ES2224507T3 - Procedimiento para la metalizacion de una superficie de plastico. - Google Patents

Procedimiento para la metalizacion de una superficie de plastico.

Info

Publication number: ES2224507T3
Authority: ES; Spain
Prior art keywords: solution; salt; treatment; corrosive; plastic
Prior art date: 1998-11-13
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Lifetime

Application number

ES99115967T

Other languages

English (en)

Spanish (es)

Inventor

Leonas Naruskevicius

Jonas Vinkevivicius

Grigorijus Rozovskis

Mykolas Baranauskas

Andreas Prof. Dr. Mibius

Peter Pies

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

LPW Chemie GmbH

Original Assignee

LPW Chemie GmbH

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1998-11-13

Filing date

1999-08-13

Publication date

2005-03-01

1998-11-13 Priority claimed from LT98-161A external-priority patent/LT4713B/lt

1999-02-04 Priority claimed from DE1999104665 external-priority patent/DE19904665A1/de

1999-08-13 Application filed by LPW Chemie GmbH filed Critical LPW Chemie GmbH

2005-03-01 Application granted granted Critical

2005-03-01 Publication of ES2224507T3 publication Critical patent/ES2224507T3/es

2019-08-13 Anticipated expiration legal-status Critical

Status Expired - Lifetime legal-status Critical Current

Links

239000004033 plastic Substances 0.000 title claims abstract description 110
229920003023 plastic Polymers 0.000 title claims abstract description 110
238000001465 metallisation Methods 0.000 title claims abstract description 20
238000000034 method Methods 0.000 title claims description 71
239000000243 solution Substances 0.000 claims abstract description 92
229910052751 metal Inorganic materials 0.000 claims abstract description 40
239000002184 metal Substances 0.000 claims abstract description 40
239000012266 salt solution Substances 0.000 claims abstract description 37
UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 claims abstract description 26
150000003839 salts Chemical class 0.000 claims abstract description 13
GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims abstract description 7
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical group [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 28
239000012670 alkaline solution Substances 0.000 claims description 14
229910052759 nickel Inorganic materials 0.000 claims description 14
239000007800 oxidant agent Substances 0.000 claims description 13
QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 10
NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 10
239000002253 acid Substances 0.000 claims description 10
150000001868 cobalt Chemical class 0.000 claims description 8
QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 7
229910017052 cobalt Inorganic materials 0.000 claims description 6
239000010941 cobalt Substances 0.000 claims description 6
238000001035 drying Methods 0.000 claims description 6
229910000147 aluminium phosphate Inorganic materials 0.000 claims description 5
229910021529 ammonia Inorganic materials 0.000 claims description 5
XLJKHNWPARRRJB-UHFFFAOYSA-N cobalt(2+) Chemical class [Co+2] XLJKHNWPARRRJB-UHFFFAOYSA-N 0.000 claims description 5
ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical class [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
229910021626 Tin(II) chloride Inorganic materials 0.000 claims description 3
230000002378 acidificating effect Effects 0.000 claims description 3
229910052977 alkali metal sulfide Inorganic materials 0.000 claims description 3
150000001412 amines Chemical class 0.000 claims description 3
239000007864 aqueous solution Substances 0.000 claims description 3
229910000001 cobalt(II) carbonate Inorganic materials 0.000 claims description 3
GGCZERPQGJTIQP-UHFFFAOYSA-N sodium;9,10-dioxoanthracene-2-sulfonic acid Chemical compound [Na+].C1=CC=C2C(=O)C3=CC(S(=O)(=O)O)=CC=C3C(=O)C2=C1 GGCZERPQGJTIQP-UHFFFAOYSA-N 0.000 claims description 2
238000005554 pickling Methods 0.000 abstract 2
BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract 1
LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 abstract 1
