ES466030A1 - Procedimiento para la fabricacion de materiales thinclad para circuitos impresos. - Google Patents

Procedimiento para la fabricacion de materiales thinclad para circuitos impresos.

Info

Publication number
ES466030A1
ES466030A1 ES466030A ES466030A ES466030A1 ES 466030 A1 ES466030 A1 ES 466030A1 ES 466030 A ES466030 A ES 466030A ES 466030 A ES466030 A ES 466030A ES 466030 A1 ES466030 A1 ES 466030A1
Authority
ES
Spain
Prior art keywords
metal layer
printed circuits
thinclad
producing
materials
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES466030A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ferrozell Sachs & Co GmbH
Original Assignee
Ferrozell Sachs & Co GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ferrozell Sachs & Co GmbH filed Critical Ferrozell Sachs & Co GmbH
Publication of ES466030A1 publication Critical patent/ES466030A1/es
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0004—Cutting, tearing or severing, e.g. bursting; Cutter details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/208—Magnetic, paramagnetic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Physical Vapour Deposition (AREA)
  • Insulating Bodies (AREA)
ES466030A 1976-12-30 1977-12-29 Procedimiento para la fabricacion de materiales thinclad para circuitos impresos. Expired ES466030A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2659625A DE2659625C3 (de) 1976-12-30 1976-12-30 Verfahren zur Herstellung von Basismaterial zur Herstellung gedruckter Schaltungen

Publications (1)

Publication Number Publication Date
ES466030A1 true ES466030A1 (es) 1978-10-01

Family

ID=5997078

Family Applications (1)

Application Number Title Priority Date Filing Date
ES466030A Expired ES466030A1 (es) 1976-12-30 1977-12-29 Procedimiento para la fabricacion de materiales thinclad para circuitos impresos.

Country Status (11)

Country Link
JP (1) JPS53111480A (es)
BE (1) BE862476A (es)
BR (1) BR7708768A (es)
CH (1) CH627405A5 (es)
DE (1) DE2659625C3 (es)
ES (1) ES466030A1 (es)
FR (1) FR2376593A1 (es)
GB (1) GB1595245A (es)
IT (1) IT1091341B (es)
NL (1) NL7714506A (es)
SE (1) SE7714867L (es)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2486875A1 (fr) * 1980-07-17 1982-01-22 Dassault Avions Procede pour metalliser au moins partiellement la surface d'une piece stratifiee
DE3631055C1 (de) * 1986-09-12 1987-05-21 Deutsche Automobilgesellsch Verfahren zum kontinuierlichen Traenken von Vliesstoff- oder Nadelfilzbahnen mit einer Aktivierungsloesung
CN107529293B (zh) * 2017-09-18 2019-05-28 Oppo广东移动通信有限公司 一种移动终端、多层pcb电路板及其制造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL217955A (es) * 1957-06-07 Philips Nv
DE1171485B (de) * 1960-07-25 1964-06-04 Photocircuits Corp Verfahren zum Herstellen von elektrischen Bau-elementen nach Art der gedruckten Schaltungen
NL135706C (es) * 1966-07-29 1900-01-01
DE1646064C3 (de) * 1966-12-29 1978-05-24 Politechnika Slaska Im. Wincentego Pstrowskiego, Gleiwitz (Polen) Verfahren zur Herstellung von mit Polyesterharzen beschichteten Metallfolien für elektro- und radiotechnische sowie elektronische Zwecke
DE1690025B2 (de) * 1967-08-09 1976-10-07 Schering Ag, 1000 Berlin Und 4619 Bergkamen Vorbehandlungsverfahren fuer duenne isolierfolien aus polyaethylenterephthalat
BE788117A (fr) * 1971-08-30 1973-02-28 Perstorp Ab Procede de production d'elements pour circuits imprimes
DE2413932C2 (de) * 1973-04-25 1984-08-30 Yates Industries, Inc., Bordentown, N.J. Verfahren zum Herstellen einer Verbundfolie für die Ausbildung gedruckter Schaltkreise
JPS5143571A (ja) * 1974-10-09 1976-04-14 Hiroki Katsuki Keesuisosochi

Also Published As

Publication number Publication date
JPS5731675B2 (es) 1982-07-06
FR2376593B1 (es) 1980-07-04
SE7714867L (sv) 1978-07-01
DE2659625A1 (de) 1978-07-06
FR2376593A1 (fr) 1978-07-28
GB1595245A (en) 1981-08-12
NL7714506A (nl) 1978-07-04
CH627405A5 (en) 1982-01-15
JPS53111480A (en) 1978-09-29
BE862476A (fr) 1978-04-14
DE2659625B2 (de) 1979-01-11
IT1091341B (it) 1985-07-06
DE2659625C3 (de) 1981-07-02
BR7708768A (pt) 1978-09-05

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