ES2543053T3 - Procedimiento para el suministro de impulsos secuenciales de potencia - Google Patents
Procedimiento para el suministro de impulsos secuenciales de potencia Download PDFInfo
- Publication number
- ES2543053T3 ES2543053T3 ES12720091.3T ES12720091T ES2543053T3 ES 2543053 T3 ES2543053 T3 ES 2543053T3 ES 12720091 T ES12720091 T ES 12720091T ES 2543053 T3 ES2543053 T3 ES 2543053T3
- Authority
- ES
- Spain
- Prior art keywords
- power
- interval
- generator
- cathode
- pulse
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3485—Sputtering using pulsed power to the target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3492—Variation of parameters during sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
- C23C14/352—Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3464—Operating strategies
- H01J37/3467—Pulsed operation, e.g. HIPIMS
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Plasma & Fusion (AREA)
- Physics & Mathematics (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
- Chemical Vapour Deposition (AREA)
- Surgical Instruments (AREA)
- Coating By Spraying Or Casting (AREA)
- Control Of Indicators Other Than Cathode Ray Tubes (AREA)
- Electrostatic Separation (AREA)
Abstract
Procedimiento para el suministro de impulsos de potencia con intervalo escalable del impulso de potencia para el funcionamiento de un cátodo de atomización-PVD, comprendiendo el cátodo de atomización-PVD un primer cátodo parcial y un segundo cátodo parcial, en el que para los cátodos parciales está predeterminada una impulsión de potencia media máxima y en el que la duración de los intervalos del impulso de potencia están predeterminados y el procedimiento comprende las siguientes etapas: a) suministrar un generador con cesión de potencia predeterminada, con preferencia constante al menos después del arranque y después de la expiración de un intervalo de formación de la potencia, b) conexión del generador, c) conexión del primer cátodo parcial en el generador, de manera que el primer cátodo parcial es impulsado con potencia desde el generador, d) separación del generador desde el primer cátodo parcial después de la expiración de un primer intervalo del impulso de potencia predeterminado que corresponde al primer cátodo parcial, e) conexión del segundo cátodo racial en el generador, de manera que el segundo cátodo parcial es impulso con potencia desde el generador f) separación del generador desde el segundo cátodo parcial después de la expiración de un segundo intervalo del impulso de potencia predeterminado que corresponde al segundo cátodo parcial en el que el primer intervalo del impulso de potencia comienza en el tiempo antes del segundo intervalo del impulso de potencia y el primer intervalo del impulso de potencia termina en el tiempo antes del segundo intervalo del impulso de potencia, caracterizado porque las etapas d) y e) se realizan de tal manera que el primer intervalo el impulso de potencia y el segundo intervalo del impulso de potencia se solapen en el tiempo y todos los intervalos del impulso de potencia forman conjuntamente un primer grupo, de manera que la cesión de potencia desde el generador se mantiene continuamente sin interrupción desde el comienzo del primer intervalo del impulso de potencia hasta el final del segundo intervalo del impulso de potencia y no tiene lugar un segundo intervalo de formación de la potencia.
