ES2172026T3 - Dispositivo de soldar/desoldar. - Google Patents
Dispositivo de soldar/desoldar.Info
- Publication number
- ES2172026T3 ES2172026T3 ES97950182T ES97950182T ES2172026T3 ES 2172026 T3 ES2172026 T3 ES 2172026T3 ES 97950182 T ES97950182 T ES 97950182T ES 97950182 T ES97950182 T ES 97950182T ES 2172026 T3 ES2172026 T3 ES 2172026T3
- Authority
- ES
- Spain
- Prior art keywords
- opening
- welding
- hot gas
- nozzle
- disolding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000003466 welding Methods 0.000 title 1
- 230000004308 accommodation Effects 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/018—Unsoldering; Removal of melted solder or other residues
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0486—Replacement and removal of components
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
LA INVENCION SE REFIERE A UN DISPOSITIVO (1) PARA SOLDAR/DESOLDAR, EN PARTICULAR PARA CIRCUITOS INTEGRADOS (2) CON COMPONENTES ELECTRICOS/ELECTRONICOS (3). EL DISPOSITIVO (1) PARA SOLDAR/DESOLDAR COMPRENDE UNA BOQUILLA CALENTADORA (6) CON UN ALOJAMIENTO (5) PRACTICAMENTE EN FORMA DE CAMPANA, FORMADO CON UNA ABERTURA DE BOQUILLA INFERIOR (4). EN LA BOQUILLA DEL CALENTADOR (6) SE ENCUENTRA DISPUESTA UNA PLACA DE DISTRIBUCION DE CALOR (8), SOBRE LA QUE PUEDE ACTUAR UN GAS CALIENTE (7). ENTRE UN BORDE (9) DE LA PLACA DE DISTRIBUCION DE CALOR (8) Y EL ALOJAMIENTO (5) SE FORMA AL MENOS UNA ABERTURA PASANTE (10) PARA EL GAS CALIENTE (7) QUE FLUYE EN LA DIRECCION DE LA ABERTURA DE LA BOQUILLA. PARA PODER CONSEGUIR UNA DISTRIBUCION UNIFORME DEL CALOR PARA FINES DE SOLDADURA O DESOLDADURA, Y REDUCIR SIMULTANEAMENTE LA DESCARGA DE GAS CALIENTE (7) DESDE LA BOQUILLA DEL CALENTADOR (6), SE DISPONE AL MENOS UNA ABERTURA DE RETORNO (11) PARA EL GAS CALIENTE (7) QUE FLUYE A TRAVES DE LA ABERTURA PASANTE (10), DISPUESTA A UNA CIERTA DISTANCIA DE ESTA ULTIMA.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE29621604U DE29621604U1 (de) | 1996-12-12 | 1996-12-12 | Löt-/Entlötvorrichtung |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES2172026T3 true ES2172026T3 (es) | 2002-09-16 |
Family
ID=8033208
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES97950182T Expired - Lifetime ES2172026T3 (es) | 1996-12-12 | 1997-11-12 | Dispositivo de soldar/desoldar. |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US6257478B1 (es) |
| EP (1) | EP0944453B1 (es) |
| JP (1) | JP3442792B2 (es) |
| DE (2) | DE29621604U1 (es) |
| ES (1) | ES2172026T3 (es) |
| RU (1) | RU2179098C2 (es) |
| WO (1) | WO1998025725A1 (es) |
Families Citing this family (71)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6347734B1 (en) * | 2000-03-27 | 2002-02-19 | Emc Corporation | Methods and apparatus for installing a module on a circuit board using heating and cooling techniques |
| US6360940B1 (en) * | 2000-11-08 | 2002-03-26 | International Business Machines Corporation | Method and apparatus for removing known good die |
| US6761304B2 (en) | 2000-11-13 | 2004-07-13 | Czeslaw A. Ruszowski | Heating head for soldering and de-soldering of SMD components |
