ES2531163T3 - Procedimiento y electrolito para la deposición galvánica de bronces - Google Patents

Procedimiento y electrolito para la deposición galvánica de bronces Download PDF

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Publication number
ES2531163T3
ES2531163T3 ES02022718T ES02022718T ES2531163T3 ES 2531163 T3 ES2531163 T3 ES 2531163T3 ES 02022718 T ES02022718 T ES 02022718T ES 02022718 T ES02022718 T ES 02022718T ES 2531163 T3 ES2531163 T3 ES 2531163T3
Authority
ES
Spain
Prior art keywords
electrolyte
bronzes
procedure
galvanic deposition
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES02022718T
Other languages
English (en)
Inventor
Katrin Zschintzsch
Joachim Dr Heyer
Marlies Dr Kleinfeld
Stefan Schäfer
Ortrud Steinius
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Enthone Inc
Original Assignee
Enthone Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=32010957&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ES2531163(T3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Enthone Inc filed Critical Enthone Inc
Application granted granted Critical
Publication of ES2531163T3 publication Critical patent/ES2531163T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

Procedimiento para la deposición galvánica de bronces con una proporción de cobre de > 10 % en peso, donde un sustrato a recubrir se metaliza en un electrolito ácido con una densidad de corriente ajustada a entre 0,1 y 120 A/dm2, donde el electrolito presenta al menos iones de estaño y de cobre, un medio humectante aromático no iónico, así como ácido metanosulfónico, caracterizado por que en el electrolito se ajusta una concentración de iones de estaño de 2 a 75 g/l, una concentración de iones de cobre de 2 a 70 g/l y una concentración de ácido metanosulfónico de al menos 238 g/l y se añaden al electrolito bismuto y/o cinc.
ES02022718T 2002-10-11 2002-10-11 Procedimiento y electrolito para la deposición galvánica de bronces Expired - Lifetime ES2531163T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP02022718.7A EP1408141B1 (de) 2002-10-11 2002-10-11 Verfahren und Elektrolyt zur galvanischen Abscheidung von Bronzen

Publications (1)

Publication Number Publication Date
ES2531163T3 true ES2531163T3 (es) 2015-03-11

Family

ID=32010957

Family Applications (1)

Application Number Title Priority Date Filing Date
ES02022718T Expired - Lifetime ES2531163T3 (es) 2002-10-11 2002-10-11 Procedimiento y electrolito para la deposición galvánica de bronces

Country Status (7)

Country Link
US (1) US20060137991A1 (es)
EP (1) EP1408141B1 (es)
JP (1) JP4675626B2 (es)
KR (1) KR100684818B1 (es)
CN (1) CN1703540B (es)
ES (1) ES2531163T3 (es)
WO (1) WO2004035875A2 (es)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
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DE102004041701A1 (de) * 2004-08-28 2006-03-02 Enthone Inc., West Haven Verfahren zur elektrolytischen Abscheidung von Metallen
KR100906008B1 (ko) * 2004-09-24 2009-07-06 자덴 징크 프로덕츠, 인코포레이티드 은백색 외관을 갖는 전기도금된 금속 및 그 제조방법
US7296370B2 (en) * 2004-09-24 2007-11-20 Jarden Zinc Products, Inc. Electroplated metals with silvery-white appearance and method of making
US20060260948A2 (en) * 2005-04-14 2006-11-23 Enthone Inc. Method for electrodeposition of bronzes
CN100368924C (zh) * 2005-05-31 2008-02-13 西北工业大学 一种非周期性红外波段负磁导率材料
EP1803837B2 (de) 2005-11-25 2024-10-23 MacDermid Enthone Inc. Verfahren zur Reinigung von Prozesslösungen
US9263609B2 (en) * 2006-05-24 2016-02-16 Atotech Deutschland Gmbh Metal plating composition and method for the deposition of copper—zinc—tin suitable for manufacturing thin film solar cell
PL1961840T3 (pl) 2007-02-14 2010-06-30 Umicore Galvanotechnik Gmbh Elektrolit miedziowo-cynowy i sposób osadzania warstw brązu
US7780839B2 (en) 2007-12-12 2010-08-24 Rohm And Haas Electronic Materials Llc Electroplating bronze
ATE486157T1 (de) 2008-05-08 2010-11-15 Umicore Galvanotechnik Gmbh Modifizierter kupfer-zinn-elektrolyt und verfahren zur abscheidung von bronzeschichten
DE102008032398A1 (de) 2008-07-10 2010-01-14 Umicore Galvanotechnik Gmbh Verbesserter Kupfer-Zinn-Elektrolyt und Verfahren zur Abscheidung von Bronzeschichten
DE102011008836B4 (de) 2010-08-17 2013-01-10 Umicore Galvanotechnik Gmbh Elektrolyt und Verfahren zur Abscheidung von Kupfer-Zinn-Legierungsschichten
US8426241B2 (en) 2010-09-09 2013-04-23 International Business Machines Corporation Structure and method of fabricating a CZTS photovoltaic device by electrodeposition
EP2660360A1 (en) * 2011-08-30 2013-11-06 Rohm and Haas Electronic Materials LLC Adhesion promotion of cyanide-free white bronze
CN102605394B (zh) * 2012-03-07 2015-02-18 深圳市华傲创表面技术有限公司 一种无氰酸性白铜锡电镀液
JP6101510B2 (ja) * 2013-02-18 2017-03-22 株式会社シミズ 非シアン銅−錫合金めっき浴
CA2957587C (en) * 2014-08-08 2019-03-05 Okuno Chemical Industries Co., Ltd. Copper-tin alloy plating bath
US11597637B2 (en) 2018-02-22 2023-03-07 Vis, Llc Under hoist support stand
EP3540097A1 (en) 2018-03-13 2019-09-18 COVENTYA S.p.A. Electroplated products and electroplating bath for providing such products
US10906789B2 (en) * 2018-09-05 2021-02-02 Vis, Llc Power unit for a floor jack
CN117845047A (zh) * 2022-09-30 2024-04-09 苏州宇邦新型材料股份有限公司 一种锡渣的回收方法

