ES2334399T3 - Modulo de microondas. - Google Patents
Modulo de microondas. Download PDFInfo
- Publication number
- ES2334399T3 ES2334399T3 ES07425745T ES07425745T ES2334399T3 ES 2334399 T3 ES2334399 T3 ES 2334399T3 ES 07425745 T ES07425745 T ES 07425745T ES 07425745 T ES07425745 T ES 07425745T ES 2334399 T3 ES2334399 T3 ES 2334399T3
- Authority
- ES
- Spain
- Prior art keywords
- microwave
- spring
- spring contacts
- microwave module
- cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
- H01P5/10—Coupling devices of the waveguide type for linking dissimilar lines or devices for coupling balanced lines or devices with unbalanced lines or devices
- H01P5/107—Hollow-waveguide/strip-line transitions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
- Constitution Of High-Frequency Heating (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP07425745A EP2063484B1 (de) | 2007-11-26 | 2007-11-26 | Mikrowellenmodul |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES2334399T3 true ES2334399T3 (es) | 2010-03-09 |
Family
ID=39301242
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES07425745T Active ES2334399T3 (es) | 2007-11-26 | 2007-11-26 | Modulo de microondas. |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP2063484B1 (de) |
| AT (1) | ATE447243T1 (de) |
| DE (1) | DE602007003031D1 (de) |
| ES (1) | ES2334399T3 (de) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113555332B (zh) * | 2021-07-13 | 2024-09-17 | 赛莱克斯微系统科技(北京)有限公司 | 一种高频器件集成模块和模组 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4166256A (en) * | 1977-01-05 | 1979-08-28 | Hughes Aircraft Company | Anti multipacting resonant cavity |
| US6459343B1 (en) | 1999-02-25 | 2002-10-01 | Formfactor, Inc. | Integrated circuit interconnect system forming a multi-pole filter |
| JP3986741B2 (ja) | 2000-09-18 | 2007-10-03 | 三菱電機株式会社 | マイクロ波モジュール格納シャーシ |
| US6573803B1 (en) | 2000-10-12 | 2003-06-03 | Tyco Electronics Corp. | Surface-mounted millimeter wave signal source with ridged microstrip to waveguide transition |
| US7411279B2 (en) * | 2004-06-30 | 2008-08-12 | Endwave Corporation | Component interconnect with substrate shielding |
-
2007
- 2007-11-26 ES ES07425745T patent/ES2334399T3/es active Active
- 2007-11-26 EP EP07425745A patent/EP2063484B1/de not_active Not-in-force
- 2007-11-26 AT AT07425745T patent/ATE447243T1/de not_active IP Right Cessation
- 2007-11-26 DE DE602007003031T patent/DE602007003031D1/de active Active
Also Published As
| Publication number | Publication date |
|---|---|
| EP2063484B1 (de) | 2009-10-28 |
| ATE447243T1 (de) | 2009-11-15 |
| EP2063484A1 (de) | 2009-05-27 |
| DE602007003031D1 (de) | 2009-12-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103824816B (zh) | 一种耐过载的t/r组件一体化气密性封装结构 | |
| EP3389189B1 (de) | Mikrowellenmodul | |
| US8242588B2 (en) | Lead frame based ceramic air cavity package | |
| JP3001565B2 (ja) | マルチチップ・モジュ―ル | |
| JP5537736B2 (ja) | 半導体素子収納用パッケージ、これを備えた半導体装置および電子装置 | |
| EP3327767B1 (de) | Montagestruktur, verfahren zur herstellung der montagestruktur und drahtlose vorrichtung | |
| US20180308776A1 (en) | Electromagnetic shield structure of high frequency circuit and high frequency module | |
| CN110739538A (zh) | Tr组件与天线阵面的射频互联方法 | |
| JP2012060533A (ja) | 高周波回路用パッケージ及び高周波回路装置 | |
| WO2008097765A1 (en) | Packaging for low cost, high-performance microwave and millimeter wave modules | |
| KR101388779B1 (ko) | 반도체 패키지 모듈 | |
| JP2012109670A (ja) | 高周波モジュール及びこれを用いたアレイアンテナ装置 | |
| CN211267229U (zh) | 电子设备 | |
| JP6790902B2 (ja) | 電子装置 | |
| ES2334399T3 (es) | Modulo de microondas. | |
| JP2006511071A (ja) | 表面実装を伴うマイクロ波パッケージ、および多層回路を備えた対応する実装体 | |
| JP2011139244A (ja) | 高周波モジュール | |
| US20110294315A1 (en) | Circuit board module and electronic device provided with the same | |
| EP4064337A1 (de) | Elektronisches bauteil, leiterplatte damit und elektronische vorrichtung | |
| CN103460816A (zh) | 电子组件 | |
| RU2463684C1 (ru) | Многокристальный модуль | |
| WO2023051553A1 (zh) | 光笼子组件和光通信设备 | |
| ES2320447T3 (es) | Dispositivo con circuitos hibridos de microondas con blindaje mediante elemento(s) de contacto elastico(s). | |
| CN116600541A (zh) | 一种新型点火控制组件模块 | |
| JP2019186379A (ja) | 光モジュール |