ES8600577A1 - Procedimiento perfeccionado para la fabricacion de cajas de distribucion electrica - Google Patents

Procedimiento perfeccionado para la fabricacion de cajas de distribucion electrica

Info

Publication number
ES8600577A1
ES8600577A1 ES533433A ES533433A ES8600577A1 ES 8600577 A1 ES8600577 A1 ES 8600577A1 ES 533433 A ES533433 A ES 533433A ES 533433 A ES533433 A ES 533433A ES 8600577 A1 ES8600577 A1 ES 8600577A1
Authority
ES
Spain
Prior art keywords
sheet
copper sheet
boxes
distrbution
die cutting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES533433A
Other languages
English (en)
Other versions
ES533433A0 (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lear Automotive EEDS Spain SL
Original Assignee
Lear Automotive EEDS Spain SL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lear Automotive EEDS Spain SL filed Critical Lear Automotive EEDS Spain SL
Priority to ES533433A priority Critical patent/ES533433A0/es
Priority to FR8416618A priority patent/FR2565425B3/fr
Priority to IT83435/84A priority patent/IT1181231B/it
Publication of ES8600577A1 publication Critical patent/ES8600577A1/es
Publication of ES533433A0 publication Critical patent/ES533433A0/es
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/026—Multiple connections subassemblies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • H05K1/0289—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303—Pin-in-hole mounted pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/306—Assembling printed circuits with electric components, e.g. with resistors with lead-in-hole components
    • H05K3/308—Adaptations of leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Connections Arranged To Contact A Plurality Of Conductors (AREA)
  • Multi-Conductor Connections (AREA)

Abstract

PERFECCIONAMIENTOS EN EL PROCEDIMIENTO PARA LA FABRICACION DE CAJAS DE DISTRIBUCION ELECTRICA.CONSISTENTES EN EL TROQUELADO DE LAMINAS DE COBRE (12) DE MUY REDUCIDO ESPESOR PARA DARLES UNA CONFIGURACION FORMADA A BASE DE TROQUELADOS DE POCA ANCHURA DISPUESTOS PARALELAMENTE ENTRE SI Y A POSICIONES ALTERNADAS CON LO CUAL AL FORMARSE CAPAS SUCESIVAS DE LAMINAS DE COBRE UNAS DOTADAS DE LINEAS ENTALLAS VERTICALES Y OTRAS HORIZONTALES, SE CONSIGUE QUE AL SUPERPONERSE QUEDAN SOBRE LA MISMA VERTICAL DE LAS ZONAS DE UNION DE LAS ENTALLAS, CONSIGUIENDOSE A SU VEZ QUE CADA LAMINA DE COBRE (12) TENGA LA SUFICIENTE RIGIDEZ PARA PODER COLOCARLA SOBRE UNA LAMINA AISLANTE (13), PROCEDIENDOSE SEGUIDAMENTE A SU SOLIDARIZACION MEDIANTE SOLDADURAS (15) DE LAS DOS LAMINAS Y OTRA DE MATERIAL AISLANTE CON UN SISTEMA CONVENCIONAL.
ES533433A 1984-06-04 1984-06-04 Procedimiento perfeccionado para la fabricacion de cajas de distribucion electrica Granted ES533433A0 (es)

Priority Applications (3)

Application Number Priority Date Filing Date Title
ES533433A ES533433A0 (es) 1984-06-04 1984-06-04 Procedimiento perfeccionado para la fabricacion de cajas de distribucion electrica
FR8416618A FR2565425B3 (fr) 1984-06-04 1984-10-26 Procede pour la fabrication de boites de distribution electrique
IT83435/84A IT1181231B (it) 1984-06-04 1984-11-02 Processo perfezionato per la fabbricazione di scatole di distribuzione elettrica

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ES533433A ES533433A0 (es) 1984-06-04 1984-06-04 Procedimiento perfeccionado para la fabricacion de cajas de distribucion electrica

Publications (2)

Publication Number Publication Date
ES8600577A1 true ES8600577A1 (es) 1985-10-16
ES533433A0 ES533433A0 (es) 1985-10-16

Family

ID=8487491

Family Applications (1)

Application Number Title Priority Date Filing Date
ES533433A Granted ES533433A0 (es) 1984-06-04 1984-06-04 Procedimiento perfeccionado para la fabricacion de cajas de distribucion electrica

Country Status (3)

Country Link
ES (1) ES533433A0 (es)
FR (1) FR2565425B3 (es)
IT (1) IT1181231B (es)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2686763A1 (fr) * 1992-01-29 1993-07-30 Mecanismos Aux Ind Procede de fabrication de boites de jonction pour vehicules.

