ES483430A1 - Dispositivo de refrigeracion por ebullicion para evacuar el calor de perdidas de energia en semiconductores. - Google Patents

Dispositivo de refrigeracion por ebullicion para evacuar el calor de perdidas de energia en semiconductores.

Info

Publication number
ES483430A1
ES483430A1 ES483430A ES483430A ES483430A1 ES 483430 A1 ES483430 A1 ES 483430A1 ES 483430 A ES483430 A ES 483430A ES 483430 A ES483430 A ES 483430A ES 483430 A1 ES483430 A1 ES 483430A1
Authority
ES
Spain
Prior art keywords
coolant
heat sink
flow
dipped
boiling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES483430A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Licentia Patent Verwaltungs GmbH
Original Assignee
Licentia Patent Verwaltungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Licentia Patent Verwaltungs GmbH filed Critical Licentia Patent Verwaltungs GmbH
Publication of ES483430A1 publication Critical patent/ES483430A1/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

1. Dispositivo de refrigeración por ebullición para evacuar el calor de pérdidas de energía en semiconductores de potencia en forma constructiva de disco, el cual está sumergido juntamente con el semiconductor de potencia en un líquido refrigerante de bajo punto de ebullición, no conductor de la electricidad (líquido de refrigeración por ebullición) caracterizado por una superficie áspera formada mediante moleteado, tratamiento con arena, graneado o colada con aspereza superficial, que favorece la formación de burbujas de gas que aparece al hervir el líquido de refrigeración por ebullición, y también la liberación de las burbujas.
ES483430A 1978-08-19 1979-08-16 Dispositivo de refrigeracion por ebullicion para evacuar el calor de perdidas de energia en semiconductores. Expired ES483430A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19782836710 DE2836710A1 (de) 1978-08-19 1978-08-19 Siedekuehlkoerper

Publications (1)

Publication Number Publication Date
ES483430A1 true ES483430A1 (es) 1980-06-16

Family

ID=6047659

Family Applications (1)

Application Number Title Priority Date Filing Date
ES483430A Expired ES483430A1 (es) 1978-08-19 1979-08-16 Dispositivo de refrigeracion por ebullicion para evacuar el calor de perdidas de energia en semiconductores.

Country Status (4)

Country Link
DE (1) DE2836710A1 (es)
DK (1) DK345079A (es)
ES (1) ES483430A1 (es)
IT (1) IT1122461B (es)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3642723A1 (de) * 1986-12-13 1988-06-23 Grundfos Int Statischer frequenzumrichter, insbesondere frequenzumrichter zur steuerung und/oder regelung von leistungsgroessen eines elektromotors
DE3825981A1 (de) * 1988-07-27 1990-02-15 Licentia Gmbh Isothermisierter kuehlkoerper
AT413163B (de) * 2001-12-18 2005-11-15 Fotec Forschungs Und Technolog Kühlvorrichtung für einen chip sowie verfahren zur herstellung
US20150022975A1 (en) * 2013-07-19 2015-01-22 General Electric Company Method and system for an immersion boiling heat sink

Also Published As

Publication number Publication date
DE2836710A1 (de) 1980-02-28
IT7925031A0 (it) 1979-08-09
IT1122461B (it) 1986-04-23
DK345079A (da) 1980-02-20

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