Description
Claims (1)
-
imagen1 imagen2
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102011018363 | 2011-04-20 | ||
| DE102011018363A DE102011018363A1 (de) | 2011-04-20 | 2011-04-20 | Hochleistungszerstäubungsquelle |
| DE102011117177 | 2011-10-28 | ||
| DE102011117177A DE102011117177A1 (de) | 2011-10-28 | 2011-10-28 | Verfahren zur Bereitstellung sequenzieller Leistungspulse |
| PCT/EP2012/001484 WO2012143091A1 (de) | 2011-04-20 | 2012-04-04 | Verfahren zur bereistellung sequenzieller leistungspulse |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES2543053T3 true ES2543053T3 (es) | 2015-08-14 |
Family
ID=46052693
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES12720091.3T Active ES2543053T3 (es) | 2011-04-20 | 2012-04-04 | Procedimiento para el suministro de impulsos secuenciales de potencia |
Country Status (19)
| Country | Link |
|---|---|
| US (1) | US9267200B2 (es) |
| EP (1) | EP2700083B1 (es) |
| JP (1) | JP5713331B2 (es) |
| KR (1) | KR101537883B1 (es) |
| CN (1) | CN103608893B (es) |
| AR (1) | AR086194A1 (es) |
| BR (1) | BR112013026962B1 (es) |
| CA (1) | CA2833796C (es) |
| ES (1) | ES2543053T3 (es) |
| HU (1) | HUE025643T2 (es) |
| MX (1) | MX346377B (es) |
| MY (1) | MY183993A (es) |
| PH (1) | PH12013502183A1 (es) |
| PL (1) | PL2700083T3 (es) |
| PT (1) | PT2700083E (es) |
| RU (1) | RU2596818C2 (es) |
| SG (1) | SG194568A1 (es) |
| TW (1) | TWI586825B (es) |
| WO (1) | WO2012143091A1 (es) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104272429B (zh) | 2011-12-05 | 2016-08-24 | 欧瑞康表面解决方案股份公司，普费菲孔 | 用于反应溅射的方法 |
| DE102012021346A1 (de) * | 2012-11-01 | 2014-08-28 | Oerlikon Trading Ag, Trübbach | Leistungsverteiler zur definierten sequenziellen Leistungsverteilung |
| JP6463078B2 (ja) * | 2014-10-24 | 2019-01-30 | 日立金属株式会社 | 被覆工具の製造方法 |
| US9812305B2 (en) * | 2015-04-27 | 2017-11-07 | Advanced Energy Industries, Inc. | Rate enhanced pulsed DC sputtering system |
| SG11201803970RA (en) * | 2015-11-12 | 2018-06-28 | Oerlikon Surface Solutions Ag Pfaeffikon | Sputtering arrangement and sputtering method for optimized distribution of the energy flow |
| US11359274B2 (en) * | 2015-12-21 | 2022-06-14 | IonQuestCorp. | Electrically and magnetically enhanced ionized physical vapor deposition unbalanced sputtering source |
| US9951414B2 (en) | 2015-12-21 | 2018-04-24 | IonQuest LLC | Magnetically enhanced high density plasma-chemical vapor deposition plasma source for depositing diamond and diamond-like films |
| US11823859B2 (en) | 2016-09-09 | 2023-11-21 | Ionquest Corp. | Sputtering a layer on a substrate using a high-energy density plasma magnetron |
| US12217949B2 (en) | 2015-12-21 | 2025-02-04 | Ionquest Corp. | Magnetically enhanced high density plasma-chemical vapor deposition plasma source for depositing diamond and diamond-like films |
| US11482404B2 (en) | 2015-12-21 | 2022-10-25 | Ionquest Corp. | Electrically and magnetically enhanced ionized physical vapor deposition unbalanced sputtering source |
| CN109154061B (zh) | 2016-04-22 | 2021-07-13 | 欧瑞康表面处理解决方案股份公司普费菲孔 | 借助HIPIMS的具有减少的生长缺陷的TiCN |
