PL1961840T3 - Elektrolit miedziowo-cynowy i sposób osadzania warstw brązu - Google Patents
Elektrolit miedziowo-cynowy i sposób osadzania warstw brązuInfo
- Publication number
- PL1961840T3 PL1961840T3 PL07003097T PL07003097T PL1961840T3 PL 1961840 T3 PL1961840 T3 PL 1961840T3 PL 07003097 T PL07003097 T PL 07003097T PL 07003097 T PL07003097 T PL 07003097T PL 1961840 T3 PL1961840 T3 PL 1961840T3
- Authority
- PL
- Poland
- Prior art keywords
- copper
- electrolyte
- tin electrolyte
- bronze layers
- tin
- Prior art date
Links
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 title abstract 4
- 229910000906 Bronze Inorganic materials 0.000 title abstract 3
- 239000010974 bronze Substances 0.000 title abstract 3
- 239000003792 electrolyte Substances 0.000 title abstract 3
- 238000000034 method Methods 0.000 title abstract 2
- 238000000151 deposition Methods 0.000 title 1
- 238000009713 electroplating Methods 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 229940042400 direct acting antivirals phosphonic acid derivative Drugs 0.000 abstract 1
- 150000002825 nitriles Chemical class 0.000 abstract 1
- 231100000252 nontoxic Toxicity 0.000 abstract 1
- 230000003000 nontoxic effect Effects 0.000 abstract 1
- 150000003007 phosphonic acid derivatives Chemical class 0.000 abstract 1
- 150000003839 salts Chemical class 0.000 abstract 1
- 150000003573 thiols Chemical class 0.000 abstract 1
- 150000003585 thioureas Chemical class 0.000 abstract 1
- 239000011701 zinc Substances 0.000 abstract 1
- 229910052725 zinc Inorganic materials 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
- Chemically Coating (AREA)
- Electrolytic Production Of Metals (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP07003097A EP1961840B1 (de) | 2007-02-14 | 2007-02-14 | Kupfer-Zinn-Elektrolyt und Verfahren zur Abscheidung von Bronzeschichten |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL1961840T3 true PL1961840T3 (pl) | 2010-06-30 |
Family
ID=38293349
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL07003097T PL1961840T3 (pl) | 2007-02-14 | 2007-02-14 | Elektrolit miedziowo-cynowy i sposób osadzania warstw brązu |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US8211285B2 (pl) |
| EP (1) | EP1961840B1 (pl) |
| JP (1) | JP2010518260A (pl) |
| CN (1) | CN101622379B (pl) |
| AT (1) | ATE453740T1 (pl) |
| DE (1) | DE502007002479D1 (pl) |
| PL (1) | PL1961840T3 (pl) |
| TW (1) | TW200844266A (pl) |
| WO (1) | WO2008098666A1 (pl) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102008032398A1 (de) * | 2008-07-10 | 2010-01-14 | Umicore Galvanotechnik Gmbh | Verbesserter Kupfer-Zinn-Elektrolyt und Verfahren zur Abscheidung von Bronzeschichten |
| DE102011121799B4 (de) | 2011-12-21 | 2013-08-29 | Umicore Galvanotechnik Gmbh | Elektrolyt und Verfahren zur elektrolytischen Abscheidung von Cu-Zn-Sn-Legierungsschichten und Verfahren zur Herstellung einer Dünnschichtsolarzelle |
| DE102011121798B4 (de) * | 2011-12-21 | 2013-08-29 | Umicore Galvanotechnik Gmbh | Elektrolyt und Verfahren zur elektrolytischen Abscheidung von Cu-Zn-Sn-Legierungsschichten und Verfahren zur Herstellung einer Dünnschichtsolarzelle |
| DE102012008544A1 (de) | 2012-05-02 | 2013-11-07 | Umicore Galvanotechnik Gmbh | Verchromte Verbundwerkstoffe ohne Nickelschicht |
| AT514818B1 (de) * | 2013-09-18 | 2015-10-15 | W Garhöfer Ges M B H Ing | Abscheidung von Cu, Sn, Zn-Beschichtungen auf metallischen Substraten |
| EP2878713A1 (en) * | 2013-11-28 | 2015-06-03 | Abbott Laboratories Vascular Enterprises Limited | Electrolyte composition and method for the electropolishing treatment of Nickel-Titanium alloys and/or other metal substrates including tungsten, niob and tantal alloys |
| DE102013226297B3 (de) * | 2013-12-17 | 2015-03-26 | Umicore Galvanotechnik Gmbh | Wässriger, cyanidfreier Elektrolyt für die Abscheidung von Kupfer-Zinn- und Kupfer-Zinn-Zink-Legierungen aus einem Elektrolyten und Verfahren zur elektrolytischen Abscheidung dieser Legierungen |
