FR1432340A - Procédé de métallisation par réduction chimique - Google Patents
Procédé de métallisation par réduction chimiqueInfo
- Publication number
- FR1432340A FR1432340A FR16047A FR16047A FR1432340A FR 1432340 A FR1432340 A FR 1432340A FR 16047 A FR16047 A FR 16047A FR 16047 A FR16047 A FR 16047A FR 1432340 A FR1432340 A FR 1432340A
- Authority
- FR
- France
- Prior art keywords
- chemical reduction
- metallization process
- reduction metallization
- chemical
- reduction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003638 chemical reducing agent Substances 0.000 title 1
- 238000001465 metallisation Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 238000006722 reduction reaction Methods 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR16047A FR1432340A (fr) | 1964-05-07 | 1965-05-06 | Procédé de métallisation par réduction chimique |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB19002/64A GB1063092A (en) | 1964-05-07 | 1964-05-07 | Improvements in metal plating processes |
| FR16047A FR1432340A (fr) | 1964-05-07 | 1965-05-06 | Procédé de métallisation par réduction chimique |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| FR1432340A true FR1432340A (fr) | 1966-03-18 |
Family
ID=26163645
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR16047A Expired FR1432340A (fr) | 1964-05-07 | 1965-05-06 | Procédé de métallisation par réduction chimique |
Country Status (1)
| Country | Link |
|---|---|
| FR (1) | FR1432340A (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0167326A3 (en) * | 1984-06-29 | 1986-10-01 | Hitachi Chemical Co., Ltd. | Sensitizing agent for electroless plating and method for sensitizing substrate with the agent |
-
1965
- 1965-05-06 FR FR16047A patent/FR1432340A/fr not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0167326A3 (en) * | 1984-06-29 | 1986-10-01 | Hitachi Chemical Co., Ltd. | Sensitizing agent for electroless plating and method for sensitizing substrate with the agent |
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