ES2224507T3 - Procedimiento para la metalizacion de una superficie de plastico. - Google Patents

Procedimiento para la metalizacion de una superficie de plastico.

Info

Publication number
ES2224507T3
ES2224507T3 ES99115967T ES99115967T ES2224507T3 ES 2224507 T3 ES2224507 T3 ES 2224507T3 ES 99115967 T ES99115967 T ES 99115967T ES 99115967 T ES99115967 T ES 99115967T ES 2224507 T3 ES2224507 T3 ES 2224507T3
Authority
ES
Spain
Prior art keywords
solution
salt
treatment
corrosive
plastic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES99115967T
Other languages
English (en)
Spanish (es)
Inventor
Leonas Naruskevicius
Jonas Vinkevivicius
Grigorijus Rozovskis
Mykolas Baranauskas
Andreas Prof. Dr. Mibius
Peter Pies
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LPW Chemie GmbH
Original Assignee
LPW Chemie GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from LT98-161A external-priority patent/LT4713B/lt
Priority claimed from DE1999104665 external-priority patent/DE19904665A1/de
Application filed by LPW Chemie GmbH filed Critical LPW Chemie GmbH
Application granted granted Critical
Publication of ES2224507T3 publication Critical patent/ES2224507T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54Electroplating of non-metallic surfaces
    • C25D5/56Electroplating of non-metallic surfaces of plastics
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1646Characteristics of the product obtained
    • C23C18/165Multilayered product
    • C23C18/1653Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1655Process features
    • C23C18/1658Process features with two steps starting with metal deposition followed by addition of reducing agent
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073Multistep pretreatment
    • C23C18/2086Multistep pretreatment with use of organic or inorganic compounds other than metals, first

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
ES99115967T 1998-11-13 1999-08-13 Procedimiento para la metalizacion de una superficie de plastico. Expired - Lifetime ES2224507T3 (es)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
LT98-161A LT4713B (lt) 1998-11-13 1998-11-13 Elektrai laidžių dangų ant dielektriko paviršiaus gavimo būdas
LT9800161 1998-11-13
DE1999104665 DE19904665A1 (de) 1999-02-04 1999-02-04 Verfahren zur Metallisierung einer Kunststoffoberfläche
DE19904665 1999-02-04

Publications (1)

Publication Number Publication Date
ES2224507T3 true ES2224507T3 (es) 2005-03-01

Family

ID=26051688

Family Applications (1)

Application Number Title Priority Date Filing Date
ES99115967T Expired - Lifetime ES2224507T3 (es) 1998-11-13 1999-08-13 Procedimiento para la metalizacion de una superficie de plastico.

Country Status (5)

Country Link
EP (1) EP1001052B1 (de)
KR (1) KR20010086023A (de)
AT (1) ATE266107T1 (de)
DE (1) DE59909392D1 (de)
ES (1) ES2224507T3 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10138446A1 (de) * 2001-08-04 2003-02-13 Enthone Omi Deutschland Gmbh Verfahren zur Metallisierung von Kunststoffoberflächen
DE102004026489B3 (de) * 2004-05-27 2005-09-29 Enthone Inc., West Haven Verfahren zur Metallisierung von Kunststoffoberflächen
DE502007001745D1 (de) * 2007-08-10 2009-11-26 Enthone Chromfreie Beize für Kunststoffoberflächen
CN101255585B (zh) * 2007-12-05 2010-06-09 天津大学 碳纤维增强环氧树脂复合材料的新型表面金属化方法
EP2639334A1 (de) 2012-03-15 2013-09-18 Atotech Deutschland GmbH Verfahren zum Metallisieren nichtleitender Kunststoffoberflächen
EP2639333A1 (de) 2012-03-15 2013-09-18 Atotech Deutschland GmbH Verfahren zum Metallisieren nichtleitender Kunststoffoberflächen
EP2639332A1 (de) * 2012-03-15 2013-09-18 Atotech Deutschland GmbH Verfahren zum Metallisieren nichtleitender Kunststoffoberflächen
EP2767614A1 (de) 2013-02-13 2014-08-20 ATOTECH Deutschland GmbH Verfahren zum Abscheiden einer ersten Metallschicht auf nicht leitfähigen Polymeren
BR112015016031A2 (pt) 2013-10-22 2017-07-11 Okuno Chem Ind Co composição para tratamento de decapagem de material de resina
US10174250B2 (en) 2014-04-01 2019-01-08 Atotech Deutschland Gmbh Composition and process for metallizing nonconductive plastic surfaces
EP3034650B1 (de) 2014-12-16 2017-06-21 ATOTECH Deutschland GmbH Plattierungsbadzusammensetzungen zur stromlosen Abscheidung von Metallen und Metalllegierungen
DE102015204912A1 (de) * 2015-03-18 2016-09-22 Coventya Gmbh Verfahren zur selektiven Metallisierung von Butadien-haltigen Kunststoffbereichen in einem Bauteil und Kit zur Durchführung des Verfahrens
EP3181726A1 (de) 2015-12-18 2017-06-21 ATOTECH Deutschland GmbH Ätzlösung zur behandlung nichtleitenden kunststoffoberflächen und verfahren zum ätzen nichtleitender kunststoffoberflächen
CN109072438B (zh) 2016-05-04 2021-08-13 德国艾托特克公司 沉积金属或金属合金到衬底表面及包括衬底表面活化的方法
EP3578683B1 (de) 2018-06-08 2021-02-24 ATOTECH Deutschland GmbH Stromloses kupfer- oder kupferlegierungsplattierungsbad und verfahren zur plattierung
JP2023553744A (ja) * 2020-12-18 2023-12-25 アトテック ドイチェランド ゲーエムベーハー ウント コ カーゲー プラスチック基材の少なくとも1つの表面をエッチングする方法
DE102023114956A1 (de) 2023-06-07 2024-12-12 Dr. Hesse GmbH & Cie. KG Verfahren zum Beizen nichtleitender Kunststoffe
DE202023103135U1 (de) 2023-06-07 2023-06-14 Dr. Hesse GmbH & Cie. KG Oberfläche aus nichtleitendem Kunststoff
CN117004073A (zh) * 2023-08-21 2023-11-07 四川华丰科技股份有限公司 高效塑料光接枝处理方法以及塑料金属化方法
DE202023107029U1 (de) 2023-11-28 2024-01-10 Dr. Hesse GmbH & Cie. KG Gegenstand mit einer gebeizten Oberfläche aus einem nichtleitenden Kunststoff

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3708214A1 (de) * 1987-03-12 1988-09-22 Schering Ag Verfahren zur haftfesten metallisierung von kunststoffen
US4873136A (en) * 1988-06-16 1989-10-10 General Electric Company Method for preparing polymer surfaces for subsequent plating thereon, and improved metal-plated plastic articles made therefrom
US4919768A (en) * 1989-09-22 1990-04-24 Shipley Company Inc. Electroplating process

Also Published As

Publication number Publication date
EP1001052B1 (de) 2004-05-06
EP1001052A3 (de) 2002-11-13
ATE266107T1 (de) 2004-05-15
DE59909392D1 (de) 2004-06-09
KR20010086023A (ko) 2001-09-07
EP1001052A2 (de) 2000-05-17

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