ES8302401A1 - Metodo para aliviar tensiones en un articulo extruido o moldeado compuesto a base de un polimero de sulfona. - Google Patents

Metodo para aliviar tensiones en un articulo extruido o moldeado compuesto a base de un polimero de sulfona.

Info

Publication number
ES8302401A1
ES8302401A1 ES508632A ES508632A ES8302401A1 ES 8302401 A1 ES8302401 A1 ES 8302401A1 ES 508632 A ES508632 A ES 508632A ES 508632 A ES508632 A ES 508632A ES 8302401 A1 ES8302401 A1 ES 8302401A1
Authority
ES
Spain
Prior art keywords
sulfone polymer
stress
stress relieving
polymer articles
ranges
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES508632A
Other languages
English (en)
Other versions
ES508632A0 (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Technologies Corp
Original Assignee
Kollmorgen Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Technologies Corp filed Critical Kollmorgen Technologies Corp
Publication of ES8302401A1 publication Critical patent/ES8302401A1/es
Publication of ES508632A0 publication Critical patent/ES508632A0/es
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C71/00—After-treatment of articles without altering their shape; Apparatus therefor
    • B29C71/02—Thermal after-treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
    • B44C1/22—Removing surface-material, e.g. by engraving, by etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C71/00—After-treatment of articles without altering their shape; Apparatus therefor
    • B29C71/04—After-treatment of articles without altering their shape; Apparatus therefor by wave energy or particle radiation, e.g. for curing or vulcanising preformed articles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0822—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using IR radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0855—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using microwave
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C71/00—After-treatment of articles without altering their shape; Apparatus therefor
    • B29C71/02—Thermal after-treatment
    • B29C2071/022—Annealing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2081/00—Use of polymers having sulfur, with or without nitrogen, oxygen or carbon only, in the main chain, as moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2081/00—Use of polymers having sulfur, with or without nitrogen, oxygen or carbon only, in the main chain, as moulding material
    • B29K2081/06—PSU, i.e. polysulfones; PES, i.e. polyethersulfones or derivatives thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/102—Using microwaves, e.g. for curing ink patterns or adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24322—Composite web or sheet

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Laminated Bodies (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

_(METODO PARA ALIVIAR TENSIONES EN UN ARTICULO EXTRUIDO O MOLDEADO, COMPUESTO A BASE DE UN POLIMERO DE SULFONA . CONSISTE EN EXPONER EL ARTICULO A RADIACION ELECTROMAGNETICA SELECCIONADA DE ENTRE MICROONDAS, INFRARROJOS Y ULTRAVIOLETAS, A UNA O VARIAS GAMAS DE FRECUENCIAS QUE SON CAPACES DE SER ABSORVIDAS POR DICHO ARTICULO Y QUE SON EFICACES PARA ALIVIAR TENSIONES SIN PROVOCAR REBLANDECIMIENTO NI FLUIDEZ INTERNA, INDUCIDO POR CALOR, DEL POLIMERO DE SULFONA, DURANTE UN PERIODO DE TIEMPO SUFICIENTE PARA ABSORBER ENERGIA BASTANTE PARA ALIVIAR TENSIONES, Y/O ESTABILIZAR DICHO POLIMERO DE SULFONA FRENTE A FISURACION POR TENSIONES.
ES508632A 1981-01-12 1982-01-11 Metodo para aliviar tensiones en un articulo extruido o moldeado compuesto a base de un polimero de sulfona. Granted ES508632A0 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/223,944 US4339303A (en) 1981-01-12 1981-01-12 Radiation stress relieving of sulfone polymer articles

Publications (2)

Publication Number Publication Date
ES8302401A1 true ES8302401A1 (es) 1983-02-01
ES508632A0 ES508632A0 (es) 1983-02-01

Family

ID=22838645

Family Applications (2)

Application Number Title Priority Date Filing Date
ES508632A Granted ES508632A0 (es) 1981-01-12 1982-01-11 Metodo para aliviar tensiones en un articulo extruido o moldeado compuesto a base de un polimero de sulfona.
ES509563A Granted ES509563A0 (es) 1981-01-12 1982-02-12 "metodo para preparar un panel de circuito de capas multiples".

Family Applications After (1)

Application Number Title Priority Date Filing Date
ES509563A Granted ES509563A0 (es) 1981-01-12 1982-02-12 "metodo para preparar un panel de circuito de capas multiples".

Country Status (17)

Country Link
US (1) US4339303A (es)
JP (1) JPS57117540A (es)
AT (1) AT384992B (es)
AU (1) AU546467B2 (es)
BE (1) BE891753A (es)
CA (1) CA1189019A (es)
CH (1) CH656809A5 (es)
DE (2) DE3249736C2 (es)
DK (1) DK7782A (es)
ES (2) ES508632A0 (es)
FR (1) FR2497813B1 (es)
GB (1) GB2094320B (es)
IL (1) IL64754A (es)
IT (1) IT1172200B (es)
NL (1) NL8200082A (es)
SE (2) SE453582B (es)
ZA (1) ZA815415B (es)

