ES481012A1 - Dispositivo schottky y procedimiento para su fabricacion. - Google Patents
Dispositivo schottky y procedimiento para su fabricacion.Info
- Publication number
- ES481012A1 ES481012A1 ES481012A ES481012A ES481012A1 ES 481012 A1 ES481012 A1 ES 481012A1 ES 481012 A ES481012 A ES 481012A ES 481012 A ES481012 A ES 481012A ES 481012 A1 ES481012 A1 ES 481012A1
- Authority
- ES
- Spain
- Prior art keywords
- metal
- manufacture
- procedure
- schottky device
- schottky
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D8/00—Diodes
- H10D8/60—Schottky-barrier diodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/01—Manufacture or treatment
- H10D64/012—Manufacture or treatment of electrodes comprising a Schottky barrier to a semiconductor
- H10D64/0121—Manufacture or treatment of electrodes comprising a Schottky barrier to a semiconductor to Group IV semiconductors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/64—Electrodes comprising a Schottky barrier to a semiconductor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/139—Schottky barrier
Landscapes
- Electrodes Of Semiconductors (AREA)
Abstract
Dispositivo "Schottky" y procedimiento para su fabricación que comprende un substrato semiconductor monocristal, caracterizado porque un primer metal difundido sobre una porción de superficie de dicho substrato forma una aleación intermétalica de dicho metal y dicho semiconductor; y un segundo metal en contacto de superficie a superficie con dicho primer metal; este segundo metal tiene una alta función de trabajo. El primer metal se selecciona del grupo que comprende paladio y platino.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US05/911,764 US4206540A (en) | 1978-06-02 | 1978-06-02 | Schottky device and method of manufacture using palladium and platinum intermetallic alloys and titanium barrier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES481012A1 true ES481012A1 (es) | 1980-07-16 |
Family
ID=25430828
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES481012A Expired ES481012A1 (es) | 1978-06-02 | 1979-05-29 | Dispositivo schottky y procedimiento para su fabricacion. |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US4206540A (es) |
| JP (1) | JPS54159183A (es) |
| DE (1) | DE2921971C2 (es) |
| ES (1) | ES481012A1 (es) |
| FR (1) | FR2427688A1 (es) |
| GB (2) | GB2022318B (es) |
| IT (1) | IT1165084B (es) |
| SE (1) | SE440293B (es) |
Families Citing this family (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4546374A (en) * | 1981-03-23 | 1985-10-08 | Motorola Inc. | Semiconductor device including plateless package |
| US4398344A (en) * | 1982-03-08 | 1983-08-16 | International Rectifier Corporation | Method of manufacture of a schottky using platinum encapsulated between layers of palladium sintered into silicon surface |
| US4638551A (en) * | 1982-09-24 | 1987-01-27 | General Instrument Corporation | Schottky barrier device and method of manufacture |
| JPS59210642A (ja) * | 1983-05-16 | 1984-11-29 | Hitachi Ltd | 半導体装置の製造方法 |
| US4899199A (en) * | 1983-09-30 | 1990-02-06 | International Rectifier Corporation | Schottky diode with titanium or like layer contacting the dielectric layer |
| US4742377A (en) * | 1985-02-21 | 1988-05-03 | General Instrument Corporation | Schottky barrier device with doped composite guard ring |
| US4687537A (en) * | 1986-04-15 | 1987-08-18 | Rca Corporation | Epitaxial metal silicide layers |
| JPS6373660A (ja) * | 1986-09-17 | 1988-04-04 | Fujitsu Ltd | 半導体装置 |
| US5130172A (en) * | 1988-10-21 | 1992-07-14 | The Regents Of The University Of California | Low temperature organometallic deposition of metals |
| US4925812A (en) * | 1989-09-21 | 1990-05-15 | International Rectifier Corporation | Platinum diffusion process |
