FR1255878A - Perfectionnements apportés aux transistors - Google Patents

Perfectionnements apportés aux transistors

Info

Publication number
FR1255878A
FR1255878A FR826061A FR826061A FR1255878A FR 1255878 A FR1255878 A FR 1255878A FR 826061 A FR826061 A FR 826061A FR 826061 A FR826061 A FR 826061A FR 1255878 A FR1255878 A FR 1255878A
Authority
FR
France
Prior art keywords
transistors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR826061A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Associated Electrical Industries Ltd
Original Assignee
Associated Electrical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB15433/59A external-priority patent/GB881646A/en
Application filed by Associated Electrical Industries Ltd filed Critical Associated Electrical Industries Ltd
Priority to FR826061A priority Critical patent/FR1255878A/fr
Application granted granted Critical
Publication of FR1255878A publication Critical patent/FR1255878A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/161—Containers comprising no base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
FR826061A 1959-05-05 1960-05-03 Perfectionnements apportés aux transistors Expired FR1255878A (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR826061A FR1255878A (fr) 1959-05-05 1960-05-03 Perfectionnements apportés aux transistors

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB15433/59A GB881646A (en) 1959-05-05 1959-05-05 Improvements in and relating to transistors
FR826061A FR1255878A (fr) 1959-05-05 1960-05-03 Perfectionnements apportés aux transistors

Publications (1)

Publication Number Publication Date
FR1255878A true FR1255878A (fr) 1961-03-10

Family

ID=26185864

Family Applications (1)

Application Number Title Priority Date Filing Date
FR826061A Expired FR1255878A (fr) 1959-05-05 1960-05-03 Perfectionnements apportés aux transistors

Country Status (1)

Country Link
FR (1) FR1255878A (fr)

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