FR1222108A - Fabrication de semi-conducteurs - Google Patents
Fabrication de semi-conducteursInfo
- Publication number
- FR1222108A FR1222108A FR791332A FR791332A FR1222108A FR 1222108 A FR1222108 A FR 1222108A FR 791332 A FR791332 A FR 791332A FR 791332 A FR791332 A FR 791332A FR 1222108 A FR1222108 A FR 1222108A
- Authority
- FR
- France
- Prior art keywords
- semiconductor manufacturing
- semiconductor
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
- H10W76/161—Containers comprising no base
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S220/00—Receptacles
- Y10S220/29—Welded seam
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US733613A US2977515A (en) | 1958-05-07 | 1958-05-07 | Semiconductor fabrication |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| FR1222108A true FR1222108A (fr) | 1960-06-08 |
Family
ID=24948382
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR791332A Expired FR1222108A (fr) | 1958-05-07 | 1959-04-06 | Fabrication de semi-conducteurs |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US2977515A (fr) |
| DE (1) | DE1110318B (fr) |
| FR (1) | FR1222108A (fr) |
| GB (1) | GB924209A (fr) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3020454A (en) * | 1959-11-09 | 1962-02-06 | Solid State Products Inc | Sealing of electrical semiconductor devices |
| US3196326A (en) * | 1961-07-14 | 1965-07-20 | Gen Electric Co Ltd | Transistor with mounting providing efficient heat dissipation through an envelope and method of making the same |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL89623C (fr) * | 1949-04-01 | |||
| US2697269A (en) * | 1950-07-24 | 1954-12-21 | Bell Telephone Labor Inc | Method of making semiconductor translating devices |
| US2825014A (en) * | 1953-11-30 | 1958-02-25 | Philips Corp | Semi-conductor device |
| BE546710A (fr) * | 1955-06-08 | 1900-01-01 | ||
| DE1048358B (fr) * | 1955-08-12 | 1959-01-08 | ||
| DE1752080U (de) * | 1956-02-10 | 1957-09-12 | Int Standard Electric Corp | Gleichrichter. |
| US2905873A (en) * | 1956-09-17 | 1959-09-22 | Rca Corp | Semiconductor power devices and method of manufacture |
-
1958
- 1958-05-07 US US733613A patent/US2977515A/en not_active Expired - Lifetime
-
1959
- 1959-04-06 FR FR791332A patent/FR1222108A/fr not_active Expired
- 1959-05-06 DE DEP22749A patent/DE1110318B/de active Pending
- 1959-05-07 GB GB15686/59A patent/GB924209A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| GB924209A (en) | 1963-04-24 |
| US2977515A (en) | 1961-03-28 |
| DE1110318B (de) | 1961-07-06 |
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