| US6845556B1 (en) * | 2002-03-20 | 2005-01-25 | Emc Corporation | Techniques for reworking circuit boards with ni/au finish |
| US20040094599A1 (en) * | 2002-11-18 | 2004-05-20 | Luebs Richard J. | Rework nozzle and method |
| US6900389B2 (en) * | 2003-01-10 | 2005-05-31 | Fci Americas Technology, Inc. | Cover for ball-grid array connector |
| US20040147169A1 (en) | 2003-01-28 | 2004-07-29 | Allison Jeffrey W. | Power connector with safety feature |
| US20040211815A1 (en) * | 2003-04-23 | 2004-10-28 | Jackson Hsieh | Apparatus for removing an image sensor from a printed circuit board |
| US6906924B2 (en) * | 2003-05-16 | 2005-06-14 | Hewlett-Packard Development Company, L.P. | Temperature-controlled rework system |
| FR2856619B1 (fr) * | 2003-06-27 | 2005-11-11 | Johnson Contr Automotive Elect | Procede de soudage par gaz chaud de broches d'interconnexion electrique sur un support |
| US6915563B2 (en) | 2003-06-27 | 2005-07-12 | International Business Machines Corporation | Apparatus for removing attached die |
| US7458839B2 (en) | 2006-02-21 | 2008-12-02 | Fci Americas Technology, Inc. | Electrical connectors having power contacts with alignment and/or restraining features |
| CN101882718B (zh) | 2003-12-31 | 2012-11-21 | Fci公司 | 电源触头及包括电源触头的连接器 |
| DE102004003521B3 (de) * | 2004-01-21 | 2005-02-17 | Siemens Ag | Reparaturlötkopf mit einem Zuführkanal für ein Wärmeübertragungsmedium und dessen Verwendung |
| DE102004034421A1 (de) * | 2004-07-15 | 2006-02-09 | Pac Tech - Packaging Technologies Gmbh | Verfahren und Vorrichtung zur wechselseitigen Kontaktierung von zwei Wafern |
| JP2008522417A (ja) * | 2004-11-29 | 2008-06-26 | ヒートロニクス・コーポレーション | 表面取り付け構成部品のための熱的脱着方法及びシステム |
| US20080156789A1 (en) * | 2004-11-29 | 2008-07-03 | Andrew Devey | Platen for use with a thermal attach and detach system which holds components by vacuum suction |
| US7476108B2 (en) | 2004-12-22 | 2009-01-13 | Fci Americas Technology, Inc. | Electrical power connectors with cooling features |
| US7384289B2 (en) * | 2005-01-31 | 2008-06-10 | Fci Americas Technology, Inc. | Surface-mount connector |
| US7303427B2 (en) * | 2005-04-05 | 2007-12-04 | Fci Americas Technology, Inc. | Electrical connector with air-circulation features |
| JP4043495B2 (ja) * | 2006-04-20 | 2008-02-06 | 株式会社カイジョー | ワーククランプ及びワイヤボンディング装置 |
| US7425145B2 (en) | 2006-05-26 | 2008-09-16 | Fci Americas Technology, Inc. | Connectors and contacts for transmitting electrical power |
| DE102006026948B3 (de) * | 2006-06-09 | 2007-12-06 | Rewatronik Gmbh | Beheizungseinrichtung |
| US7726982B2 (en) | 2006-06-15 | 2010-06-01 | Fci Americas Technology, Inc. | Electrical connectors with air-circulation features |
| US7681776B2 (en) * | 2006-08-01 | 2010-03-23 | Raytheon Company | Methods and apparatus for efficiently generating profiles for circuit board work/rework |
| US7641500B2 (en) | 2007-04-04 | 2010-01-05 | Fci Americas Technology, Inc. | Power cable connector system |
| US7905731B2 (en) | 2007-05-21 | 2011-03-15 | Fci Americas Technology, Inc. | Electrical connector with stress-distribution features |