231100001010 corrosive Toxicity 0.000 description 49
HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 40
230000007797 corrosion Effects 0.000 description 26
238000005260 corrosion Methods 0.000 description 26
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 26
235000011121 sodium hydroxide Nutrition 0.000 description 13
239000012153 distilled water Substances 0.000 description 8
239000003792 electrolyte Substances 0.000 description 8
239000004417 polycarbonate Substances 0.000 description 8
239000012286 potassium permanganate Substances 0.000 description 8
238000007654 immersion Methods 0.000 description 7
239000000126 substance Substances 0.000 description 7
KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 5
229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 5
KTVIXTQDYHMGHF-UHFFFAOYSA-L cobalt(2+) sulfate Chemical compound [Co+2].[O-]S([O-])(=O)=O KTVIXTQDYHMGHF-UHFFFAOYSA-L 0.000 description 5
239000000203 mixture Substances 0.000 description 5
GRVFOGOEDUUMBP-UHFFFAOYSA-N sodium sulfide (anhydrous) Chemical compound [Na+].[Na+].[S-2] GRVFOGOEDUUMBP-UHFFFAOYSA-N 0.000 description 5
239000004793 Polystyrene Substances 0.000 description 4
CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 4
238000007747 plating Methods 0.000 description 4
-1 polypropylene Polymers 0.000 description 4
229920002223 polystyrene Polymers 0.000 description 4
239000011148 porous material Substances 0.000 description 4
239000011734 sodium Substances 0.000 description 4
230000037303 wrinkles Effects 0.000 description 4
HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 3
QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
239000004743 Polypropylene Substances 0.000 description 3
NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 3
230000004913 activation Effects 0.000 description 3
KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 3
AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 3
229910052763 palladium Inorganic materials 0.000 description 3
KHIWWQKSHDUIBK-UHFFFAOYSA-N periodic acid Chemical compound OI(=O)(=O)=O KHIWWQKSHDUIBK-UHFFFAOYSA-N 0.000 description 3
150000002978 peroxides Chemical class 0.000 description 3
229920000515 polycarbonate Polymers 0.000 description 3
229910052979 sodium sulfide Inorganic materials 0.000 description 3
239000011593 sulfur Substances 0.000 description 3
229910052717 sulfur Inorganic materials 0.000 description 3
LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
229930040373 Paraformaldehyde Natural products 0.000 description 2
GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 2
229910052783 alkali metal Inorganic materials 0.000 description 2
150000001340 alkali metals Chemical class 0.000 description 2
230000015572 biosynthetic process Effects 0.000 description 2
238000000576 coating method Methods 0.000 description 2
230000006835 compression Effects 0.000 description 2
238000007906 compression Methods 0.000 description 2
150000001879 copper Chemical class 0.000 description 2
OMZSGWSJDCOLKM-UHFFFAOYSA-N copper(II) sulfide Chemical compound [S-2].[Cu+2] OMZSGWSJDCOLKM-UHFFFAOYSA-N 0.000 description 2
150000002009 diols Chemical class 0.000 description 2
238000004519 manufacturing process Methods 0.000 description 2
239000012528 membrane Substances 0.000 description 2
150000002739 metals Chemical class 0.000 description 2
JRKICGRDRMAZLK-UHFFFAOYSA-L peroxydisulfate Chemical compound [O-]S(=O)(=O)OOS([O-])(=O)=O JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 description 2
229920005862 polyol Polymers 0.000 description 2
150000003077 polyols Chemical class 0.000 description 2
229920006324 polyoxymethylene Polymers 0.000 description 2
229920001155 polypropylene Polymers 0.000 description 2
229920001021 polysulfide Polymers 0.000 description 2
239000005077 polysulfide Substances 0.000 description 2
150000008117 polysulfides Polymers 0.000 description 2
230000035939 shock Effects 0.000 description 2
RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 2
235000012239 silicon dioxide Nutrition 0.000 description 2
229910000029 sodium carbonate Inorganic materials 0.000 description 2
