ES448545A1 - Perfeccionamientos en componentes semiconductores goberna- bles. - Google Patents

Perfeccionamientos en componentes semiconductores goberna- bles.

Info

Publication number
ES448545A1
ES448545A1 ES448545A ES448545A ES448545A1 ES 448545 A1 ES448545 A1 ES 448545A1 ES 448545 A ES448545 A ES 448545A ES 448545 A ES448545 A ES 448545A ES 448545 A1 ES448545 A1 ES 448545A1
Authority
ES
Spain
Prior art keywords
metal bodies
conically shaped
semiconductor component
lead
anode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES448545A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Publication of ES448545A1 publication Critical patent/ES448545A1/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type

Landscapes

  • Die Bonding (AREA)
  • Thyristors (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
ES448545A 1975-06-06 1976-06-04 Perfeccionamientos en componentes semiconductores goberna- bles. Expired ES448545A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19752525390 DE2525390A1 (de) 1975-06-06 1975-06-06 Steuerbares halbleiterbauelement

Publications (1)

Publication Number Publication Date
ES448545A1 true ES448545A1 (es) 1977-07-01

Family

ID=5948506

Family Applications (1)

Application Number Title Priority Date Filing Date
ES448545A Expired ES448545A1 (es) 1975-06-06 1976-06-04 Perfeccionamientos en componentes semiconductores goberna- bles.

Country Status (7)

Country Link
US (1) US4041523A (es)
JP (1) JPS5231678A (es)
DE (1) DE2525390A1 (es)
ES (1) ES448545A1 (es)
FR (1) FR2313776A1 (es)
GB (1) GB1502066A (es)
IT (1) IT1060796B (es)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5563650A (en) * 1978-11-02 1980-05-13 Nitsupi Kousan Kk Full automatic sterilizer
US4263607A (en) * 1979-03-06 1981-04-21 Alsthom-Atlantique Snap fit support housing for a semiconductor power wafer
JPS55160437A (en) * 1979-05-31 1980-12-13 Hitachi Ltd Semiconductor device
DE3221794A1 (de) * 1982-06-09 1983-12-15 Brown, Boveri & Cie Ag, 6800 Mannheim Scheibenfoermige halbleiterzelle fuer druckkontaktierbare leistungshalbleiterbauelemente
JPS5951852A (ja) * 1982-09-17 1984-03-26 三洋電機株式会社 蒸気式滅菌器
US4587377A (en) * 1984-09-21 1986-05-06 Illinois Tool Works Inc. Electrically insulating fastener for heat sinks of different thicknesses
WO1997022145A1 (en) * 1995-12-14 1997-06-19 Philips Electronics N.V. Method of manufacturing a semiconductor device for surface mounting suitable for comparatively high voltages, and such a semiconductor device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3513361A (en) * 1968-05-09 1970-05-19 Westinghouse Electric Corp Flat package electrical device
US3525910A (en) * 1968-05-31 1970-08-25 Westinghouse Electric Corp Contact system for intricate geometry devices
US3636419A (en) * 1969-07-11 1972-01-18 Siemens Ag Pressure-biased semiconductor component free from damage to semiconductor body
BE790502A (fr) * 1971-10-26 1973-04-25 Westinghouse Electric Corp Dispositif semiconducteur encapsule a l'aide d'un elastomere
US3962719A (en) * 1974-12-05 1976-06-08 Plastronics, Inc. Mounting pad and semiconductor encapsulation device combination

Also Published As

Publication number Publication date
FR2313776A1 (fr) 1976-12-31
US4041523A (en) 1977-08-09
GB1502066A (en) 1978-02-22
IT1060796B (it) 1982-09-30
JPS5231678A (en) 1977-03-10
DE2525390A1 (de) 1976-12-16
JPS5750073B2 (es) 1982-10-25

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