUYE A TRAVES DE LA ABERTURA PASANTE (10), DISPUESTA A UNA CIERTA DISTANCIA DE ESTA ULTIMA.
ES97950182T 1996-12-12 1997-11-12 Dispositivo de soldar/desoldar. Expired - Lifetime ES2172026T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE29621604U DE29621604U1 (de) 1996-12-12 1996-12-12 Löt-/Entlötvorrichtung

Publications (1)

Publication Number Publication Date
ES2172026T3 true ES2172026T3 (es) 2002-09-16

Family

ID=8033208

Family Applications (1)

Application Number Title Priority Date Filing Date
ES97950182T Expired - Lifetime ES2172026T3 (es) 1996-12-12 1997-11-12 Dispositivo de soldar/desoldar.

Country Status (7)

Country Link
US (1) US6257478B1 (es)
EP (1) EP0944453B1 (es)
JP (1) JP3442792B2 (es)
DE (2) DE29621604U1 (es)
ES (1) ES2172026T3 (es)
RU (1) RU2179098C2 (es)
WO (1) WO1998025725A1 (es)

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JP5862003B2 (ja) * 2010-10-15 2016-02-16 富士通株式会社 電子部品接合装置および電子部品接合方法
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CN110087403B (zh) * 2019-04-30 2022-01-25 苏州经贸职业技术学院 一种smt重工喷嘴
RU2770605C2 (ru) * 2020-08-18 2022-04-19 Акционерное общество "Калужский научно-исследовательский радиотехнический институт" Способ автоматизированного монтажа шариковых выводов на BGA или CSP микросхемы при реболлинге
JP7695522B2 (ja) * 2021-05-11 2025-06-19 澁谷工業株式会社 ボンディング装置
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Also Published As

Publication number Publication date
US6257478B1 (en) 2001-07-10
WO1998025725A1 (de) 1998-06-18
JP2000509905A (ja) 2000-08-02
JP3442792B2 (ja) 2003-09-02
DE29621604U1 (de) 1998-01-02
EP0944453B1 (de) 2002-03-27
DE59706801D1 (de) 2002-05-02
EP0944453A1 (de) 1999-09-29
RU2179098C2 (ru) 2002-02-10

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