| CN116356255A (zh) * | 2023-04-04 | 2023-06-30 | 东北大学 | 一种基于高功率脉冲磁控溅射技术的TiCN涂层及其制备方法 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6141766A (ja) * | 1984-08-06 | 1986-02-28 | Hitachi Ltd | スパツタリング方法およびスパツタ−装置 |
| JPH07116596B2 (ja) * | 1989-02-15 | 1995-12-13 | 株式会社日立製作所 | 薄膜形成方法、及びその装置 |
| US5064520A (en) * | 1989-02-15 | 1991-11-12 | Hitachi, Ltd. | Method and apparatus for forming a film |
| DE19651615C1 (de) * | 1996-12-12 | 1997-07-10 | Fraunhofer Ges Forschung | Verfahren zum Aufbringen von Kohlenstoffschichten durch reaktives Magnetron-Sputtern |
| US20050103620A1 (en) * | 2003-11-19 | 2005-05-19 | Zond, Inc. | Plasma source with segmented magnetron cathode |
| EP1580298A1 (fr) * | 2004-03-22 | 2005-09-28 | Materia Nova A.S.B.L | Dépôt par pulverisation cathodique magnétron en régime impulsionnel avec préionisation |
| US20060260938A1 (en) * | 2005-05-20 | 2006-11-23 | Petrach Philip M | Module for Coating System and Associated Technology |
| DE102006017382A1 (de) * | 2005-11-14 | 2007-05-16 | Itg Induktionsanlagen Gmbh | Verfahren und Vorrichtung zum Beschichten und/oder zur Behandlung von Oberflächen |
| US20080197015A1 (en) * | 2007-02-16 | 2008-08-21 | Terry Bluck | Multiple-magnetron sputtering source with plasma confinement |
| EP2272080B1 (de) | 2008-04-28 | 2012-08-01 | CemeCon AG | Vorrichtung und verfahren zum vorbehandeln und beschichten von körpern |
| DE202010001497U1 (de) * | 2010-01-29 | 2010-04-22 | Hauzer Techno-Coating B.V. | Beschichtungsvorrichtung mit einer HIPIMS-Leistungsquelle |
| DE102011018363A1 (de) | 2011-04-20 | 2012-10-25 | Oerlikon Trading Ag, Trübbach | Hochleistungszerstäubungsquelle |
| JP7116596B2 (ja) * | 2018-05-31 | 2022-08-10 | 川崎重工業株式会社 | リード線挿入装置およびリード線挿入方法 |
-
2012
- 2012-04-04 PL PL12720091T patent/PL2700083T3/pl unknown
- 2012-04-04 RU RU2013151453/07A patent/RU2596818C2/ru active
- 2012-04-04 BR BR112013026962-6A patent/BR112013026962B1/pt active IP Right Grant
- 2012-04-04 CN CN201280030387.4A patent/CN103608893B/zh active Active
- 2012-04-04 CA CA2833796A patent/CA2833796C/en active Active
- 2012-04-04 MX MX2013012198A patent/MX346377B/es active IP Right Grant
- 2012-04-04 HU HUE12720091A patent/HUE025643T2/en unknown
- 2012-04-04 KR KR1020137027646A patent/KR101537883B1/ko active Active
- 2012-04-04 EP EP20120720091 patent/EP2700083B1/de active Active
- 2012-04-04 WO PCT/EP2012/001484 patent/WO2012143091A1/de not_active Ceased
- 2012-04-04 MY MYPI2013003835A patent/MY183993A/en unknown
- 2012-04-04 SG SG2013078290A patent/SG194568A1/en unknown
- 2012-04-04 PT PT127200913T patent/PT2700083E/pt unknown
- 2012-04-04 PH PH1/2013/502183A patent/PH12013502183A1/en unknown
- 2012-04-04 ES ES12720091.3T patent/ES2543053T3/es active Active
- 2012-04-04 JP JP2014505525A patent/JP5713331B2/ja active Active
- 2012-04-04 US US14/112,757 patent/US9267200B2/en active Active
- 2012-04-18 TW TW101113746A patent/TWI586825B/zh not_active IP Right Cessation
- 2012-04-20 AR ARP120101358A patent/AR086194A1/es active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| JP5713331B2 (ja) | 2015-05-07 |
| HUE025643T2 (en) | 2016-04-28 |
| RU2013151453A (ru) | 2015-05-27 |
| AR086194A1 (es) | 2013-11-27 |
| CA2833796A1 (en) | 2012-10-26 |
| WO2012143091A8 (de) | 2013-11-28 |