238000003756 stirring Methods 0.000 description 2
238000004381 surface treatment Methods 0.000 description 2
239000004094 surface-active agent Substances 0.000 description 2
229910021583 Cobalt(III) fluoride Inorganic materials 0.000 description 1
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
BWGNESOTFCXPMA-UHFFFAOYSA-N Dihydrogen disulfide Chemical compound SS BWGNESOTFCXPMA-UHFFFAOYSA-N 0.000 description 1
UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
239000004696 Poly ether ether ketone Substances 0.000 description 1
QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
229910052782 aluminium Inorganic materials 0.000 description 1
XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
UYJXRRSPUVSSMN-UHFFFAOYSA-P ammonium sulfide Chemical compound [NH4+].[NH4+].[S-2] UYJXRRSPUVSSMN-UHFFFAOYSA-P 0.000 description 1
239000011260 aqueous acid Substances 0.000 description 1
238000007664 blowing Methods 0.000 description 1
NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 1
239000003518 caustics Substances 0.000 description 1
239000003795 chemical substances by application Substances 0.000 description 1
GRWVQDDAKZFPFI-UHFFFAOYSA-H chromium(III) sulfate Chemical compound [Cr+3].[Cr+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O GRWVQDDAKZFPFI-UHFFFAOYSA-H 0.000 description 1
239000011248 coating agent Substances 0.000 description 1
GVPFVAHMJGGAJG-UHFFFAOYSA-L cobalt dichloride Chemical compound [Cl-].[Cl-].[Co+2] GVPFVAHMJGGAJG-UHFFFAOYSA-L 0.000 description 1
JAWGVVJVYSANRY-UHFFFAOYSA-N cobalt(3+) Chemical compound [Co+3] JAWGVVJVYSANRY-UHFFFAOYSA-N 0.000 description 1
229910000335 cobalt(II) sulfate Inorganic materials 0.000 description 1
WZJQNLGQTOCWDS-UHFFFAOYSA-K cobalt(iii) fluoride Chemical compound F[Co](F)F WZJQNLGQTOCWDS-UHFFFAOYSA-K 0.000 description 1
239000000084 colloidal system Substances 0.000 description 1
230000000052 comparative effect Effects 0.000 description 1
239000004020 conductor Substances 0.000 description 1
150000004696 coordination complex Chemical class 0.000 description 1
229910052802 copper Inorganic materials 0.000 description 1
239000010949 copper Substances 0.000 description 1
229910001431 copper ion Inorganic materials 0.000 description 1
238000000151 deposition Methods 0.000 description 1
230000008021 deposition Effects 0.000 description 1
238000009792 diffusion process Methods 0.000 description 1
VDQVEACBQKUUSU-UHFFFAOYSA-M disodium;sulfanide Chemical compound [Na+].[Na+].[SH-] VDQVEACBQKUUSU-UHFFFAOYSA-M 0.000 description 1
238000007772 electroless plating Methods 0.000 description 1
238000009713 electroplating Methods 0.000 description 1
239000000839 emulsion Substances 0.000 description 1
JEGUKCSWCFPDGT-UHFFFAOYSA-N h2o hydrate Chemical compound O.O JEGUKCSWCFPDGT-UHFFFAOYSA-N 0.000 description 1
238000010438 heat treatment Methods 0.000 description 1
229910052739 hydrogen Inorganic materials 0.000 description 1
239000001257 hydrogen Substances 0.000 description 1
WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
150000002500 ions Chemical class 0.000 description 1
239000000463 material Substances 0.000 description 1
229910021645 metal ion Inorganic materials 0.000 description 1
229910052976 metal sulfide Inorganic materials 0.000 description 1
TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
230000035515 penetration Effects 0.000 description 1
125000005385 peroxodisulfate group Chemical group 0.000 description 1
238000009832 plasma treatment Methods 0.000 description 1
229920002530 polyetherether ketone Polymers 0.000 description 1
238000002360 preparation method Methods 0.000 description 1
230000001681 protective effect Effects 0.000 description 1
238000007086 side reaction Methods 0.000 description 1
239000007787 solid Substances 0.000 description 1
230000006641 stabilisation Effects 0.000 description 1
238000011105 stabilization Methods 0.000 description 1
235000011149 sulphuric acid Nutrition 0.000 description 1
238000005406 washing Methods 0.000 description 1
238000009736 wetting Methods 0.000 description 1
239000008096 xylene Substances 0.000 description 1

