FR1422820A - Monture pour dispositif semi-conducteur - Google Patents

Monture pour dispositif semi-conducteur

Info

Publication number
FR1422820A
FR1422820A FR920197A FR920197A FR1422820A FR 1422820 A FR1422820 A FR 1422820A FR 920197 A FR920197 A FR 920197A FR 920197 A FR920197 A FR 920197A FR 1422820 A FR1422820 A FR 1422820A
Authority
FR
France
Prior art keywords
semiconductor device
device mount
mount
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR920197A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US196793A external-priority patent/US3184658A/en
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Priority to FR920197A priority Critical patent/FR1422820A/fr
Application granted granted Critical
Publication of FR1422820A publication Critical patent/FR1422820A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/153—Containers comprising an insulating or insulated base having interconnections in passages through the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
FR920197A 1962-05-22 1962-12-29 Monture pour dispositif semi-conducteur Expired FR1422820A (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR920197A FR1422820A (fr) 1962-05-22 1962-12-29 Monture pour dispositif semi-conducteur

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US196793A US3184658A (en) 1962-05-22 1962-05-22 Semiconductor device and header combination
FR920197A FR1422820A (fr) 1962-05-22 1962-12-29 Monture pour dispositif semi-conducteur

Publications (1)

Publication Number Publication Date
FR1422820A true FR1422820A (fr) 1966-01-03

Family

ID=26199182

Family Applications (1)

Application Number Title Priority Date Filing Date
FR920197A Expired FR1422820A (fr) 1962-05-22 1962-12-29 Monture pour dispositif semi-conducteur

Country Status (1)

Country Link
FR (1) FR1422820A (fr)

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