| GB2265636B (en) * | 1989-09-21 | 1994-05-18 | Int Rectifier Corp | Platinum diffusion process |
| AT399419B (de) * | 1989-09-21 | 1995-05-26 | Int Rectifier Corp | Verfahren zur einführung von platinatomen in eine siliziumscheibe zur verringerung der minoritätsträger-lebensdauer |
| IT1247293B (it) * | 1990-05-09 | 1994-12-12 | Int Rectifier Corp | Dispositivo transistore di potenza presentante una regione ultra-profonda, a maggior concentrazione |
| US5047367A (en) * | 1990-06-08 | 1991-09-10 | Intel Corporation | Process for formation of a self aligned titanium nitride/cobalt silicide bilayer |
| US5536684A (en) * | 1994-06-30 | 1996-07-16 | Intel Corporation | Process for formation of epitaxial cobalt silicide and shallow junction of silicon |
| US5888891A (en) * | 1996-08-23 | 1999-03-30 | International Rectifier Corporation | Process for manufacturing a schottky diode with enhanced barrier height and high thermal stability |
| DE19939484A1 (de) * | 1998-09-01 | 2000-03-09 | Int Rectifier Corp | Schottky-Diode |
| US6184564B1 (en) * | 1998-12-28 | 2001-02-06 | International Rectifier Corp. | Schottky diode with adjusted barrier height and process for its manufacture |
| US6690037B1 (en) | 2000-08-31 | 2004-02-10 | Agere Systems Inc. | Field plated Schottky diode |
| JP2002353182A (ja) * | 2001-05-25 | 2002-12-06 | Mitsubishi Electric Corp | 半導体装置の洗浄方法および洗浄装置、ならびに半導体装置の製造方法 |
| US7061067B2 (en) * | 2003-07-04 | 2006-06-13 | Matsushita Electric Industrial Co., Ltd. | Schottky barrier diode |
| US7394158B2 (en) * | 2004-10-21 | 2008-07-01 | Siliconix Technology C.V. | Solderable top metal for SiC device |
| US7812441B2 (en) | 2004-10-21 | 2010-10-12 | Siliconix Technology C.V. | Schottky diode with improved surge capability |
| US7834376B2 (en) | 2005-03-04 | 2010-11-16 | Siliconix Technology C. V. | Power semiconductor switch |
| US9419092B2 (en) * | 2005-03-04 | 2016-08-16 | Vishay-Siliconix | Termination for SiC trench devices |
| DE102005026301B3 (de) * | 2005-06-08 | 2007-01-11 | Atmel Germany Gmbh | Verfahren zum Herstellen eines Metall- Halbleiter-Kontakts bei Halbleiterbauelementen |
| US7923362B2 (en) * | 2005-06-08 | 2011-04-12 | Telefunken Semiconductors Gmbh & Co. Kg | Method for manufacturing a metal-semiconductor contact in semiconductor components |
| CN101223638A (zh) * | 2005-07-05 | 2008-07-16 | 国际整流器公司 | 具有改进的浪涌能力的肖特基二极管 |
| US8368165B2 (en) | 2005-10-20 | 2013-02-05 | Siliconix Technology C. V. | Silicon carbide Schottky diode |
| US7749877B2 (en) * | 2006-03-07 | 2010-07-06 | Siliconix Technology C. V. | Process for forming Schottky rectifier with PtNi silicide Schottky barrier |
| EP2047514A4 (en) | 2006-07-31 | 2010-12-01 | Vishay Siliconix | MOLYBDENUM BARRIER METAL FOR SIC SCHOTTKY DIODE AND METHOD FOR MANUFACTURING THE SAME |
| DE102009018971A1 (de) * | 2009-04-25 | 2010-11-04 | Secos Halbleitertechnologie Gmbh | Konstruktion einer Schottkydiode mit verbessertem Hochstromverhalten und Verfahren zu deren Herstellung |
| US8784572B2 (en) * | 2011-10-19 | 2014-07-22 | Intermolecular, Inc. | Method for cleaning platinum residues on a semiconductor substrate |
| EP3268991A1 (de) | 2015-06-02 | 2018-01-17 | Diotec Semiconductor AG | Verbesserte halbleiteranordnung mit schottky-diode |
| CN109585570A (zh) * | 2018-12-19 | 2019-04-05 | 吉林麦吉柯半导体有限公司 | 肖特基二极管、nipt95合金及肖特基二极管的制造方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1107700A (en) * | 1966-03-29 | 1968-03-27 | Matsushita Electronics Corp | A method for manufacturing semiconductor devices |
| BE736650A (es) * | 1968-08-01 | 1969-12-31 | ||
| US3669730A (en) * | 1970-04-24 | 1972-06-13 | Bell Telephone Labor Inc | Modifying barrier layer devices |