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2617650B1 (fr) * 1987-07-03 1992-12-11 Orega Electro Mecanique Procede de connexion entre un circuit imprime et un substrat metallique
US5587890A (en) 1994-08-08 1996-12-24 Cooper Industries, Inc. Vehicle electric power distribution system
US6539963B1 (en) * 1999-07-14 2003-04-01 Micron Technology, Inc. Pressurized liquid diffuser
DE10260786A1 (de) * 2002-12-23 2004-07-15 Daimlerchrysler Ag Flachkabelstrang
WO2016074729A1 (de) * 2014-11-13 2016-05-19 Leukert Gmbh Vorrichtung zur leistungskontaktierung
CN105188258A (zh) * 2015-10-16 2015-12-23 苏州市狮威电子有限公司 柔性线路板的多贴热固钢片

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2686763A1 (fr) * 1992-01-29 1993-07-30 Mecanismos Aux Ind Procede de fabrication de boites de jonction pour vehicules.
GB2263817A (en) * 1992-01-29 1993-08-04 Mecanismos Aux Ind Process for the production of service boxes for vehicles
ES2071540A1 (es) * 1992-01-29 1995-06-16 Mecanismos Aux Ind Perfeccionamientos en los procesos de fabricacion de cajas de servicios y de sus partes.
GB2263817B (en) * 1992-01-29 1995-08-23 Mecanismos Aux Ind Improved process for the production of service boxes

Also Published As

Publication number Publication date
IT1181231B (it) 1987-09-23
FR2565425B3 (fr) 1986-09-12
FR2565425A1 (fr) 1985-12-06
IT8483435A0 (it) 1984-11-02
ES533433A0 (es) 1985-10-16

Similar Documents

Publication Publication Date Title
IT1179640B (it) Procedimento per la preparazione di polianiline. polianiline ottenute con tale procedimento e loro applicazione per la realizzazione di generatori elettrochimici
IT1116451B (it) Perfezionamento nei pannelli di isolamento acustico e procedimento per la loro produzione
DE3785448D1 (de) Thermisch isolierende und elektrisch leitende verbindung und verfahren zu deren herstellung.
ES2053994T3 (es) Estratificados de capas multiples de peliculas microporosas.
IT8347570A0 (it) Interfreron ibrido multiclasse,composizione farmaceutica che lo conti ene e procedimento di produzione
DE69020012D1 (de) Herstellung einer isolierenden Schicht, zum Beispiel in einem aktiven Matrix-Bauelement.
IT8321954A0 (it) Metodo per la fabbricazione di barre laminate conduttrici ad alta capacita' con connnessioni elettriche ottenute per la saldatura, e relative barre prodotte secondo tale metodo.
KR880008728A (ko) 전기적 보호케이스와 전기적 보호케이스의 제조방법
ES8600577A1 (es) Procedimiento perfeccionado para la fabricacion de cajas de distribucion electrica
IT8223375A0 (it) Derivati piridinici eprocedimento per la loro produzione.
IT8424104A0 (it) 5-pirimidincarbossammidi e tiocarbossammidi processo per la loro produzione e composizioni farmaceutiche contenenti le stesse
BE807547A (fr) Procede de fabrication d'un element de resistance electrique
IT1120441B (it) Procedimento di saldatura vetro-vetro con strato conduttore interposto particolarmente per la produzione di dispositivi di presentazione elettronici
DE3785699D1 (de) Halbleiteranordnung mit zwei durch eine isolationsschicht getrennten elektroden.
FR2555630B1 (fr) Procede de fabrication de planchers isolants a base d'elements ainsi que les elements et les planchers fabriques par ledit procede
IT8148567A0 (it) Derivati della benzoguanammina procedimento per la loro produzione e composizioni farmaceutiche che licontengono
DE3852903D1 (de) Hohe Durchbruchspannung aufweisende isolierende Schicht, die zwischen Polysilizium-Schichten liegt.
FR2335926A1 (fr) Composant electrique et notamment condensateur electrolytique sec, et procede pour sa fabrication
BE775748A (fr) Procede de fabrication de cables electriques isoles notamment pour l'aviation
IT8419167A0 (it) Carbostirilossiminopropanolamine utili come medicamenti eprocedimento per la loro preparazione.
FR2587827B1 (fr) Procede de fabrication d'un hauban isolant et hauban realise selon le procede
EP0146613A4 (en) Process for fabricating semiconductor structures.
FR2545654B1 (fr) Composant semi-conducteur de puissance, et procede pour la fabrication
JPS524780A (en) Manufacturing method of semiconductor equipment
IT1164677B (it) Derivati di 1,3 benzodiossina procedimento per la loro produzione e composizioni farmaceutiche che li contengono come incredienti attivi