| DE102013021502A1 (de) * | 2013-12-19 | 2015-06-25 | Schlenk Metallfolien Gmbh & Co. Kg | Elektrisch leitende Flüssigkeiten auf der Basis von Metall-Diphosphonat-Komplexen |
| CN103755738B (zh) * | 2014-01-13 | 2016-06-01 | 孙松华 | 一种络合剂及其制备方法和用途 |
| JP2018119169A (ja) * | 2017-01-23 | 2018-08-02 | 学校法人関東学院 | 電気めっき液、電気めっき方法及び電気めっき皮膜 |
| CN108658321B (zh) * | 2018-05-18 | 2019-08-09 | 深圳市祺鑫天正环保科技有限公司 | 扩散渗析处理硝酸型退锡废液的系统及方法 |
| DE102021117095A1 (de) | 2021-07-02 | 2023-01-05 | Umicore Galvanotechnik Gmbh | Bronzeschichten als Edelmetallersatz |
| DE202021004169U1 (de) | 2021-07-02 | 2022-12-07 | Umicore Galvanotechnik Gmbh | Bronzeschicht als Edelmetallersatz in Smart Cards |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE267718C (pl) * | ||||
| BE791401A (fr) * | 1971-11-15 | 1973-05-14 | Monsanto Co | Compositions et procedes electrochimiques |
| US3833486A (en) * | 1973-03-26 | 1974-09-03 | Lea Ronal Inc | Cyanide-free electroplating |
| JPS513331A (ja) * | 1974-06-25 | 1976-01-12 | Lea Ronal Inc | Shiankabutsuofukumanai kairyodentoyoku |
| JPS52106331A (en) * | 1976-03-05 | 1977-09-06 | Kosaku Kk | Plating bath |
| US4389286A (en) * | 1980-07-17 | 1983-06-21 | Electrochemical Products, Inc. | Alkaline plating baths and electroplating process |
| CN1004010B (zh) * | 1986-07-11 | 1989-04-26 | 南京大学 | 无氰仿金电镀液 |
| JPH02175894A (ja) * | 1988-12-28 | 1990-07-09 | Kosaku:Kk | スズ、スズ合金電気めっき方法及び同電気めっき装置 |
| JPH049493A (ja) * | 1990-04-27 | 1992-01-14 | Permelec Electrode Ltd | 鋼板の電気錫メッキ方法 |
| JPH04176893A (ja) * | 1990-11-08 | 1992-06-24 | Kawasaki Steel Corp | Sn―Ni合金めっき方法 |
| DE4324995C2 (de) * | 1993-07-26 | 1995-12-21 | Demetron Gmbh | Cyanidisch-alkalische Bäder zur galvanischen Abscheidung von Kupfer-Zinn-Legierungsüberzügen |
| JP4132247B2 (ja) * | 1998-07-09 | 2008-08-13 | 株式会社大和化成研究所 | 電気・電子回路部品 |
| US6508927B2 (en) | 1998-11-05 | 2003-01-21 | C. Uyemura & Co., Ltd. | Tin-copper alloy electroplating bath |
| JP2001181889A (ja) * | 1999-12-22 | 2001-07-03 | Nippon Macdermid Kk | 光沢錫−銅合金電気めっき浴 |
| JP3306404B2 (ja) * | 2000-01-28 | 2002-07-24 | 三井金属鉱業株式会社 | 表面処理銅箔の製造方法及びその製造方法で得られた表面処理銅箔を用いた銅張積層板 |
| JP3455712B2 (ja) | 2000-04-14 | 2003-10-14 | 日本ニュークローム株式会社 | 銅−スズ合金めっき用ピロリン酸浴 |
| DE10046600C2 (de) | 2000-09-20 | 2003-02-20 | Schloetter Fa Dr Ing Max | Elektrolyt und Verfahren zur Abscheidung von Zinn-Kupfer-Legierungsschichten und Verwendung des Elektrolyten |
| JP4249438B2 (ja) | 2002-07-05 | 2009-04-02 | 日本ニュークローム株式会社 | 銅―錫合金めっき用ピロリン酸浴 |
| DE10243139A1 (de) * | 2002-09-17 | 2004-03-25 | Omg Galvanotechnik Gmbh | Dunkle Schichten |
| ES2531163T3 (es) * | 2002-10-11 | 2015-03-11 | Enthone | Procedimiento y electrolito para la deposición galvánica de bronces |
| JP4441726B2 (ja) * | 2003-01-24 | 2010-03-31 | 石原薬品株式会社 | スズ又はスズ合金の脂肪族スルホン酸メッキ浴の製造方法 |
-
2007
- 2007-02-14 PL PL07003097T patent/PL1961840T3/pl unknown
- 2007-02-14 AT AT07003097T patent/ATE453740T1/de active
- 2007-02-14 EP EP07003097A patent/EP1961840B1/de not_active Not-in-force
- 2007-02-14 DE DE502007002479T patent/DE502007002479D1/de active Active
-
2008
- 2008-01-15 TW TW097101536A patent/TW200844266A/zh unknown
- 2008-01-24 JP JP2009549787A patent/JP2010518260A/ja active Pending
- 2008-01-24 CN CN2008800069531A patent/CN101622379B/zh not_active Expired - Fee Related
- 2008-01-24 WO PCT/EP2008/000534 patent/WO2008098666A1/de not_active Ceased
- 2008-01-24 US US12/526,727 patent/US8211285B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP1961840A1 (de) | 2008-08-27 |
| WO2008098666A1 (de) | 2008-08-21 |
| ATE453740T1 (de) | 2010-01-15 |
| EP1961840B1 (de) | 2009-12-30 |
| US8211285B2 (en) | 2012-07-03 |
| US20100147696A1 (en) | 2010-06-17 |
| JP2010518260A (ja) | 2010-05-27 |
| TW200844266A (en) | 2008-11-16 |
| CN101622379B (zh) | 2011-05-25 |
| HK1137785A1 (en) | 2010-08-06 |
| CN101622379A (zh) | 2010-01-06 |
| DE502007002479D1 (de) | 2010-02-11 |
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