FI872004L - System foer loestagbar montering av halvledare pao ett ledarunderlag. - Google Patents

System foer loestagbar montering av halvledare pao ett ledarunderlag. Download PDF

Info

Publication number
FI872004L
FI872004L FI872004A FI872004A FI872004L FI 872004 L FI872004 L FI 872004L FI 872004 A FI872004 A FI 872004A FI 872004 A FI872004 A FI 872004A FI 872004 L FI872004 L FI 872004L
Authority
FI
Finland
Prior art keywords
loestagbar
ledarunderlag
halvledare
montering
system foer
Prior art date
Application number
FI872004A
Other languages
English (en)
Finnish (fi)
Other versions
FI872004A7 (fi
FI872004A0 (fi
Inventor
James C K Lee
Gene M Amdahl
Richard Beck
Chune Lee
Edward Hu
Original Assignee
Digital Equipment Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Digital Equipment Corp filed Critical Digital Equipment Corp
Publication of FI872004A0 publication Critical patent/FI872004A0/fi
Publication of FI872004A7 publication Critical patent/FI872004A7/fi
Publication of FI872004L publication Critical patent/FI872004L/fi

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W78/00—Detachable holders for supporting packaged chips in operation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H10W40/233—Arrangements for cooling characterised by their places of attachment or cooling paths attached to chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H10W40/237—Arrangements for cooling characterised by their places of attachment or cooling paths attached to additional arrangements for cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H10W40/242—Arrangements for cooling characterised by their places of attachment or cooling paths comprising thermal conductors between chips and the and the arrangements for cooling, e.g. compliant heat-spreaders
FI872004A 1986-05-07 1987-05-06 System foer loestagbar montering av halvledare pao ett ledarunderlag. FI872004L (fi)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US86072586A 1986-05-07 1986-05-07

Publications (3)

Publication Number Publication Date
FI872004A0 FI872004A0 (fi) 1987-05-06
FI872004A7 FI872004A7 (fi) 1987-11-08
FI872004L true FI872004L (fi) 1987-11-08

Family

ID=25333883

Family Applications (1)

Application Number Title Priority Date Filing Date
FI872004A FI872004L (fi) 1986-05-07 1987-05-06 System foer loestagbar montering av halvledare pao ett ledarunderlag.

Country Status (7)

Country Link
EP (1) EP0245179B1 (de)
JP (1) JPS6332958A (de)
AT (1) ATE84168T1 (de)
AU (1) AU598253B2 (de)
DE (1) DE3783266T2 (de)
DK (1) DK231287A (de)
FI (1) FI872004L (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0854506A3 (de) * 1987-03-04 1999-03-31 Canon Kabushiki Kaisha Elektrisches Verbindungsteil und elektrisches Schaltungsteil
US4899208A (en) * 1987-12-17 1990-02-06 International Business Machines Corporation Power distribution for full wafer package
US5637925A (en) * 1988-02-05 1997-06-10 Raychem Ltd Uses of uniaxially electrically conductive articles
EP0391979A1 (de) * 1988-02-05 1990-10-17 Raychem Limited Verwendungen von uniaxial-elektroleitenden anordnungen
EP0329314A1 (de) * 1988-02-05 1989-08-23 Raychem Limited Verwendungen von uniaxial-elektroleitenden Anordnungen
US5631447A (en) * 1988-02-05 1997-05-20 Raychem Limited Uses of uniaxially electrically conductive articles
EP0344702B1 (de) * 1988-05-30 1996-03-13 Canon Kabushiki Kaisha Elektrischer Schaltungsapparat
US5283468A (en) * 1988-05-30 1994-02-01 Canon Kabushiki Kaisha Electric circuit apparatus
US4933808A (en) * 1989-05-11 1990-06-12 Westinghouse Electric Corp. Solderless printed wiring board module and multi-module assembly
US4954878A (en) * 1989-06-29 1990-09-04 Digital Equipment Corp. Method of packaging and powering integrated circuit chips and the chip assembly formed thereby
US5047830A (en) * 1990-05-22 1991-09-10 Amp Incorporated Field emitter array integrated circuit chip interconnection
US5140405A (en) * 1990-08-30 1992-08-18 Micron Technology, Inc. Semiconductor assembly utilizing elastomeric single axis conductive interconnect
US5148266A (en) * 1990-09-24 1992-09-15 Ist Associates, Inc. Semiconductor chip assemblies having interposer and flexible lead
US7198969B1 (en) 1990-09-24 2007-04-03 Tessera, Inc. Semiconductor chip assemblies, methods of making same and components for same
JP2747113B2 (ja) * 1990-11-28 1998-05-06 北川工業株式会社 導電線内蔵筐体
DE29620595U1 (de) * 1996-11-26 1998-01-02 Siemens AG, 80333 München Sockel für eine integrierte Schaltung
DE19832970A1 (de) * 1998-07-22 1999-11-04 Siemens Ag Integrierte elektronische Schaltung und Verfahren zum Versehen einer integrierten elektronischen Schaltung mit Anschlüssen
DE10147054A1 (de) * 2001-09-25 2003-04-24 Siemens Ag Mehrebenenleiterplatte mit erhöhter freier Verdrahtungsfläche
DE10355921B4 (de) * 2003-11-29 2005-12-22 Festo Ag & Co. Elektrische Schaltungsanordnung mit einem elektronischen Chip in einer Aufnahmevorrichtung des Schaltungsträgers

