ES8708151A1 - Metodo para la obtencion de peliculas de cobre electrodepositadas - Google Patents

Metodo para la obtencion de peliculas de cobre electrodepositadas

Info

Publication number
ES8708151A1
ES8708151A1 ES556394A ES556394A ES8708151A1 ES 8708151 A1 ES8708151 A1 ES 8708151A1 ES 556394 A ES556394 A ES 556394A ES 556394 A ES556394 A ES 556394A ES 8708151 A1 ES8708151 A1 ES 8708151A1
Authority
ES
Spain
Prior art keywords
copper foil
electrodeposited copper
electrolyzing
electrodeposited
elongation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES556394A
Other languages
English (en)
Other versions
ES556394A0 (es
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Kinzoku Co Ltd
Original Assignee
Mitsui Mining and Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=15411921&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ES8708151(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from JP60146623A external-priority patent/JPS6210291A/ja
Application filed by Mitsui Mining and Smelting Co Ltd filed Critical Mitsui Mining and Smelting Co Ltd
Publication of ES8708151A1 publication Critical patent/ES8708151A1/es
Publication of ES556394A0 publication Critical patent/ES556394A0/es
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Cosmetics (AREA)
  • Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
  • Fats And Perfumes (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

METODO DE OBTENER PELICULAS DE COBRE ELECTRODEPOSITADAS. CONSISTE EN PREPARAR UN ELECTROLITO QUE CONTIENE IONES DE COBRE FORMANDO UNA SOLUCION QUE COMPRENDE DE 50 A 100 G/L DE IONES DE COBRE DERIVADOS DEL SULFATO CUPRICO O DEL CLORURO CUPRICO, Y UN ELEMENTO SELECCIONADO DEL GRUPO QUE COMPRENDE DE 80 A 180 G/L DE ACIDO SULFURICO, DE 5 A 50 G/L DE ACIDO CLORHIDRICO, DE 200 A 500 G/L DE UN PIROFOSFATO Y UN FLUORURO DE BORO EN UNA CANTIDAD CORRESPONDIENTE A UN VALOR DE PH ENTRE 0,1 Y 2,0; TRATAR UN 60% DE VOLUMEN DEL ELECTRODO CON CARBON ACTIVADO; Y SOMETER A ELECTROLISIS EL ELECTROLITO DENTRO DE LOS 20 MINUTOS DESPUES DEL TRATAMIENTO. TIENE APLICACION EN ESTRUCTURAS LAMINARES CHAPADAS.
ES556394A 1985-07-05 1986-06-06 Metodo para la obtencion de peliculas de cobre electrodepositadas Expired ES8708151A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60146623A JPS6210291A (ja) 1985-07-05 1985-07-05 電解銅箔

Publications (2)

Publication Number Publication Date
ES8708151A1 true ES8708151A1 (es) 1987-07-01
ES556394A0 ES556394A0 (es) 1987-07-01

Family

ID=15411921

Family Applications (1)

Application Number Title Priority Date Filing Date
ES556394A Expired ES8708151A1 (es) 1985-07-05 1986-06-06 Metodo para la obtencion de peliculas de cobre electrodepositadas

Country Status (7)

Country Link
EP (1) EP0207244B2 (es)
JP (1) JPH0610181A (es)
AT (1) ATE82333T1 (es)
DE (1) DE3687089T3 (es)
ES (1) ES8708151A1 (es)
FI (1) FI862842A7 (es)
NO (1) NO862041L (es)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4837764A (en) * 1987-03-26 1989-06-06 Bunker Ramo Corporation Programmable apparatus and method for testing computer peripherals
US4956053A (en) * 1988-05-26 1990-09-11 Olin Corporation Apparatus and process for the production of micro-pore free high ductility metal foil
US5431803A (en) * 1990-05-30 1995-07-11 Gould Electronics Inc. Electrodeposited copper foil and process for making same
US6123788A (en) * 1993-04-19 2000-09-26 Electrocopper Products Limited Copper wire and process for making copper wire
TW432124B (en) * 1996-05-13 2001-05-01 Mitsui Mining & Amp Smelting C Electrolytic copper foil with high post heat tensile strength and its manufacturing method
TW336325B (en) * 1996-05-24 1998-07-11 Electrocopper Products Ltd Copper wire and process for making copper wire
JP3670179B2 (ja) * 1999-11-11 2005-07-13 三井金属鉱業株式会社 キャリア箔付電解銅箔及びそのキャリア箔付電解銅箔を用いた銅張積層板
JP3521074B2 (ja) * 2000-01-06 2004-04-19 三井金属鉱業株式会社 電解銅箔の物性検査方法
JP2004269950A (ja) * 2003-03-07 2004-09-30 Mitsui Mining & Smelting Co Ltd 電解銅箔の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH494824A (de) * 1969-07-10 1970-08-15 Fluehmann Werner Verfahren zur elektrolytischen Abscheidung von Kupfer hoher Duktilität
GB8333752D0 (en) * 1983-12-19 1984-01-25 Thorpe J E Matte surface on metal layer
JPS6152387A (ja) * 1984-08-17 1986-03-15 Fukuda Kinzoku Hakufun Kogyo Kk 高温加熱時の伸び率が優れた電解銅箔の製造方法

Also Published As

Publication number Publication date
DE3687089D1 (de) 1992-12-17
EP0207244B2 (en) 1999-03-31
FI862842A0 (fi) 1986-07-04
DE3687089T3 (de) 1999-10-07
FI862842L (fi) 1987-01-06
FI862842A7 (fi) 1987-01-06
ATE82333T1 (de) 1992-11-15
EP0207244A3 (en) 1988-05-25
DE3687089T2 (de) 1993-03-18
NO862041L (no) 1987-01-06
JPH0610181A (ja) 1994-01-18
EP0207244A2 (en) 1987-01-07
ES556394A0 (es) 1987-07-01
EP0207244B1 (en) 1992-11-11

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Legal Events

Date Code Title Description
MM4A Patent lapsed

Effective date: 19960506