| IT1002232B (it) * | 1972-12-26 | 1976-05-20 | Gen Electric | Contatti a barriera schottky e metodi per fare i medesimi |
| US3938243A (en) * | 1973-02-20 | 1976-02-17 | Signetics Corporation | Schottky barrier diode semiconductor structure and method |
| US3906540A (en) * | 1973-04-02 | 1975-09-16 | Nat Semiconductor Corp | Metal-silicide Schottky diode employing an aluminum connector |
| US3968272A (en) * | 1974-01-25 | 1976-07-06 | Microwave Associates, Inc. | Zero-bias Schottky barrier detector diodes |
| US4110488A (en) * | 1976-04-09 | 1978-08-29 | Rca Corporation | Method for making schottky barrier diodes |
| US4063964A (en) * | 1976-12-27 | 1977-12-20 | International Business Machines Corporation | Method for forming a self-aligned schottky barrier device guardring |
-
1978
- 1978-06-02 US US05/911,764 patent/US4206540A/en not_active Expired - Lifetime
-
1979
- 1979-05-16 SE SE7904305A patent/SE440293B/sv unknown
- 1979-05-23 FR FR7913119A patent/FR2427688A1/fr active Granted
- 1979-05-29 ES ES481012A patent/ES481012A1/es not_active Expired
- 1979-05-30 DE DE2921971A patent/DE2921971C2/de not_active Expired
- 1979-06-01 JP JP6877679A patent/JPS54159183A/ja active Granted
- 1979-06-01 GB GB7919107A patent/GB2022318B/en not_active Expired
- 1979-06-01 IT IT23215/79A patent/IT1165084B/it active
- 1979-06-01 GB GB7914677A patent/GB2044534B/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| DE2921971A1 (de) | 1979-12-06 |
| US4206540A (en) | 1980-06-10 |
| GB2044534A (en) | 1980-10-15 |
| GB2044534B (en) | 1982-09-08 |
| SE7904305L (sv) | 1979-12-03 |
| FR2427688A1 (fr) | 1979-12-28 |
| FR2427688B1 (es) | 1984-10-26 |
| JPS54159183A (en) | 1979-12-15 |
| IT1165084B (it) | 1987-04-22 |
| IT7923215A0 (it) | 1979-06-01 |
| GB2022318B (en) | 1982-09-15 |
| JPS6226593B2 (es) | 1987-06-09 |
| SE440293B (sv) | 1985-07-22 |
| GB2022318A (en) | 1979-12-12 |
| DE2921971C2 (de) | 1983-09-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| ES481012A1 (es) | Dispositivo schottky y procedimiento para su fabricacion. | |
| DE69324024D1 (de) | Ohmsche kontaktstruktur zwischen platin und siliziumkarbid | |
| KR910009957A (ko) | 기판상에 알루미늄 또는 알루미늄 합금 트랙을 제공하는 방법 | |
| ES2028084T3 (es) | Un catodo adecuado para su uso en procesos electroquimicos que desprenden hidrogeno. | |
| JPS51130174A (en) | Semiconductor device process | |
| JPS5618466A (en) | Manufacture of semiconductor device | |
| JPS523383A (en) | Manufacturing method of semiconductor device electrode | |
| JPS51134566A (en) | Semiconductor unit manufacturing process | |
| JPS5318973A (en) | Production of two kinds of schottky barrier diodes | |
| JPS52117584A (en) | Mos type semiconductor device | |
| ATE103418T1 (de) | Feldeffekttransistor und verfahren zum herstellen eines feldeffenkttransistors. | |
| JPS5325350A (en) | Dicing method of semiconductor substrates | |
| JPS5674933A (en) | Preparation method of semiconductor device | |
| JPS5311591A (en) | Semiconductor laser device | |
| JPS5667933A (en) | Scribe method of semiconductor wafer | |
| NEGRERIE et al. | OXIDATION OF BRASS 67/33 DURING ANNEALING: EFFECT OF SURFACE CLEANNESS ON COMPOSITION AND PROPERTIES OF THE SCALE LAYER | |
| KR950025856A (ko) | 대구경 반도체 웨이퍼의 균일도 향상방법 | |
| JPS5365671A (en) | Schottky barrier semiconductor device and its manufacture | |
| KR910017664A (ko) | 바이폴라 트랜지스터 제조방법 | |
| JPS5210676A (en) | Semiconductor device | |
| JPS53110461A (en) | Semiconductor device | |
| JPS52147967A (en) | Test method for p-n junction depth | |
| KR970028872A (ko) | 반도체소자 제조용 습식 식각조에서의 웨이퍼 식각방법 | |
| JPS52139368A (en) | Semiconductor device | |
| JPS56110237A (en) | Semiconductor device |