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1183280A (en) * 1981-02-09 1985-02-26 Francis N. Sinnadurai Integrated circuit chip carrier
JPS57166051A (en) * 1981-04-06 1982-10-13 Mitsubishi Electric Corp Semiconductor device
EP0148820B1 (de) * 1983-07-11 1988-10-12 Silicon Connection, Inc. Chipverbindungsanordnung und methode
US4597617A (en) * 1984-03-19 1986-07-01 Tektronix, Inc. Pressure interconnect package for integrated circuits
US4667219A (en) * 1984-04-27 1987-05-19 Trilogy Computer Development Partners, Ltd. Semiconductor chip interface
GB8412674D0 (en) * 1984-05-18 1984-06-27 British Telecomm Integrated circuit chip carrier
JPS60263447A (ja) * 1984-06-11 1985-12-26 Nec Corp 電子回路パツケ−ジ

Also Published As

Publication number Publication date
FI872004A7 (fi) 1987-11-08
FI872004A0 (fi) 1987-05-06
EP0245179B1 (de) 1992-12-30
EP0245179A2 (de) 1987-11-11
DE3783266T2 (de) 1993-07-22
AU598253B2 (en) 1990-06-21
DK231287A (da) 1987-11-08
DK231287D0 (da) 1987-05-06
ATE84168T1 (de) 1993-01-15
JPS6332958A (ja) 1988-02-12
EP0245179A3 (en) 1988-10-05
AU7216587A (en) 1987-11-19
DE3783266D1 (de) 1993-02-11

Similar Documents

Publication Publication Date Title
FI872771A7 (fi) System foer fjaerrstyrning av hissanordningar.
FI880631A7 (fi) System foer inmatning av ett tillsatsaemne i en behaollare.
FI872254A0 (fi) Positionskaennande system foer ett roerligt foeremaol.
FI882221A0 (fi) Nytt system foer administrering av liposomer till daeggdjur.
FI900093A7 (fi) System foer tillslutbart lastrum av container-typ.
FI862627A0 (fi) System foer reglerande av en krans hastighet.
FI860179L (fi) Stickkoppling foer tillfaellig fastsaettning av en anordning pao ett skaft.
FI872004L (fi) System foer loestagbar montering av halvledare pao ett ledarunderlag.
FI89302C (fi) Foerfarande foer framstaellning av ett optiskt aktivt system, isynnerhet att tillaempas pao ett fordons koerljus
FI881709A7 (fi) System foer kontinuerlig reglering av vattenstroemningen i vattenmassagebad.
FI850999A0 (fi) System foer distribuering av aonga pao en pappersbana.
FI884151A0 (fi) System foer instaellning av en rotationstryckmaskins driftsparametrar.
FI863720A0 (fi) System foer utval av faner baserad pao deras storlek.
FI881386A0 (fi) Anordning foer applicering av ett stroemmande medium pao en materialbana.
DE3787252D1 (de) Ortungssystem.
NO880055D0 (no) Lokaliseringssystem.
FI890306L (fi) System foer paovisning av cannabinoider.
FI870852L (fi) Riktning av partiklar pao ett foeremaol.
FI872407L (fi) Anordning foer samtidigt formande av tvenne snitt laengs en bana pao ett oega.
FI881395A7 (fi) Saekerhetsanordning foer ett system i fjaerrkommunikationsvaexel.
FI872979A7 (fi) System foer vaetskeskintillationsoevervakning med ett oevervakningsskydd framstaellt av fast kristallmaterial.
FI883676L (fi) System foer graevning pao havsbottnen.
FI870352A7 (fi) Kretskortstaell foer elektriskt system.
FI871248A0 (fi) Anordning foer bestrykning av glidytan pao skidor med ett vaxartat aemne.
FI874288A0 (fi) Anordning foer upphoejning av taket pao ett lastutrymme i ett lastfordon.

Legal Events

Date Code Title Description
FD Application lapsed
MM Patent lapsed

Owner name: DIGITAL EQUIPMENT CORPORATION