FR1475436A - Dispositif semi-conducteur - Google Patents
Dispositif semi-conducteurInfo
- Publication number
- FR1475436A FR1475436A FR57250A FR57250A FR1475436A FR 1475436 A FR1475436 A FR 1475436A FR 57250 A FR57250 A FR 57250A FR 57250 A FR57250 A FR 57250A FR 1475436 A FR1475436 A FR 1475436A
- Authority
- FR
- France
- Prior art keywords
- semiconductor device
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
- H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
- H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US480577A US3283224A (en) | 1965-08-18 | 1965-08-18 | Mold capping semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| FR1475436A true FR1475436A (fr) | 1967-03-31 |
Family
ID=23908500
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR57250A Expired FR1475436A (fr) | 1965-08-18 | 1966-04-12 | Dispositif semi-conducteur |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US3283224A (fr) |
| DE (1) | DE1564839A1 (fr) |
| FR (1) | FR1475436A (fr) |
| GB (1) | GB1135607A (fr) |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1283969B (de) * | 1965-02-16 | 1968-11-28 | Itt Ind Gmbh Deutsche | Halbleiterbauelement mit elektrisch isolierendem Zwischenkoerper zwischen dem Halbleiterkoerper und einem Gehaeuseteil, sowie Verfahren zu seiner Herstellung |
| US3386015A (en) * | 1965-10-21 | 1968-05-28 | Texas Instruments Inc | Semiconductor element having an organic silicone base cement |
| US3479570A (en) * | 1966-06-14 | 1969-11-18 | Rca Corp | Encapsulation and connection structure for high power and high frequency semiconductor devices |
| US3492157A (en) * | 1966-06-20 | 1970-01-27 | Tokyo Shibaura Electric Co | Resin-sealed semiconductor device and manufacturing method for the same |
| US3594619A (en) * | 1967-09-30 | 1971-07-20 | Nippon Electric Co | Face-bonded semiconductor device having improved heat dissipation |
| US3560808A (en) * | 1968-04-18 | 1971-02-02 | Motorola Inc | Plastic encapsulated semiconductor assemblies |
| US3590341A (en) * | 1968-08-19 | 1971-06-29 | Kmc Semiconductor Corp | Microwave transistor package |
| US3546543A (en) * | 1968-08-30 | 1970-12-08 | Nat Beryllia Corp | Hermetically sealed electronic package for semiconductor devices with high current carrying conductors |
| US3539875A (en) * | 1968-09-25 | 1970-11-10 | Philips Corp | Hardware envelope with semiconductor mounting arrangements |
| US3559002A (en) * | 1968-12-09 | 1971-01-26 | Gen Electric | Semiconductor device with multiple shock absorbing and passivation layers |
| DE1914442C3 (de) * | 1969-03-21 | 1978-05-11 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Halbleiteranordnung |
| US3628106A (en) * | 1969-05-05 | 1971-12-14 | Gen Electric | Passivated semiconductor device with protective peripheral junction portion |
| US3628107A (en) * | 1969-05-05 | 1971-12-14 | Gen Electric | Passivated semiconductor device with peripheral protective junction |
| US3597658A (en) * | 1969-11-26 | 1971-08-03 | Rca Corp | High current semiconductor device employing a zinc-coated aluminum substrate |
| JPS4947713B1 (fr) * | 1970-04-27 | 1974-12-17 | ||
| US3718969A (en) * | 1970-09-21 | 1973-03-06 | Motorola Inc | Plastic encapsulated semiconductor assemblies |
| US3753634A (en) * | 1970-10-09 | 1973-08-21 | T Bliven | Molding means for strip frame semiconductive device |
| US3828425A (en) * | 1970-10-16 | 1974-08-13 | Texas Instruments Inc | Method for making semiconductor packaged devices and assemblies |
| US3742599A (en) * | 1970-12-14 | 1973-07-03 | Gen Electric | Processes for the fabrication of protected semiconductor devices |
| US3719969A (en) * | 1971-04-21 | 1973-03-13 | Goodrich Co B F | Plastic encapsulated semiconductor assemblies |
| US3792406A (en) * | 1971-11-26 | 1974-02-12 | Dale Electronics | Fuse resistor and the method for making same |
| US3839660A (en) * | 1973-02-05 | 1974-10-01 | Gen Motors Corp | Power semiconductor device package |
| US3814994A (en) * | 1973-03-07 | 1974-06-04 | Gen Motors Corp | Four terminal power transistor |
| DE2760035C2 (de) * | 1974-06-12 | 1983-11-24 | The D.L. Auld Co., Columbus, Ohio | Verfahren zur Herstellung dekorativer Embleme |
| DE2941822A1 (de) | 1979-10-16 | 1981-04-30 | Patra Patent Treuhand | Vorschaltanordnung zum betreiben von niederdruckentladungslampen |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2750654A (en) * | 1950-10-03 | 1956-06-19 | Harry L Owens | Miniature rectifier |
| NL104654C (fr) * | 1952-12-31 | 1900-01-01 | ||
| US2888736A (en) * | 1955-03-31 | 1959-06-02 | Raytheon Mfg Co | Transistor packages |
| US2948835A (en) * | 1958-10-21 | 1960-08-09 | Texas Instruments Inc | Transistor structure |
| US2985806A (en) * | 1958-12-24 | 1961-05-23 | Philco Corp | Semiconductor fabrication |
| US3199001A (en) * | 1960-12-08 | 1965-08-03 | Microtronics Inc | Temperature stable transistor device |
| US3195026A (en) * | 1962-09-21 | 1965-07-13 | Westinghouse Electric Corp | Hermetically enclosed semiconductor device |
| US3231797A (en) * | 1963-09-20 | 1966-01-25 | Nat Semiconductor Corp | Semiconductor device |
-
1965
- 1965-08-18 US US480577A patent/US3283224A/en not_active Expired - Lifetime
-
1966
- 1966-03-15 GB GB11327/66A patent/GB1135607A/en not_active Expired
- 1966-04-12 FR FR57250A patent/FR1475436A/fr not_active Expired
- 1966-05-05 DE DE19661564839 patent/DE1564839A1/de active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| GB1135607A (en) | 1968-12-04 |
| US3283224A (en) | 1966-11-01 |
| DE1564839A1 (de) | 1969-10-23 |
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