ES8708151A1 - Electrodeposited copper foil. - Google Patents

Electrodeposited copper foil.

Info

Publication number
ES8708151A1
ES8708151A1 ES556394A ES556394A ES8708151A1 ES 8708151 A1 ES8708151 A1 ES 8708151A1 ES 556394 A ES556394 A ES 556394A ES 556394 A ES556394 A ES 556394A ES 8708151 A1 ES8708151 A1 ES 8708151A1
Authority
ES
Spain
Prior art keywords
copper foil
electrodeposited copper
electrolyzing
electrodeposited
elongation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES556394A
Other languages
Spanish (es)
Other versions
ES556394A0 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Kinzoku Co Ltd
Original Assignee
Mitsui Mining and Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=15411921&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ES8708151(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from JP60146623A external-priority patent/JPS6210291A/en
Application filed by Mitsui Mining and Smelting Co Ltd filed Critical Mitsui Mining and Smelting Co Ltd
Publication of ES8708151A1 publication Critical patent/ES8708151A1/en
Publication of ES556394A0 publication Critical patent/ES556394A0/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Cosmetics (AREA)
  • Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
  • Fats And Perfumes (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

An electrodeposited copper foil having improved properties such as high tensile strength and elongation at room temperature and at elevated temperature, obtained by electrolyzing a copper ion-containing electrolyte at least 60 vol.% of which is treated with activated carbon within 20 minutes before the electrolyzing.
ES556394A 1985-07-05 1986-06-06 Electrodeposited copper foil. Expired ES8708151A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60146623A JPS6210291A (en) 1985-07-05 1985-07-05 Electrolytic copper foil

Publications (2)

Publication Number Publication Date
ES8708151A1 true ES8708151A1 (en) 1987-07-01
ES556394A0 ES556394A0 (en) 1987-07-01

Family

ID=15411921

Family Applications (1)

Application Number Title Priority Date Filing Date
ES556394A Expired ES8708151A1 (en) 1985-07-05 1986-06-06 Electrodeposited copper foil.

Country Status (7)

Country Link
EP (1) EP0207244B2 (en)
JP (1) JPH0610181A (en)
AT (1) ATE82333T1 (en)
DE (1) DE3687089T3 (en)
ES (1) ES8708151A1 (en)
FI (1) FI862842A7 (en)
NO (1) NO862041L (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4837764A (en) * 1987-03-26 1989-06-06 Bunker Ramo Corporation Programmable apparatus and method for testing computer peripherals
US4956053A (en) * 1988-05-26 1990-09-11 Olin Corporation Apparatus and process for the production of micro-pore free high ductility metal foil
US5431803A (en) * 1990-05-30 1995-07-11 Gould Electronics Inc. Electrodeposited copper foil and process for making same
US6123788A (en) * 1993-04-19 2000-09-26 Electrocopper Products Limited Copper wire and process for making copper wire
TW432124B (en) * 1996-05-13 2001-05-01 Mitsui Mining & Amp Smelting C Electrolytic copper foil with high post heat tensile strength and its manufacturing method
TW336325B (en) * 1996-05-24 1998-07-11 Electrocopper Products Ltd Copper wire and process for making copper wire
JP3670179B2 (en) * 1999-11-11 2005-07-13 三井金属鉱業株式会社 Electrolytic copper foil with carrier foil and copper-clad laminate using the electrolytic copper foil with carrier foil
JP3521074B2 (en) * 2000-01-06 2004-04-19 三井金属鉱業株式会社 Method for testing physical properties of electrolytic copper foil
JP2004269950A (en) * 2003-03-07 2004-09-30 Mitsui Mining & Smelting Co Ltd Manufacturing method of electrolytic copper foil

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH494824A (en) * 1969-07-10 1970-08-15 Fluehmann Werner Process for the electrodeposition of copper with high ductility
GB8333752D0 (en) * 1983-12-19 1984-01-25 Thorpe J E Matte surface on metal layer
JPS6152387A (en) * 1984-08-17 1986-03-15 Fukuda Kinzoku Hakufun Kogyo Kk Manufacture of electrolytic copper foil having superior elongation during heating at high temperature

Also Published As

Publication number Publication date
DE3687089D1 (en) 1992-12-17
EP0207244B2 (en) 1999-03-31
FI862842A0 (en) 1986-07-04
DE3687089T3 (en) 1999-10-07
FI862842L (en) 1987-01-06
FI862842A7 (en) 1987-01-06
ATE82333T1 (en) 1992-11-15
EP0207244A3 (en) 1988-05-25
DE3687089T2 (en) 1993-03-18
NO862041L (en) 1987-01-06
JPH0610181A (en) 1994-01-18
EP0207244A2 (en) 1987-01-07
ES556394A0 (en) 1987-07-01
EP0207244B1 (en) 1992-11-11

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Legal Events

Date Code Title Description
MM4A Patent lapsed

Effective date: 19960506