| US7762857B2 (en) | 2007-10-01 | 2010-07-27 | Fci Americas Technology, Inc. | Power connectors with contact-retention features |
| US8096033B2 (en) * | 2007-11-05 | 2012-01-17 | Caterpillar Inc. | Remanufacture of electronic assemblies |
| US7681778B2 (en) * | 2007-11-20 | 2010-03-23 | Caterpillar Inc. | Electronic assembly remanufacturing system and method |
| US20110024484A1 (en) * | 2008-03-24 | 2011-02-03 | Vapor Works, Inc. | Vapor phase rework station and method |
| US8062051B2 (en) | 2008-07-29 | 2011-11-22 | Fci Americas Technology Llc | Electrical communication system having latching and strain relief features |
| USD610548S1 (en) | 2009-01-16 | 2010-02-23 | Fci Americas Technology, Inc. | Right-angle electrical connector |
| USD608293S1 (en) | 2009-01-16 | 2010-01-19 | Fci Americas Technology, Inc. | Vertical electrical connector |
| USD606496S1 (en) | 2009-01-16 | 2009-12-22 | Fci Americas Technology, Inc. | Right-angle electrical connector |
| USD664096S1 (en) | 2009-01-16 | 2012-07-24 | Fci Americas Technology Llc | Vertical electrical connector |
| USD640637S1 (en) | 2009-01-16 | 2011-06-28 | Fci Americas Technology Llc | Vertical electrical connector |
| USD606497S1 (en) | 2009-01-16 | 2009-12-22 | Fci Americas Technology, Inc. | Vertical electrical connector |
| USD619099S1 (en) | 2009-01-30 | 2010-07-06 | Fci Americas Technology, Inc. | Electrical connector |
| US8323049B2 (en) | 2009-01-30 | 2012-12-04 | Fci Americas Technology Llc | Electrical connector having power contacts |
| US8366485B2 (en) | 2009-03-19 | 2013-02-05 | Fci Americas Technology Llc | Electrical connector having ribbed ground plate |
| USD618180S1 (en) | 2009-04-03 | 2010-06-22 | Fci Americas Technology, Inc. | Asymmetrical electrical connector |
| USD618181S1 (en) | 2009-04-03 | 2010-06-22 | Fci Americas Technology, Inc. | Asymmetrical electrical connector |
| IT1395626B1 (it) * | 2009-09-14 | 2012-10-16 | Ecoprogetti S R L | Dispositivo per la saldatura di nastro conduttore su celle fotovoltaiche |
| US8113411B2 (en) * | 2010-03-30 | 2012-02-14 | Flextronics Ap, Llc | Universal radio frequency shield removal |
| JP5505181B2 (ja) * | 2010-08-06 | 2014-05-28 | 富士通株式会社 | 電子部品のリペア方法、電子部品のリペア装置及び伝熱プレート |
| JP5862003B2 (ja) * | 2010-10-15 | 2016-02-16 | 富士通株式会社 | 電子部品接合装置および電子部品接合方法 |
| DE102011080202A1 (de) * | 2011-08-01 | 2013-02-07 | Gebr. Schmid Gmbh | Vorrichtung und Verfahren zur Herstellung von dünnen Schichten |
| EP2624034A1 (en) | 2012-01-31 | 2013-08-07 | Fci | Dismountable optical coupling device |
| USD727268S1 (en) | 2012-04-13 | 2015-04-21 | Fci Americas Technology Llc | Vertical electrical connector |
| USD727852S1 (en) | 2012-04-13 | 2015-04-28 | Fci Americas Technology Llc | Ground shield for a right angle electrical connector |
| US9257778B2 (en) | 2012-04-13 | 2016-02-09 | Fci Americas Technology | High speed electrical connector |
| USD718253S1 (en) | 2012-04-13 | 2014-11-25 | Fci Americas Technology Llc | Electrical cable connector |
| US8944831B2 (en) | 2012-04-13 | 2015-02-03 | Fci Americas Technology Llc | Electrical connector having ribbed ground plate with engagement members |