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US4424095A (en) 1981-01-12 1984-01-03 Kollmorgen Technologies Corporation Radiation stress relieving of polymer articles
ZA823981B (en) * 1982-05-21 1983-06-29 Kollmorgen Tech Corp Radiation stress relieving of polymer articles
US4520067A (en) * 1982-06-23 1985-05-28 Union Carbide Corporation Composition useful for making circuit board substrates and electrical connectors
US4861640A (en) * 1982-09-03 1989-08-29 John Fluke Mfg. Co., Inc. Molded circuit board and manufacturing method therefor
US4447471A (en) * 1982-12-30 1984-05-08 Gould Inc. Method of treating thermoplastic surfaces
EP0135589A1 (en) * 1983-03-02 1985-04-03 MITCHELL, Dennis R. Method for bonding electrical conductors to an insulating substrate
US4683036A (en) * 1983-06-10 1987-07-28 Kollmorgen Technologies Corporation Method for electroplating non-metallic surfaces
US4585502A (en) * 1984-04-27 1986-04-29 Hitachi Condenser Co., Ltd. Process for producing printed circuit board
US4641222A (en) * 1984-05-29 1987-02-03 Motorola, Inc. Mounting system for stress relief in surface mounted components
US4626309A (en) * 1984-07-02 1986-12-02 Motorola, Inc. Selective bonding interconnection mask
US5047114A (en) * 1984-11-02 1991-09-10 Amp-Akzo Corporation Process for the production of metal clad thermoplastic base materials and printed circuits on thermoplastic base materials
JPS61263726A (ja) * 1985-03-26 1986-11-21 イリノイ　トウ−ル　ワ−クス　インコ−ポレイテイド 可撓性基板の処理方法
DE3515109A1 (de) * 1985-04-26 1986-10-30 Bayer Ag, 5090 Leverkusen Kunststoffteile mit quasi dielektrisch isotropem aufbau
US4777564A (en) * 1986-10-16 1988-10-11 Motorola, Inc. Leadform for use with surface mounted components
US4859805A (en) * 1987-09-19 1989-08-22 Nippon Cmk Corp. Printed wiring board
JPH0798870B2 (ja) * 1987-12-11 1995-10-25 帝人株式会社 高分子の光加工方法
US5017311A (en) * 1988-07-21 1991-05-21 Idemitsu Kosan Co., Ltd. Method for injection molding into a resonating mold
DE4027169C2 (de) * 1989-08-31 1994-05-05 Aisin Seiki Außen-Rückspiegel für ein Kraftfahrzeug
US5259999A (en) * 1990-04-04 1993-11-09 Mitsubishi Gas Chemical Co., Inc. Process for producing resin molded article having diminished residual stress
US5245751A (en) * 1990-04-27 1993-09-21 Circuit Components, Incorporated Array connector
US5071359A (en) * 1990-04-27 1991-12-10 Rogers Corporation Array connector
FR2671513B1 (fr) * 1991-01-14 1993-04-23 Sextant Avionique Procede pour rendre etanches des pieces comprenant des inserts metalliques surmoules.
JP2875438B2 (ja) * 1992-09-24 1999-03-31 日本ペイント株式会社 熱可塑性樹脂製品の表面処理方法
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US5753134A (en) * 1994-01-04 1998-05-19 Siemens Aktiengesellschaft Method for producing a layer with reduced mechanical stresses
US5840402A (en) * 1994-06-24 1998-11-24 Sheldahl, Inc. Metallized laminate material having ordered distribution of conductive through holes
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US5522954A (en) * 1994-09-12 1996-06-04 Ford Motor Company Non-contact bonding of plastics
JP3885280B2 (ja) * 1997-04-25 2007-02-21 東レ株式会社 金属蒸着フィルム、その製造方法及びそれを用いたコンデンサ
US6015520A (en) * 1997-05-15 2000-01-18 International Business Machines Corporation Method for filling holes in printed wiring boards
DE19723854A1 (de) * 1997-06-06 1998-12-10 Hoechst Ag Verfahren zur Herstellung von Lösungen mit Säuregruppen funktionalisierter Polymere durch Mikrowellenbestrahlung
US7527357B2 (en) 1997-07-15 2009-05-05 Silverbrook Research Pty Ltd Inkjet nozzle array with individual feed channel for each nozzle
US6557977B1 (en) * 1997-07-15 2003-05-06 Silverbrook Research Pty Ltd Shape memory alloy ink jet printing mechanism
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US6630743B2 (en) * 2001-02-27 2003-10-07 International Business Machines Corporation Copper plated PTH barrels and methods for fabricating
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Also Published As

Publication number Publication date
CH656809A5 (de) 1986-07-31
SE8703514L (sv) 1987-09-10
SE453582B (sv) 1988-02-15
DK7782A (da) 1982-07-13
IT1172200B (it) 1987-06-18
ES8302402A1 (es) 1983-01-01
GB2094320A (en) 1982-09-15
ES509563A0 (es) 1983-01-01
CA1189019A (en) 1985-06-18
AU7742881A (en) 1982-07-22
DE3249736C2 (es) 1989-04-27
DE3200301A1 (de) 1982-07-29
GB2094320B (en) 1985-08-14
SE8703514D0 (sv) 1987-09-10
US4339303A (en) 1982-07-13
FR2497813B1 (fr) 1986-05-16
DE3200301C2 (es) 1989-03-23
JPS57117540A (en) 1982-07-22
AU546467B2 (en) 1985-09-05
ATA5482A (de) 1987-07-15
JPH0114858B2 (es) 1989-03-14
IT8150031A0 (it) 1981-12-30
IL64754A (en) 1986-01-31
NL8200082A (nl) 1982-08-02
AT384992B (de) 1988-02-10
IL64754A0 (en) 1982-03-31
ZA815415B (en) 1983-02-23
BE891753A (fr) 1982-07-12
SE8200038L (sv) 1982-07-13
FR2497813A1 (fr) 1982-07-16
ES508632A0 (es) 1983-02-01

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