ES449379A1 - Perfeccionamientos introducidos en estructuras de circuito de capas multiples. - Google Patents

Perfeccionamientos introducidos en estructuras de circuito de capas multiples.

Info

Publication number
ES449379A1
ES449379A1 ES449379A ES449379A ES449379A1 ES 449379 A1 ES449379 A1 ES 449379A1 ES 449379 A ES449379 A ES 449379A ES 449379 A ES449379 A ES 449379A ES 449379 A1 ES449379 A1 ES 449379A1
Authority
ES
Spain
Prior art keywords
circuit boards
ceramic composition
ceramic capacitors
conductor
sintering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES449379A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NL Industries Inc
Original Assignee
NL Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NL Industries Inc filed Critical NL Industries Inc
Publication of ES449379A1 publication Critical patent/ES449379A1/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/101—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by casting or moulding of conductive material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H01G4/302—Stacked capacitors obtained by injection of metal in cavities formed in a ceramic body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/128—Molten metals, e.g. casting thereof, or melting by heating and excluding molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/308—Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
ES449379A 1973-09-24 1976-06-30 Perfeccionamientos introducidos en estructuras de circuito de capas multiples. Expired ES449379A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US40024273A 1973-09-24 1973-09-24

Publications (1)

Publication Number Publication Date
ES449379A1 true ES449379A1 (es) 1977-08-01

Family

ID=23582798

Family Applications (3)

Application Number Title Priority Date Filing Date
ES430301A Expired ES430301A1 (es) 1973-09-24 1974-09-23 Un procedimiento para formar cuerpos ceramicos unitarios quetienen electrodos o conductores internos.
ES449379A Expired ES449379A1 (es) 1973-09-24 1976-06-30 Perfeccionamientos introducidos en estructuras de circuito de capas multiples.
ES449378A Expired ES449378A1 (es) 1973-09-24 1976-06-30 Perfeccionamientos introducidos en condensadores ceramicos.

Family Applications Before (1)

Application Number Title Priority Date Filing Date
ES430301A Expired ES430301A1 (es) 1973-09-24 1974-09-23 Un procedimiento para formar cuerpos ceramicos unitarios quetienen electrodos o conductores internos.

Family Applications After (1)

Application Number Title Priority Date Filing Date
ES449378A Expired ES449378A1 (es) 1973-09-24 1976-06-30 Perfeccionamientos introducidos en condensadores ceramicos.

Country Status (18)

Country Link
JP (1) JPS6258124B2 (es)
AR (1) AR216889A1 (es)
AU (1) AU500529B2 (es)
BE (1) BE820287A (es)
BR (1) BR7407820D0 (es)
CH (1) CH586994A5 (es)
DE (4) DE2461996A1 (es)
ES (3) ES430301A1 (es)
FR (1) FR2245063B1 (es)
GB (1) GB1486308A (es)
IE (1) IE40174B1 (es)
IL (1) IL45512A (es)
IN (1) IN143579B (es)
IT (1) IT1022218B (es)
NL (1) NL162504C (es)
NO (1) NO743408L (es)
SE (4) SE7411924L (es)
ZA (1) ZA745838B (es)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53210A (en) * 1976-06-23 1978-01-05 Mitsubishi Electric Corp Ceramic multiilayer structures and manufacture
JPS6057212B2 (ja) * 1976-07-29 1985-12-13 タム セラミツクス インコ−ポレイテツド 単一焼結セラミック体およびその製造方法
US4289719A (en) * 1976-12-10 1981-09-15 International Business Machines Corporation Method of making a multi-layer ceramic substrate
JPS5441426A (en) * 1977-07-01 1979-04-02 Lucas Industries Ltd Battery charging state indicator
DE3015356A1 (de) * 1980-04-22 1981-10-29 Robert Bosch Gmbh, 7000 Stuttgart Freitragende schichten sowie verfahren zur herstellung freitragender schichten, insbesondere fuer sensoren fuer brennkraftmaschinen
GB2103422B (en) * 1981-07-30 1985-02-27 Standard Telephones Cables Ltd Ceramic capacitors
US4771520A (en) * 1985-04-25 1988-09-20 Murata Manufacturing Co., Ltd. Method of producing laminated ceramic capacitors
DE4121390C2 (de) * 1991-06-28 1994-10-20 Bosch Gmbh Robert Verfahren zum Herstellen einer freitragenden Dickschichtstruktur
JP3980801B2 (ja) * 1999-09-16 2007-09-26 株式会社東芝 三次元構造体およびその製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2939059A (en) * 1955-03-21 1960-05-31 Clevite Corp Capacitor of high permittivity ceramic
DE1141719B (de) * 1955-03-21 1962-12-27 Clevite Corp Keramischer Kondensator und Verfahren zu seiner Herstellung
NL294447A (es) * 1964-06-22

Also Published As

Publication number Publication date
NO743408L (es) 1975-04-21
AU7337574A (en) 1976-03-25
NL7412599A (nl) 1975-03-26
AR216889A1 (es) 1980-02-15
SE7411924L (es) 1975-03-25
FR2245063B1 (es) 1980-04-11
DE2445086C2 (de) 1985-11-21
NL162504C (nl) 1980-05-16
DE2461995B2 (de) 1979-01-11
DE2461995C3 (de) 1979-09-13
IL45512A0 (en) 1974-11-29
DE2461997A1 (de) 1975-11-20
DE2461995A1 (de) 1975-11-20
ES449378A1 (es) 1977-08-01
FR2245063A1 (es) 1975-04-18
AU500529B2 (en) 1979-05-24
DE2461997C2 (de) 1985-12-05
IN143579B (es) 1977-12-31
IL45512A (en) 1977-05-31
SE7800028L (sv) 1978-01-02
BE820287A (fr) 1975-01-16
SE7800026L (sv) 1978-01-02
ZA745838B (en) 1975-11-26
BR7407820D0 (pt) 1975-07-15
JPS5060507A (es) 1975-05-24
CH586994A5 (es) 1977-04-15
NL162504B (nl) 1979-12-17
IE40174B1 (en) 1979-03-28
GB1486308A (en) 1977-09-21
IE40174L (en) 1975-03-24
JPS6258124B2 (es) 1987-12-04
SE7800027L (sv) 1978-01-02
DE2461996A1 (de) 1975-11-20
DE2445086A1 (de) 1975-05-28
IT1022218B (it) 1978-03-20
ES430301A1 (es) 1977-02-16

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