ES480922A1 - Metodo y aparato para soldar componentes a un substrato de -pelicula gruesa. - Google Patents

Metodo y aparato para soldar componentes a un substrato de -pelicula gruesa.

Info

Publication number
ES480922A1
ES480922A1 ES480922A ES480922A ES480922A1 ES 480922 A1 ES480922 A1 ES 480922A1 ES 480922 A ES480922 A ES 480922A ES 480922 A ES480922 A ES 480922A ES 480922 A1 ES480922 A1 ES 480922A1
Authority
ES
Spain
Prior art keywords
thick
film substrate
soldering components
soldering
substrates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES480922A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of ES480922A1 publication Critical patent/ES480922A1/es
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating processes for reflow soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0776—Uses of liquids not otherwise provided for in H05K2203/0759 - H05K2203/0773
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/111—Preheating, e.g. before soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1581—Treating the backside of the PCB, e.g. for heating during soldering or providing a liquid coating on the backside

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)

Abstract

Método de soldar componentes a un substrato de película gruesa que está provisto localmente de una capa de pasta de soldar, siendo precalentado el sustrato con los componentes descansando sobre la pasta de soldar, hasta una temperatura inferior al punto de fusión de la soldadura durante una fase de precalentamiento, después de la cual es calentado, durante una fase de soldadura, de modo que la soldadura comience a fundirse y a fluir, después de la cual es enfriado durante una fase de enfriamiento hasta una temperatura inferior al punto de fusión de la soldadura, caracterizado porque durante cada una de las tres fases, el sustrato que lleva la capa de pasta de soldar y los componentes, es puesto en contacto con metal fundido caliente que sirve como medio de transmisión de calor; enfriándose el sustrato a un régimen acelerado durante la fase de enfriamiento.
ES480922A 1978-05-29 1979-05-25 Metodo y aparato para soldar componentes a un substrato de -pelicula gruesa. Expired ES480922A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7805800A NL7805800A (nl) 1978-05-29 1978-05-29 Werkwijze en inrichting voor het solderen van onderde- len op een gatloos dikke-film substraat alsmede dikke-film substraat met onderdelen gesoldeerd met de werkwijze.

Publications (1)

Publication Number Publication Date
ES480922A1 true ES480922A1 (es) 1979-12-01

Family

ID=19830932

Family Applications (1)

Application Number Title Priority Date Filing Date
ES480922A Expired ES480922A1 (es) 1978-05-29 1979-05-25 Metodo y aparato para soldar componentes a un substrato de -pelicula gruesa.

Country Status (7)

Country Link
US (1) US4332342A (es)
EP (1) EP0005883B1 (es)
JP (1) JPS54156173A (es)
AT (1) ATE602T1 (es)
DE (1) DE2961866D1 (es)
ES (1) ES480922A1 (es)
NL (1) NL7805800A (es)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6051939B2 (ja) * 1981-06-02 1985-11-16 権士 近藤 噴流式はんだ槽
EP0109988B1 (en) * 1982-11-24 1987-01-28 Nihon Den-Netsu Keiki Co., Ltd. Soldering apparatus
US4697730A (en) * 1984-05-25 1987-10-06 The Htc Corporation Continuous solder system
US4693408A (en) * 1985-02-14 1987-09-15 American Telephone And Telegraph, Company At&T Technologies, Inc. Apparatus for bonding connector terminals to circuit boards
US4653682A (en) * 1985-02-14 1987-03-31 At&T Technologies, Inc. Method and apparatus for bonding connector terminals to circuit boards
US4657172A (en) * 1985-10-31 1987-04-14 American Microsystems, Inc. Apparatus and method of solder coating integrated circuit leads
US4747533A (en) * 1986-04-28 1988-05-31 International Business Machines Corporation Bonding method and apparatus
US4805831A (en) * 1986-04-28 1989-02-21 International Business Machines Corporation Bonding method
US4805828A (en) * 1987-01-23 1989-02-21 Rockwell International Corporation Thermally durable surface mounted device printed wiring assemblies and apparatus and method for manufacture and repair
DE4103098C1 (es) * 1991-02-01 1992-06-25 Helmut Walter 8901 Koenigsbrunn De Leicht
JP3103410B2 (ja) * 1991-12-20 2000-10-30 大阪酸素工業株式会社 特殊雰囲気ガスを用いたはんだ付け方法
US5230462A (en) * 1992-07-08 1993-07-27 Materials Research Corporation Method of soldering a sputtering target to a backing member
DE4302976A1 (de) * 1992-07-22 1994-01-27 Bosch Gmbh Robert Vorrichtung und Verfahren zum Auflöten von Bauelementen auf Platinen
JP2000244108A (ja) * 1999-02-22 2000-09-08 Senju Metal Ind Co Ltd プリント基板のはんだ付け方法、プリント基板のはんだ付け装置およびはんだ付け装置用冷却装置
WO2005107991A1 (de) * 2004-04-08 2005-11-17 Kirsten Soldering Ag Wellenlötanlage und verfahren zum wellenlöten
US7730772B2 (en) * 2007-12-28 2010-06-08 Honeywell International Inc. Surface acoustic wave sensor and package
US7726184B2 (en) * 2007-12-28 2010-06-01 Honeywell International Inc. Surface acoustic wave sensor and package
US8384524B2 (en) * 2008-11-26 2013-02-26 Honeywell International Inc. Passive surface acoustic wave sensing system
US8317392B2 (en) * 2008-12-23 2012-11-27 Honeywell International Inc. Surface acoustic wave based micro-sensor apparatus and method for simultaneously monitoring multiple conditions

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2495150A (en) * 1945-04-02 1950-01-17 Packard Motor Car Co Method of conditioning metal members for a welding operation
US2869497A (en) * 1954-01-11 1959-01-20 Sylvania Electric Prod Soldering machine
US3217959A (en) * 1963-04-17 1965-11-16 Philco Corp Soldering apparatus
US3500536A (en) * 1966-11-17 1970-03-17 Burroughs Corp Process for finishing solder joints on a circuit board
US3765591A (en) * 1972-01-19 1973-10-16 Dynamics Corp America Wave soldering electrical connections
US3778883A (en) * 1972-06-02 1973-12-18 Honeywell Inf Systems Process of mass soldering electrical components to circuit boards having runs formed from insulated magnet wire
US3825994A (en) * 1972-11-15 1974-07-30 Rca Corp Method of soldering circuit components to a substrate

Also Published As

Publication number Publication date
ATE602T1 (de) 1982-02-15
EP0005883A1 (de) 1979-12-12
NL7805800A (nl) 1979-12-03
US4332342A (en) 1982-06-01
DE2961866D1 (en) 1982-03-04
JPS6157720B2 (es) 1986-12-08
EP0005883B1 (de) 1982-01-20
JPS54156173A (en) 1979-12-08

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