Classifications

- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/1658—Process features with two steps starting with metal deposition followed by addition of reducing agent
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Chemical Kinetics & Catalysis (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Mechanical Engineering (AREA)
General Chemical & Material Sciences (AREA)
Electrochemistry (AREA)
Inorganic Chemistry (AREA)
Chemically Coating (AREA)
Treatments Of Macromolecular Shaped Articles (AREA)

ES99115967T 1998-11-13 1999-08-13 Procedimiento para la metalizacion de una superficie de plastico. Expired - Lifetime ES2224507T3 (es)

Applications Claiming Priority (4)

Application Number	Priority Date	Filing Date	Title
LT9800161		1998-11-13
LT98-161A LT4713B (lt)	1998-11-13	1998-11-13	Elektrai laidžių dangų ant dielektriko paviršiaus gavimo būdas
DE19904665		1999-02-04
DE1999104665 DE19904665A1 (de)	1999-02-04	1999-02-04	Verfahren zur Metallisierung einer Kunststoffoberfläche

Publications (1)

Publication Number	Publication Date
ES2224507T3 true ES2224507T3 (es)	2005-03-01

Family

ID=26051688

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
ES99115967T Expired - Lifetime ES2224507T3 (es)	1998-11-13	1999-08-13	Procedimiento para la metalizacion de una superficie de plastico.

Country Status (5)

Country	Link
EP (1)	EP1001052B1 (de)
KR (1)	KR20010086023A (de)
AT (1)	ATE266107T1 (de)
DE (1)	DE59909392D1 (de)
ES (1)	ES2224507T3 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE10138446A1 (de) *	2001-08-04	2003-02-13	Enthone Omi Deutschland Gmbh	Verfahren zur Metallisierung von Kunststoffoberflächen
DE102004026489B3 (de) *	2004-05-27	2005-09-29	Enthone Inc., West Haven	Verfahren zur Metallisierung von Kunststoffoberflächen
EP2025708B1 (de) *	2007-08-10	2009-10-14	Enthone Inc.	Chromfreie Beize für Kunststoffoberflächen
CN101255585B (zh) *	2007-12-05	2010-06-09	天津大学	碳纤维增强环氧树脂复合材料的新型表面金属化方法
EP2639333A1 (de)	2012-03-15	2013-09-18	Atotech Deutschland GmbH	Verfahren zum Metallisieren nichtleitender Kunststoffoberflächen
EP2639334A1 (de)	2012-03-15	2013-09-18	Atotech Deutschland GmbH	Verfahren zum Metallisieren nichtleitender Kunststoffoberflächen
EP2639332A1 (de)	2012-03-15	2013-09-18	Atotech Deutschland GmbH	Verfahren zum Metallisieren nichtleitender Kunststoffoberflächen
EP2767614A1 (de)	2013-02-13	2014-08-20	ATOTECH Deutschland GmbH	Verfahren zum Abscheiden einer ersten Metallschicht auf nicht leitfähigen Polymeren
EP3327175B1 (de) *	2013-10-22	2019-12-18	Okuno Chemical Industries Co., Ltd.	Zusammensetzung zur ätzbehandlung eines harzmaterials
PT3660189T (pt)	2014-04-01	2024-02-14	Atotech Deutschland Gmbh & Co Kg	Composição e processo para metalizar superfícies plásticas não condutoras
EP3034650B1 (de)	2014-12-16	2017-06-21	ATOTECH Deutschland GmbH	Plattierungsbadzusammensetzungen zur stromlosen Abscheidung von Metallen und Metalllegierungen
DE102015204912A1 (de) *	2015-03-18	2016-09-22	Coventya Gmbh	Verfahren zur selektiven Metallisierung von Butadien-haltigen Kunststoffbereichen in einem Bauteil und Kit zur Durchführung des Verfahrens
EP3181726A1 (de)	2015-12-18	2017-06-21	ATOTECH Deutschland GmbH	Ätzlösung zur behandlung nichtleitenden kunststoffoberflächen und verfahren zum ätzen nichtleitender kunststoffoberflächen
TWI713737B (zh)	2016-05-04	2020-12-21	德商德國艾托特克公司	沉積金屬或金屬合金至基板表面及包含基板表面活化之方法
EP3578683B1 (de)	2018-06-08	2021-02-24	ATOTECH Deutschland GmbH	Stromloses kupfer- oder kupferlegierungsplattierungsbad und verfahren zur plattierung
US20240068105A1 (en) *	2020-12-18	2024-02-29	Atotech Deutschland GmbH & Co. KG	Method for etching at least one surface of a plastic substrate
DE102023114956A1 (de)	2023-06-07	2024-12-12	Dr. Hesse GmbH & Cie. KG	Verfahren zum Beizen nichtleitender Kunststoffe
DE202023103135U1 (de)	2023-06-07	2023-06-14	Dr. Hesse GmbH & Cie. KG	Oberfläche aus nichtleitendem Kunststoff
CN117004073A (zh) *	2023-08-21	2023-11-07	四川华丰科技股份有限公司	高效塑料光接枝处理方法以及塑料金属化方法
DE202023107029U1 (de)	2023-11-28	2024-01-10	Dr. Hesse GmbH & Cie. KG	Gegenstand mit einer gebeizten Oberfläche aus einem nichtleitenden Kunststoff

