ES3030232R1 - Método y máquina para un procesamiento láser con estimación de la rugosidad - Google Patents
Método y máquina para un procesamiento láser con estimación de la rugosidadInfo
- Publication number
- ES3030232R1 ES3030232R1 ES202590015A ES202590015A ES3030232R1 ES 3030232 R1 ES3030232 R1 ES 3030232R1 ES 202590015 A ES202590015 A ES 202590015A ES 202590015 A ES202590015 A ES 202590015A ES 3030232 R1 ES3030232 R1 ES 3030232R1
- Authority
- ES
- Spain
- Prior art keywords
- machine
- laser processing
- roughness estimation
- roughness
- estimation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Program-control systems
- G05B19/02—Program-control systems electric
- G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of program data in numerical form
- G05B19/401—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of program data in numerical form characterised by control arrangements for measuring, e.g. calibration and initialisation, measuring workpiece for machining purposes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/40—Analysis of texture
- G06T7/41—Analysis of texture based on statistical description of texture
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/37—Measurements
- G05B2219/37208—Vision, visual inspection of workpiece
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/37—Measurements
- G05B2219/37402—Flatness, roughness of surface
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/37—Measurements
- G05B2219/37573—In-cycle, insitu, during machining workpiece is measured continuously
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/49—Nc machine tool, till multiple
- G05B2219/49084—Control roughness of surface
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/20—Special algorithmic details
- G06T2207/20076—Probabilistic image processing
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30164—Workpiece; Machine component
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Automation & Control Theory (AREA)
- Human Computer Interaction (AREA)
- Quality & Reliability (AREA)
- Probability & Statistics with Applications (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IT102022000022038A IT202200022038A1 (it) | 2022-10-25 | 2022-10-25 | Procedimento e macchina per una lavorazione laser con stima di rugosita |
| PCT/IB2023/056574 WO2024089476A1 (en) | 2022-10-25 | 2023-06-26 | Method of and machine for a laser processing with roughness estimation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| ES3030232A2 ES3030232A2 (es) | 2025-06-26 |
| ES3030232R1 true ES3030232R1 (es) | 2025-06-30 |
Family
ID=84943463
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES202590015A Pending ES3030232R1 (es) | 2022-10-25 | 2023-06-26 | Método y máquina para un procesamiento láser con estimación de la rugosidad |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US20250162066A1 (es) |
| JP (1) | JP2025535953A (es) |
| KR (1) | KR20250092258A (es) |
| CN (1) | CN120418739A (es) |
| DE (1) | DE112023004439T5 (es) |
| ES (1) | ES3030232R1 (es) |
| GB (1) | GB2639165A (es) |
| IT (1) | IT202200022038A1 (es) |
| PL (1) | PL452449A1 (es) |
| WO (1) | WO2024089476A1 (es) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110278277A1 (en) * | 2008-11-21 | 2011-11-17 | Ingo Stork Genannt Wersborg | Method and device for monitoring a laser processing operation to be performed on a workpiece and laser processing head having such a device |
| US20130223724A1 (en) * | 2010-06-28 | 2013-08-29 | Precitec Itm Gmbh | Method for classifying a multitude of images recorded by a camera observing a processing area and laser material processing head using the same |
| US20210162544A1 (en) * | 2018-06-22 | 2021-06-03 | Mitsubishi Electric Corporation | Laser processing apparatus |
| DE102020112116A1 (de) * | 2020-05-05 | 2021-11-11 | Precitec Gmbh & Co. Kg | Verfahren zum Analysieren eines Laserbearbeitungsprozesses, System zum Analysieren eines Laserbearbeitungsprozesses und Laserbearbeitungssystem mit einem solchen System |
-
2022
- 2022-10-25 IT IT102022000022038A patent/IT202200022038A1/it unknown
-
2023
- 2023-06-26 WO PCT/IB2023/056574 patent/WO2024089476A1/en not_active Ceased
- 2023-06-26 US US18/839,521 patent/US20250162066A1/en active Pending
- 2023-06-26 DE DE112023004439.2T patent/DE112023004439T5/de active Pending
- 2023-06-26 CN CN202380073983.9A patent/CN120418739A/zh active Pending
- 2023-06-26 KR KR1020257016931A patent/KR20250092258A/ko active Pending
- 2023-06-26 PL PL452449A patent/PL452449A1/pl unknown
- 2023-06-26 JP JP2025524415A patent/JP2025535953A/ja active Pending
- 2023-06-26 GB GB2505816.5A patent/GB2639165A/en active Pending
- 2023-06-26 ES ES202590015A patent/ES3030232R1/es active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110278277A1 (en) * | 2008-11-21 | 2011-11-17 | Ingo Stork Genannt Wersborg | Method and device for monitoring a laser processing operation to be performed on a workpiece and laser processing head having such a device |
| US20130223724A1 (en) * | 2010-06-28 | 2013-08-29 | Precitec Itm Gmbh | Method for classifying a multitude of images recorded by a camera observing a processing area and laser material processing head using the same |
| US20210162544A1 (en) * | 2018-06-22 | 2021-06-03 | Mitsubishi Electric Corporation | Laser processing apparatus |
| DE102020112116A1 (de) * | 2020-05-05 | 2021-11-11 | Precitec Gmbh & Co. Kg | Verfahren zum Analysieren eines Laserbearbeitungsprozesses, System zum Analysieren eines Laserbearbeitungsprozesses und Laserbearbeitungssystem mit einem solchen System |
Also Published As
| Publication number | Publication date |
|---|---|
| DE112023004439T5 (de) | 2025-09-04 |
| GB202505816D0 (en) | 2025-06-04 |
| CN120418739A (zh) | 2025-08-01 |
| ES3030232A2 (es) | 2025-06-26 |
| IT202200022038A1 (it) | 2024-04-25 |
| PL452449A1 (pl) | 2026-01-19 |
| JP2025535953A (ja) | 2025-10-30 |
| WO2024089476A1 (en) | 2024-05-02 |
| US20250162066A1 (en) | 2025-05-22 |
| GB2639165A (en) | 2025-09-10 |
| KR20250092258A (ko) | 2025-06-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| BA2A | Patent application published |
Ref document number: 3030232 Country of ref document: ES Kind code of ref document: A2 Effective date: 20250626 |
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| EC2A | Search report published |
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