FR1326261A - Procédé de fabrication d'un composant à semi-conducteur - Google Patents

Procédé de fabrication d'un composant à semi-conducteur

Info

Publication number
FR1326261A
FR1326261A FR901991A FR901991A FR1326261A FR 1326261 A FR1326261 A FR 1326261A FR 901991 A FR901991 A FR 901991A FR 901991 A FR901991 A FR 901991A FR 1326261 A FR1326261 A FR 1326261A
Authority
FR
France
Prior art keywords
manufacturing
semiconductor component
semiconductor
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR901991A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens and Halske AG
Siemens Corp
Original Assignee
Siemens and Halske AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens and Halske AG, Siemens Corp filed Critical Siemens and Halske AG
Application granted granted Critical
Publication of FR1326261A publication Critical patent/FR1326261A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49101—Applying terminal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
FR901991A 1961-06-28 1962-06-26 Procédé de fabrication d'un composant à semi-conducteur Expired FR1326261A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES74535A DE1199408B (de) 1961-06-28 1961-06-28 Verfahren zum Herstellen von Halbleiterbau-elementen und nach diesem Verfahren hergestelltes Halbleiterbauelement

Publications (1)

Publication Number Publication Date
FR1326261A true FR1326261A (fr) 1963-05-03

Family

ID=7504715

Family Applications (1)

Application Number Title Priority Date Filing Date
FR901991A Expired FR1326261A (fr) 1961-06-28 1962-06-26 Procédé de fabrication d'un composant à semi-conducteur

Country Status (7)

Country Link
US (1) US3264715A (fr)
CH (1) CH414019A (fr)
DE (1) DE1199408B (fr)
FR (1) FR1326261A (fr)
GB (1) GB959520A (fr)
NL (1) NL280224A (fr)
SE (1) SE218579C1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1514015A1 (de) * 1965-06-01 1970-08-20 Itt Ind Gmbh Deutsche Verfahren zum Herstellen von mit einer Huelle umgebenen und mit Zuleitungen versehenen Halbleiteranordnungen
DE1614364C3 (de) * 1966-06-01 1979-04-05 Rca Corp., New York, N.Y. (V.St.A.) Verfahren zur Montage eines Halbleiter-Kristallelementes
DE1564867C3 (de) * 1966-06-30 1975-04-10 Telefunken Patentverwertungsgesellschaft Mbh, 7900 Ulm Verfahren zum Kontaktieren von Dioden, Planartransistoren und integrierten Schaltungen
DE1277446B (de) * 1966-08-26 1968-09-12 Siemens Ag Verfahren zum Herstellen von Halbleiterbauelementen mit vollstaendig gekapseltem Halbleiterelement
GB1196452A (en) * 1967-01-19 1970-06-24 Lucas Industries Ltd Semiconductor Circuits

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL231513A (fr) * 1957-09-20 1900-01-01
NL109587C (fr) * 1957-11-05
US2990501A (en) * 1958-07-10 1961-06-27 Texas Instruments Inc Novel header of semiconductor devices
US3087239A (en) * 1959-06-19 1963-04-30 Western Electric Co Methods of bonding leads to semiconductive devices
US3103061A (en) * 1960-10-05 1963-09-10 Columbia Broadcasting Syst Inc Method of handling small lead wires
NL268830A (fr) * 1960-12-01

Also Published As

Publication number Publication date
NL280224A (nl) 1964-12-10
GB959520A (en) 1964-06-03
DE1199408B (de) 1965-08-26
US3264715A (en) 1966-08-09
SE218579C1 (sv) 1968-01-30
CH414019A (de) 1966-05-31

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