| US8870051B2 (en) * | 2012-05-03 | 2014-10-28 | International Business Machines Corporation | Flip chip assembly apparatus employing a warpage-suppressor assembly |
| US9302277B2 (en) | 2012-06-29 | 2016-04-05 | International Business Machines Corporation | Component rework nozzle |
| US9543703B2 (en) | 2012-07-11 | 2017-01-10 | Fci Americas Technology Llc | Electrical connector with reduced stack height |
| USD751507S1 (en) | 2012-07-11 | 2016-03-15 | Fci Americas Technology Llc | Electrical connector |
| USD745852S1 (en) | 2013-01-25 | 2015-12-22 | Fci Americas Technology Llc | Electrical connector |
| USD720698S1 (en) | 2013-03-15 | 2015-01-06 | Fci Americas Technology Llc | Electrical cable connector |
| WO2016022755A2 (en) | 2014-08-06 | 2016-02-11 | Greene Lyon Group, Inc. | Rotational removal of electronic chips and other components from printed wire boards using liquid heat media |
| US10475763B2 (en) * | 2015-05-26 | 2019-11-12 | Asm Technology Singapore Pte Ltd | Die bonding apparatus comprising an inert gas environment |
| DE102015120156B4 (de) * | 2015-11-20 | 2019-07-04 | Semikron Elektronik Gmbh & Co. Kg | Vorrichtung zur materialschlüssigen Verbindung von Verbindungspartnern eines Leistungselekronik-Bauteils und Verwendung einer solchen Vorrichtung |
| WO2018081331A1 (en) | 2016-10-26 | 2018-05-03 | Milwaukee Electric Tool Corporation | Soldering tool |
| USD852596S1 (en) | 2017-10-26 | 2019-07-02 | Milwaukee Electric Tool Corporation | Soldering tool |
| RU2701976C1 (ru) * | 2018-06-18 | 2019-10-02 | Дмитрий Владимирович Григоренко | Припаивающее/отпаивающее устройство |
| CN110087403B (zh) * | 2019-04-30 | 2022-01-25 | 苏州经贸职业技术学院 | 一种smt重工喷嘴 |
| RU2770605C2 (ru) * | 2020-08-18 | 2022-04-19 | Акционерное общество "Калужский научно-исследовательский радиотехнический институт" | Способ автоматизированного монтажа шариковых выводов на BGA или CSP микросхемы при реболлинге |
| JP7695522B2 (ja) * | 2021-05-11 | 2025-06-19 | 澁谷工業株式会社 | ボンディング装置 |
| DE102021214626A1 (de) | 2021-12-17 | 2023-06-22 | Robert Bosch Gesellschaft mit beschränkter Haftung | Werkzeug und Verfahren zum Entlöten eines auf einem Schaltungsträger oberflächenmontierten Bauelements |
| US20250157979A1 (en) * | 2023-11-09 | 2025-05-15 | Electronics And Telecommunications Research Institute | Reflow flip chip bonding tool apparatus and operating method thereof |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SU578169A1 (ru) * | 1976-06-16 | 1977-10-30 | Предприятие П/Я В-8657 | Па льник дл пайки деталей с нагревом струей гор чего газа |
| US4295596A (en) * | 1979-12-19 | 1981-10-20 | Western Electric Company, Inc. | Methods and apparatus for bonding an article to a metallized substrate |
| US4444559A (en) * | 1982-06-28 | 1984-04-24 | International Business Machines Corporation | Process and apparatus for unsoldering solder bonded semiconductor devices |
| US4552300A (en) * | 1983-05-09 | 1985-11-12 | Pace, Incorporated | Method and apparatus for soldering and desoldering leadless semiconductor modules for printed wiring boards |
| EP0233018B1 (en) * | 1986-02-01 | 1991-08-07 | THE GENERAL ELECTRIC COMPANY, p.l.c. | Soldering device |
