ES2188541T3 - Procedimiento de fabricacion de tarjetas chip de contacto con dielectrico de bajo coste. - Google Patents

Procedimiento de fabricacion de tarjetas chip de contacto con dielectrico de bajo coste.

Info

Publication number
ES2188541T3
ES2188541T3 ES00927328T ES00927328T ES2188541T3 ES 2188541 T3 ES2188541 T3 ES 2188541T3 ES 00927328 T ES00927328 T ES 00927328T ES 00927328 T ES00927328 T ES 00927328T ES 2188541 T3 ES2188541 T3 ES 2188541T3
Authority
ES
Spain
Prior art keywords
contact
support film
dielectric support
fields
grid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES00927328T
Other languages
English (en)
Inventor
Lucille Dossetto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gemplus SA
Original Assignee
Gemplus Card International SA
Gemplus SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemplus Card International SA, Gemplus SA filed Critical Gemplus Card International SA
Application granted granted Critical
Publication of ES2188541T3 publication Critical patent/ES2188541T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Manufacture Of Switches (AREA)
  • Ceramic Capacitors (AREA)
  • Wire Bonding (AREA)

Abstract

Procedimiento de fabricación de un módulo electrónico (100) de contacto destinado a un dispositivo electrónico portátil, tal como por ejemplo una tarjeta chip; este procedimiento prevé: obtener una rejilla metálica (18) con una cara externa y una cara interna, la rejilla metálica (18) está equipada de campos de contacto (19a), así como campos de conexión (19b) a un chip (10); laminar un film soporte dieléctrico (60) en banda en la cara externa de la rejilla metálica (18) dejando los campos de contacto (19a) libres; pegar el chip (10) y conectarlo a los campos de conexión (19b) de la rejilla (18); recortar el módulo (100); y depositar en la cara interna de la rejilla (18) un adhesivo (25) reactivable; caracterizado porque comprende las siguientes etapas: ¿ suministro de un film soporte dieléctrico (60) que se elige de bajo coste; ¿ realización de una zona mediana de combadura (80) en la rejilla metálica (18) entre los campos de contacto (19a); seguidamente ¿ fijación inamovible del film soporte dieléctrico (60) en la cara externa de la combadura (80), de manera a encajar por lo menos parcialmente la marcha del espesor del film soporte dieléctrico (60) y obtener un módulo (100) prácticamente plano del lado de la cara externa, lo que compensa la pérdida de rigidez mecánica.
ES00927328T 1999-05-25 2000-05-11 Procedimiento de fabricacion de tarjetas chip de contacto con dielectrico de bajo coste. Expired - Lifetime ES2188541T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9906584A FR2794265B1 (fr) 1999-05-25 1999-05-25 Procede de fabrication de cartes a puce a contact avec dielectrique bas cout

Publications (1)

Publication Number Publication Date
ES2188541T3 true ES2188541T3 (es) 2003-07-01

Family

ID=9545962

Family Applications (1)

Application Number Title Priority Date Filing Date
ES00927328T Expired - Lifetime ES2188541T3 (es) 1999-05-25 2000-05-11 Procedimiento de fabricacion de tarjetas chip de contacto con dielectrico de bajo coste.

Country Status (9)

Country Link
US (1) US6617672B1 (es)
EP (1) EP1190379B1 (es)
CN (1) CN1351732A (es)
AT (1) ATE229205T1 (es)
AU (1) AU4575400A (es)
DE (1) DE60000941T2 (es)
ES (1) ES2188541T3 (es)
FR (1) FR2794265B1 (es)
WO (1) WO2000072253A1 (es)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004044834A1 (en) * 2002-11-12 2004-05-27 Koninklijke Philips Electronics N.V. Data carrier with a module with a reinforcement strip
EP2447886A1 (fr) * 2010-10-07 2012-05-02 Gemalto SA Module électronique sécurisé, dispositif à module électronique sécurisé et procédé de fabrication
CN103473593B (zh) * 2012-06-05 2018-10-19 德昌电机(深圳)有限公司 智能卡、智能卡接触垫载板及其制造方法
EP4371033A1 (en) * 2021-07-15 2024-05-22 Linxens Holding Lead-frame, card body of a smart card, smart card, and method of forming a smart card

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4222516A (en) * 1975-12-31 1980-09-16 Compagnie Internationale Pour L'informatique Cii-Honeywell Bull Standardized information card
NL191959B (nl) * 1981-03-24 1996-07-01 Gao Ges Automation Org Identificatiekaart met IC-bouwsteen en dragerelement voor een IC-bouwsteen.
JPH074995B2 (ja) * 1986-05-20 1995-01-25 株式会社東芝 Ｉｃカ−ド及びその製造方法
JPH01108095A (ja) * 1987-10-20 1989-04-25 Ryoden Kasei Co Ltd Ｉｃカード
FR2632100B1 (fr) 1988-05-25 1992-02-21 Schlumberger Ind Sa Procede de realisation d'une carte a memoire electronique et cartes a memoire electronique obtenue par la mise en oeuvre dudit procede
EP0688050A1 (fr) * 1994-06-15 1995-12-20 Philips Cartes Et Systemes Procédé d'assemblage de carte à circuit intégré et carte ainsi obtenue
FR2733553B1 (fr) * 1995-04-25 1997-07-11 Pem Sa Protection Electrolytiq Dispositif de contre-collage pour la solidarisation d'une bande metallique et d'une bande de materiau isolant
FR2741191B1 (fr) * 1995-11-14 1998-01-09 Sgs Thomson Microelectronics Procede de fabrication d'un micromodule, notamment pour cartes a puces
JPH09327990A (ja) * 1996-06-11 1997-12-22 Toshiba Corp カード型記憶装置

Also Published As

Publication number Publication date
FR2794265B1 (fr) 2003-09-19
EP1190379A1 (fr) 2002-03-27
FR2794265A1 (fr) 2000-12-01
US6617672B1 (en) 2003-09-09
CN1351732A (zh) 2002-05-29
AU4575400A (en) 2000-12-12
DE60000941T2 (de) 2003-09-04
EP1190379B1 (fr) 2002-12-04
WO2000072253A1 (fr) 2000-11-30
DE60000941D1 (de) 2003-01-16
ATE229205T1 (de) 2002-12-15

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