| MY183993A (en) | 2021-03-17 |
| CA2833796C (en) | 2018-07-31 |
| WO2012143091A1 (de) | 2012-10-26 |
| MX346377B (es) | 2017-03-16 |
| EP2700083B1 (de) | 2015-04-22 |
| CN103608893B (zh) | 2016-08-31 |
| EP2700083A1 (de) | 2014-02-26 |
| KR101537883B1 (ko) | 2015-07-17 |
| JP2014514453A (ja) | 2014-06-19 |
| SG194568A1 (en) | 2013-12-30 |
| BR112013026962A2 (pt) | 2017-01-10 |
| PT2700083E (pt) | 2015-08-24 |
| CN103608893A (zh) | 2014-02-26 |
| BR112013026962B1 (pt) | 2021-02-09 |
| PL2700083T3 (pl) | 2015-10-30 |
| MX2013012198A (es) | 2014-05-28 |
| US20140190819A1 (en) | 2014-07-10 |
| PH12013502183A1 (en) | 2016-10-07 |
| TW201243082A (en) | 2012-11-01 |
| US9267200B2 (en) | 2016-02-23 |
| TWI586825B (zh) | 2017-06-11 |
| KR20140019806A (ko) | 2014-02-17 |
| RU2596818C2 (ru) | 2016-09-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| ES2543053T3 (es) | Procedimiento para el suministro de impulsos secuenciales de potencia | |
| BR112017017300A2 (pt) | laser ultravioleta de femtossegundo | |
| FI3077041T3 (fi) | Syövän immunoterapia radiotaajuisella sähköisellä solukalvon hajotuksella (rf-emb) | |
| WO2016126300A3 (en) | Electrothermal energy storage system and an associated method thereof | |
| RU2014121388A (ru) | Способ предоставления последовательных импульсов мощности | |
| AR110192A1 (es) | Dispositivo de calentamiento inductivo, sistema generador de aerosol que comprende un dispositivo de calentamiento inductivo y método para operarlo | |
| MX2017000888A (es) | Sistema de cojinete para bomba de vaiven y metodo de montaje. | |
| WO2016168249A8 (en) | Magnetic coil power methods and apparatus | |
| MX2020007037A (es) | Un microorganismo del genero corynebacterium que produce l-aminoacidos y un procedimiento para producir l-aminoacidos mediante el uso del mismo. | |
| JP2014107363A5 (es) | ||
| EP2568590A3 (en) | Switching power source and image forming apparatus | |
| AR102981A1 (es) | Inhibidores de la necrosis celular y métodos de preparación de los mismos | |
| ES2538700T3 (es) | Aparato para la limpieza de piscinas | |
| CL2018000327A1 (es) | Sistemas de tratamiento de aloinjerto rápido y métodos | |
| EP2822113A3 (en) | Pulse laser and photoacoustic apparatus | |
| CL2016001061A1 (es) | Sistema y método de compensación contra la turbulencia para turbogeneradores. | |
| JP2015501383A5 (es) | ||
| WO2015157778A3 (en) | System and method for generating high energy optical pulses with arbitrary waveform | |
| AR099497A1 (es) | Sistema de bombeo para el transporte de medios viscosos o parcialmente viscosos desde un pozo perforado, como también procedimiento para remover una bomba helicoidal excéntrica desde un pozo perforado | |
| MX2020004162A (es) | Elemento termo-electrico accionado por pulsos electricos. | |
| WO2016060465A3 (ko) | 플리커 성능이 개선된 led 구동회로 및 이를 포함하는 led 조명장치 | |
| MX2015000441A (es) | Metodo de recubrimiento de pulso de alta potencia. | |
| ES2532889A2 (es) | Sistema de esterilización de acuicultura | |
| MX2019000074A (es) | Sistema y metodo para almacenar un dispositivo medico. | |
| ES2611776T3 (es) | Uso de sales de tungsteno (VI) para el tratamiento de la esterilidad femenina en mamíferos no diabéticos |