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE3708214A1 (de) *	1987-03-12	1988-09-22	Schering Ag	Verfahren zur haftfesten metallisierung von kunststoffen
US4873136A (en) *	1988-06-16	1989-10-10	General Electric Company	Method for preparing polymer surfaces for subsequent plating thereon, and improved metal-plated plastic articles made therefrom
US4919768A (en) *	1989-09-22	1990-04-24	Shipley Company Inc.	Electroplating process

1999
- 1999-08-13 AT AT99115967T patent/ATE266107T1/de not_active IP Right Cessation
- 1999-08-13 EP EP99115967A patent/EP1001052B1/de not_active Expired - Lifetime
- 1999-08-13 DE DE59909392T patent/DE59909392D1/de not_active Expired - Lifetime
- 1999-08-13 ES ES99115967T patent/ES2224507T3/es not_active Expired - Lifetime
- 1999-11-05 KR KR1020017006001A patent/KR20010086023A/ko not_active Withdrawn

Also Published As

Publication number	Publication date
EP1001052A3 (de)	2002-11-13
EP1001052B1 (de)	2004-05-06
KR20010086023A (ko)	2001-09-07
EP1001052A2 (de)	2000-05-17
DE59909392D1 (de)	2004-06-09
ATE266107T1 (de)	2004-05-15

Publication	Publication Date	Title
ES2224507T3 (es)	2005-03-01	Procedimiento para la metalizacion de una superficie de plastico.
WO2000029646A1 (en)	2000-05-25	Process for metallizing a plastic surface
US3664933A (en)	1972-05-23	Process for acid copper plating of zinc
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JP6877650B2 (ja)	2021-05-26	電極触媒の製造方法
KR100188481B1 (ko)	1999-06-15	유전기질과 도금기질을 직접 전기도금 하는 방법
KR100684821B1 (ko)	2007-02-20	플라스틱 표면의 금속화 방법
JP2002530529A5 (de)	2006-02-09
US4520046A (en)	1985-05-28	Metal plating on plastics
JP2009504923A (ja)	2009-02-05	マグネシウム基板の電気めっき前処理
KR19980070173A (ko)	1998-10-26	전기 니켈 도금욕 또는 전기 니켈합금 도금욕 및 그것을 사용하는 도금방법
CN110139946B (zh)	2021-09-14	塑料上的无铬镀覆蚀刻
KR970070248A (ko)	1997-11-07	니켈 도금 단계와 니켈 제거 단계를 포함하는 타입의, 금속의 연속 주조용 주형 요소의 구리 또는 구리-합금 외부 표면의 상태조절 방법
JPS61253383A (ja)	1986-11-11	黒色被膜形成方法
JP2003183881A (ja)	2003-07-03	複合接着性促進および直接金属化法
KR930006103B1 (ko)	1993-07-07	인쇄회로용 전해동박 및 그 제조방법
KR100402730B1 (ko)	2003-10-22	마그네슘합금에 동-니켈 도금층을 전해 도금으로 형성하는방법
US4948674A (en)	1990-08-14	Method of applying a metal layer of large adhesive strength on enamels
US3689380A (en)	1972-09-05	Process for acid copper plating of steel
TWI275668B (en)	2007-03-11	Electroplating method
JPH05287583A (ja)	1993-11-02	非導電性材料表面に電気メッキ層を直接形成する方法
CN101255584A (zh)	2008-09-03	塑料表面镀敷金属的方法
GB2603003A (en)	2022-07-27	Method of etching a plastic component
KR19990046446A (ko)	1999-07-05	퍼포레이티드패널의제조방법
JP2013504685A (ja)	2013-02-07	ブリスター形成の減少させた傾向を有する亜鉛ダイカストの電気銅メッキのための方法