PL452449A1 - Sposób i urządzenie do obróbki laserowej z szacowaniem chropowatości - Google Patents

Sposób i urządzenie do obróbki laserowej z szacowaniem chropowatości

Info

Publication number
PL452449A1
PL452449A1 PL452449A PL45244923A PL452449A1 PL 452449 A1 PL452449 A1 PL 452449A1 PL 452449 A PL452449 A PL 452449A PL 45244923 A PL45244923 A PL 45244923A PL 452449 A1 PL452449 A1 PL 452449A1
Authority
PL
Poland
Prior art keywords
workpiece
machining
characteristic parameters
roughness
time history
Prior art date
Application number
PL452449A
Other languages
English (en)
Inventor
Matteo PACHER
Davide GANDOLFI
Mara Tanelli
Barbara Previtali
Sergio Matteo Savaresi
Valentina FINAZZI
Fabio PICCOLI
Giulio DELAMA
Original Assignee
Adige S.P.A.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Adige S.P.A. filed Critical Adige S.P.A.
Publication of PL452449A1 publication Critical patent/PL452449A1/pl

Links

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of program data in numerical form
    • G05B19/401—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of program data in numerical form characterised by control arrangements for measuring, e.g. calibration and initialisation, measuring workpiece for machining purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/40—Analysis of texture
    • G06T7/41—Analysis of texture based on statistical description of texture
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/37—Measurements
    • G05B2219/37208—Vision, visual inspection of workpiece
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/37—Measurements
    • G05B2219/37402—Flatness, roughness of surface
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/37—Measurements
    • G05B2219/37573—In-cycle, insitu, during machining workpiece is measured continuously
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/49—Nc machine tool, till multiple
    • G05B2219/49084—Control roughness of surface
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20076—Probabilistic image processing
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30164—Workpiece; Machine component

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Automation & Control Theory (AREA)
  • Human Computer Interaction (AREA)
  • Quality & Reliability (AREA)
  • Probability & Statistics with Applications (AREA)
  • Laser Beam Processing (AREA)

Abstract

Przedmiotem zgłoszenia jest sposób obróbki laserowej przedmiotu obrabianego (2), korzystnie z materiału metalicznego, obejmujący co najmniej następujące etapy: a) kierowanie wiązki laserowej (5) na przedmiot obrabiany (2) w strefie obróbki (7) przedmiotu obrabianego (2) w celu wykonania obróbki laserowej; b) wykonywanie ruchu względnego między wiązką laserową (5) i przedmiotem obrabianym (2); c) pozyskiwanie sygnałów optycznych, korzystniej wielu pozyskanych obrazów, ze strefy obróbki (7); d) określanie przebiegu czasowego jednego lub większej liczby parametrów charakterystycznych uzyskanych na podstawie sygnałów optycznych, korzystniej z wielu pozyskanych obrazów; e) szacowanie chropowatości uzyskanej podczas obróbki laserowej, w zależności od każdego przebiegu czasowego jednego lub większej liczby parametrów charakterystycznych. Podczas etapu e) określa się co najmniej jeden odpowiedni parametr statystyczny na podstawie przebiegu czasowego jednego lub większej liczby parametrów charakterystycznych, a następnie obliczane jest ciągłe oszacowanie w czasie rzeczywistym chropowatości w funkcji każdego określonego parametru statystycznego.
PL452449A 2022-10-25 2023-06-26 Sposób i urządzenie do obróbki laserowej z szacowaniem chropowatości PL452449A1 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IT102022000022038A IT202200022038A1 (it) 2022-10-25 2022-10-25 Procedimento e macchina per una lavorazione laser con stima di rugosita
PCT/IB2023/056574 WO2024089476A1 (en) 2022-10-25 2023-06-26 Method of and machine for a laser processing with roughness estimation

Publications (1)

Publication Number Publication Date
PL452449A1 true PL452449A1 (pl) 2026-01-19

Family

ID=84943463

Family Applications (1)

Application Number Title Priority Date Filing Date
PL452449A PL452449A1 (pl) 2022-10-25 2023-06-26 Sposób i urządzenie do obróbki laserowej z szacowaniem chropowatości

Country Status (10)

Country Link
US (1) US20250162066A1 (pl)
JP (1) JP2025535953A (pl)
KR (1) KR20250092258A (pl)
CN (1) CN120418739A (pl)
DE (1) DE112023004439T5 (pl)
ES (1) ES3030232R1 (pl)
GB (1) GB2639165A (pl)
IT (1) IT202200022038A1 (pl)
PL (1) PL452449A1 (pl)
WO (1) WO2024089476A1 (pl)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MX2011005335A (es) * 2008-11-21 2011-10-11 Precitec Kg Metodo y dispositivo para monitorear una operacion de procesamiento laser a ser realizada sobre una pieza de trabajo y cabeza de procesamiento laser que tiene dicho dispositivo.
WO2012000648A1 (en) * 2010-06-28 2012-01-05 Precitec Kg Method for closed-loop controlling a laser processing operation and laser material processing head using the same
WO2019244484A1 (ja) * 2018-06-22 2019-12-26 三菱電機株式会社 レーザ加工装置
DE102020112116A1 (de) * 2020-05-05 2021-11-11 Precitec Gmbh & Co. Kg Verfahren zum Analysieren eines Laserbearbeitungsprozesses, System zum Analysieren eines Laserbearbeitungsprozesses und Laserbearbeitungssystem mit einem solchen System

Also Published As

Publication number Publication date
DE112023004439T5 (de) 2025-09-04
GB202505816D0 (en) 2025-06-04
CN120418739A (zh) 2025-08-01
ES3030232A2 (es) 2025-06-26
IT202200022038A1 (it) 2024-04-25
JP2025535953A (ja) 2025-10-30
WO2024089476A1 (en) 2024-05-02
ES3030232R1 (es) 2025-06-30
US20250162066A1 (en) 2025-05-22
GB2639165A (en) 2025-09-10
KR20250092258A (ko) 2025-06-23

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