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US2854388A (en) * 1955-03-14 1958-09-30 City Auto Stamping Co Electrodeposition of copper-tin alloys
JPS5672196A (en) * 1979-11-19 1981-06-16 Shimizu Shoji Kk Bright plating bath for copper-tin alloy
DE3339541C2 (de) * 1983-11-02 1986-08-07 Degussa Ag, 6000 Frankfurt Alkalisch-cyanidisches Bad zur galvanischen Abscheidung von Kupfer-Zinn-Legierungsüberzügen
JPS63206494A (ja) * 1987-02-20 1988-08-25 Yutaka Fujiwara シアン化合物を含まない光沢銅−亜鉛−錫合金電気めつき浴
JPH02107795A (ja) * 1988-10-14 1990-04-19 Tohoku Ricoh Co Ltd 銅一スズ合金メツキ浴
DE3934866A1 (de) * 1989-10-19 1991-04-25 Blasberg Oberflaechentech Verfahren zur abscheidung von blei- und bleihaltigen schichten, elektrolyte zur durchfuehrung des verfahrens sowie verwendung von tensiden in sauren blei-elektrolyten
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JPH0711477A (ja) * 1993-06-28 1995-01-13 Electroplating Eng Of Japan Co 貴金属めっき品
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JP3274766B2 (ja) * 1994-06-28 2002-04-15 荏原ユージライト株式会社 低融点錫合金めっき浴
JPH0827590A (ja) * 1994-07-13 1996-01-30 Okuno Chem Ind Co Ltd 光沢銅−錫合金めっき浴
US6176996B1 (en) * 1997-10-30 2001-01-23 Sungsoo Moon Tin alloy plating compositions
JP3366851B2 (ja) * 1997-12-18 2003-01-14 株式会社ジャパンエナジー 錫合金電気めっき液およびめっき方法
TW577938B (en) * 1998-11-05 2004-03-01 Uyemura C & Co Ltd Tin-copper alloy electroplating bath and plating process therewith
JP2001060672A (ja) * 1999-08-20 2001-03-06 Mitsubishi Electric Corp エッチング方法およびエッチングマスク
JP3433291B2 (ja) * 1999-09-27 2003-08-04 石原薬品株式会社 スズ−銅含有合金メッキ浴、スズ−銅含有合金メッキ方法及びスズ−銅含有合金メッキ皮膜が形成された物品
JP2001107287A (ja) * 1999-10-07 2001-04-17 Ebara Udylite Kk Ｓｎ−Ｃｕ合金めっき浴
EP1091023A3 (en) * 1999-10-08 2003-05-14 Shipley Company LLC Alloy composition and plating method
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EP1325175B1 (de) * 2000-09-20 2005-05-04 Dr.Ing. Max Schlötter GmbH & Co. KG Elektrolyt und verfahren zur abscheidung von zinn-kupfer-legierungsschichten
DE10046600C2 (de) * 2000-09-20 2003-02-20 Schloetter Fa Dr Ing Max Elektrolyt und Verfahren zur Abscheidung von Zinn-Kupfer-Legierungsschichten und Verwendung des Elektrolyten
KR20020073434A (ko) * 2001-03-16 2002-09-26 쉬플리 캄파니, 엘.엘.씨. 주석 도금
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US20060260948A2 (en) * 2005-04-14 2006-11-23 Enthone Inc. Method for electrodeposition of bronzes

Also Published As

Publication number Publication date
CN1703540B (zh) 2010-10-06
KR20050059174A (ko) 2005-06-17
US20060137991A1 (en) 2006-06-29
CN1703540A (zh) 2005-11-30
EP1408141B1 (de) 2014-12-17
WO2004035875A3 (de) 2005-04-14
JP2005537394A (ja) 2005-12-08
WO2004035875A2 (de) 2004-04-29
EP1408141A1 (de) 2004-04-14
KR100684818B1 (ko) 2007-02-22
JP4675626B2 (ja) 2011-04-27

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