| US4858820A (en) * | 1987-02-18 | 1989-08-22 | Plato Products, Inc. | Desoldering aid and method |
| US4752025A (en) * | 1987-05-22 | 1988-06-21 | Austin American Technology | Surface mount assembly repair terminal |
| US5220147A (en) * | 1991-08-26 | 1993-06-15 | Sierra Research And Technology | Electronic component heater |
| DE9205697U1 (de) * | 1992-04-28 | 1992-09-03 | Gammelin, Jens, 6948 Wald-Michelbach | Heißluft-Lötvorrichtung für die Oberflächenmontage |
| NL9202279A (nl) * | 1992-07-29 | 1994-02-16 | Soltec Bv | Reflow-soldeermachine. |
| DE4243385A1 (de) * | 1992-12-21 | 1994-06-23 | Siemens Ag | Verfahren und Vorrichtung zum Anlöten von elektrischen Bauelementen an eine Leiterplatte |
| DE9304784U1 (de) * | 1993-03-29 | 1993-08-05 | Cooper Tools GmbH, 74354 Besigheim | Löt-/Entlötvorrichtung, insbesondere für integrierte Schaltungen |
| US5320273A (en) * | 1993-08-02 | 1994-06-14 | Ford Motor Company | Gas flow distribution system for molten solder dispensing process |
| US5419481A (en) * | 1993-09-21 | 1995-05-30 | Air-Vac Engineering Company, Inc. | Process and apparatus for attaching/deataching land grid array components |
| DE4401790C1 (de) * | 1994-01-21 | 1995-04-06 | Smt Maschinengesellschaft Mbh | Vorrichtung zur Erzeugung einer Gasströmung in einer Lötanlage |
| DE4422341C2 (de) * | 1994-06-27 | 1997-03-06 | Martin Umwelt & Energietech | Löteinrichtung |
| US5862588A (en) * | 1995-08-14 | 1999-01-26 | International Business Machines Corporation | Method for restraining circuit board warp during area array rework |
| US5560531A (en) * | 1994-12-14 | 1996-10-01 | O.K. Industries, Inc. | Reflow minioven for electrical component |
| US5603857A (en) * | 1995-02-24 | 1997-02-18 | Assembly Technologies International, Inc. | Handheld electric heater for removing or replacing surface-mounted integrated circuits from a circuit board |
| US5814789A (en) * | 1996-07-18 | 1998-09-29 | Btu International, Inc. | Forced convection furnance gas plenum |
-
1996
- 1996-12-12 DE DE29621604U patent/DE29621604U1/de not_active Expired - Lifetime
-
1997
- 1997-11-12 RU RU99114598/02A patent/RU2179098C2/ru not_active IP Right Cessation
- 1997-11-12 EP EP97950182A patent/EP0944453B1/de not_active Expired - Lifetime
- 1997-11-12 WO PCT/EP1997/006317 patent/WO1998025725A1/de not_active Ceased
- 1997-11-12 US US09/319,584 patent/US6257478B1/en not_active Expired - Lifetime
- 1997-11-12 JP JP52613198A patent/JP3442792B2/ja not_active Expired - Fee Related
- 1997-11-12 DE DE59706801T patent/DE59706801D1/de not_active Expired - Lifetime
- 1997-11-12 ES ES97950182T patent/ES2172026T3/es not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| US6257478B1 (en) | 2001-07-10 |
| WO1998025725A1 (de) | 1998-06-18 |
| JP2000509905A (ja) | 2000-08-02 |
| JP3442792B2 (ja) | 2003-09-02 |
| DE29621604U1 (de) | 1998-01-02 |
| EP0944453B1 (de) | 2002-03-27 |
| DE59706801D1 (de) | 2002-05-02 |
| EP0944453A1 (de) | 1999-09-29 |
| RU2179098C2 (ru) | 2002-02-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FG2A | Definitive protection |
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