FR1099888A - Support isolant muni d'un câblage - Google Patents

Support isolant muni d'un câblage

Info

Publication number
FR1099888A
FR1099888A FR1099888DA FR1099888A FR 1099888 A FR1099888 A FR 1099888A FR 1099888D A FR1099888D A FR 1099888DA FR 1099888 A FR1099888 A FR 1099888A
Authority
FR
France
Prior art keywords
wiring
insulating support
insulating
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Application granted granted Critical
Publication of FR1099888A publication Critical patent/FR1099888A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/658—Shapes or dispositions of interconnections for devices provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07554—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/29—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
FR1099888D 1953-05-07 1954-05-05 Support isolant muni d'un câblage Expired FR1099888A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL178165 1953-05-07

Publications (1)

Publication Number Publication Date
FR1099888A true FR1099888A (fr) 1955-09-12

Family

ID=19750607

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1099888D Expired FR1099888A (fr) 1953-05-07 1954-05-05 Support isolant muni d'un câblage

Country Status (3)

Country Link
DE (1) DE1698910U (fr)
FR (1) FR1099888A (fr)
NL (1) NL178165B (fr)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1156457B (de) * 1961-07-08 1963-10-31 Telefunken Patent Verfahren zur Herstellung einer integrierten Schaltungsanordnung
US3231797A (en) * 1963-09-20 1966-01-25 Nat Semiconductor Corp Semiconductor device
DE1236612B (de) * 1960-02-24 1967-03-16 Globe Union Inc Befestigung eines Transistors innerhalb eines gedruckten Stromkreises in der Ausnehmung einer Isolierplatte
DE1283965B (de) * 1959-05-06 1968-11-28 Texas Instruments Inc Hermetisch eingeschlossene Halbleiteranordnung
US3471753A (en) * 1965-05-26 1969-10-07 Sprague Electric Co Semiconductor mounting chip assembly
US3480836A (en) * 1966-08-11 1969-11-25 Ibm Component mounted in a printed circuit
US3484534A (en) * 1966-07-29 1969-12-16 Texas Instruments Inc Multilead package for a multilead electrical device
DE1616293B1 (de) * 1967-05-04 1971-08-26 North American Rockwell Verfahren zum Verbinden eines Mikroschaltungsplaettchens mit einer Unterlage
US3678346A (en) * 1964-11-10 1972-07-18 Trw Inc Semiconductor device and method of making the same
US3702953A (en) * 1970-04-28 1972-11-14 Agfa Gevaert Ag Printed circuit arrangement
US3828210A (en) * 1973-01-22 1974-08-06 Motorola Inc Temperature compensated mounting structure for coupled resonator crystals

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3365620A (en) * 1966-06-13 1968-01-23 Ibm Circuit package with improved modular assembly and cooling apparatus
DE3326968A1 (de) * 1982-06-12 1985-02-14 IVO Irion & Vosseler, Zählerfabrik GmbH & Co, 7730 Villingen-Schwenningen Traegerbauteil aus thermoplastischem material mit durch heisspraegen aufgebrachten metallischen leitern
DE3409146A1 (de) * 1984-03-13 1985-09-19 Siemens AG, 1000 Berlin und 8000 München Optoelektronisches mudul
DE3501710A1 (de) * 1985-01-19 1986-07-24 Allied Corp., Morristown, N.J. Leiterplatte mit integralen positioniermitteln

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1283965B (de) * 1959-05-06 1968-11-28 Texas Instruments Inc Hermetisch eingeschlossene Halbleiteranordnung
DE1236612B (de) * 1960-02-24 1967-03-16 Globe Union Inc Befestigung eines Transistors innerhalb eines gedruckten Stromkreises in der Ausnehmung einer Isolierplatte
DE1156457B (de) * 1961-07-08 1963-10-31 Telefunken Patent Verfahren zur Herstellung einer integrierten Schaltungsanordnung
US3231797A (en) * 1963-09-20 1966-01-25 Nat Semiconductor Corp Semiconductor device
US3678346A (en) * 1964-11-10 1972-07-18 Trw Inc Semiconductor device and method of making the same
US3471753A (en) * 1965-05-26 1969-10-07 Sprague Electric Co Semiconductor mounting chip assembly
US3484534A (en) * 1966-07-29 1969-12-16 Texas Instruments Inc Multilead package for a multilead electrical device
US3480836A (en) * 1966-08-11 1969-11-25 Ibm Component mounted in a printed circuit
DE1616293B1 (de) * 1967-05-04 1971-08-26 North American Rockwell Verfahren zum Verbinden eines Mikroschaltungsplaettchens mit einer Unterlage
US3702953A (en) * 1970-04-28 1972-11-14 Agfa Gevaert Ag Printed circuit arrangement
US3828210A (en) * 1973-01-22 1974-08-06 Motorola Inc Temperature compensated mounting structure for coupled resonator crystals

Also Published As

Publication number Publication date
DE1698910U (de) 1955-05-18
NL178165B (nl) 1900-01-01

Similar Documents

Publication Publication Date Title
FR1099888A (fr) Support isolant muni d'un câblage
CH337889A (de) Isolieröl
FR1093736A (fr) étagère
FR1082304A (fr) Support de rayonnage
AT179640B (de) Metallbauverbindung
AT191135B (de) Schornsteinaufsatz
FR1108010A (fr) Dictaphone
FR1094018A (fr) Sectionneur
FR1144068A (fr) Carburateur
FR1095875A (fr) Carburateur
AT179629B (de) Herdplatte
CH314155A (de) Klammer
FR1097102A (fr) étable
FR1084317A (fr) Trop-plein
FR1094140A (fr) Support pour câbles
AT191019B (de) Lusteranordnung
AT187671B (de) Mastfuß
AT184357B (de) Mastfuß
DK80209C (da) Skarnkassestativ.
ES37421Y (es) Tablero
ES34278Y (es) Tablero
AT181072B (de) Hausnummerntafel
ES37875Y (es) Sostén
ES37789Y (es) Sostén
ES38454Y (es) Mueble barril-bar