FR1517308A - Procédé de polissage de matériaux semi-conducteurs - Google Patents

Procédé de polissage de matériaux semi-conducteurs

Info

Publication number
FR1517308A
FR1517308A FR8436A FR06008436A FR1517308A FR 1517308 A FR1517308 A FR 1517308A FR 8436 A FR8436 A FR 8436A FR 06008436 A FR06008436 A FR 06008436A FR 1517308 A FR1517308 A FR 1517308A
Authority
FR
France
Prior art keywords
polishing process
semiconductor materials
polishing
semiconductor
materials
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8436A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of FR1517308A publication Critical patent/FR1517308A/fr
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/102—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being able to rotate freely due to a frictional contact with the lapping tool
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
    • H10P14/2901—Materials
    • H10P14/2902—Materials being Group IVA materials
    • H10P14/2905—Silicon, silicon germanium or germanium
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34—Deposited materials, e.g. layers
    • H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
    • H10P14/3404—Deposited materials, e.g. layers characterised by the chemical composition being Group IVA materials
    • H10P14/3411—Silicon, silicon germanium or germanium
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/36—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by treatments done before the formation of the materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Weting (AREA)
FR8436A 1966-05-12 1967-03-23 Procédé de polissage de matériaux semi-conducteurs Expired FR1517308A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US54958666A 1966-05-12 1966-05-12

Publications (1)

Publication Number Publication Date
FR1517308A true FR1517308A (fr) 1968-03-15

Family

ID=24193603

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8436A Expired FR1517308A (fr) 1966-05-12 1967-03-23 Procédé de polissage de matériaux semi-conducteurs

Country Status (4)

Country Link
US (1) US3436259A (fr)
DE (1) DE1621473B2 (fr)
FR (1) FR1517308A (fr)
GB (1) GB1168536A (fr)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3549439A (en) * 1967-09-15 1970-12-22 North American Rockwell Chemical lapping method
US3629023A (en) * 1968-07-17 1971-12-21 Minnesota Mining & Mfg METHOD OF CHEMICALLY POLISHING CRYSTALS OF II(b){14 VI(a) SYSTEM
US3930870A (en) * 1973-12-28 1976-01-06 International Business Machines Corporation Silicon polishing solution preparation
US3951710A (en) * 1974-09-13 1976-04-20 International Business Machines Corporation Method for removing copper contaminant from semiconductor surfaces
US4050954A (en) * 1976-03-25 1977-09-27 International Business Machines Corporation Surface treatment of semiconductor substrates
US4640846A (en) * 1984-09-25 1987-02-03 Yue Kuo Semiconductor spin coating method
FR2580974B1 (fr) * 1985-04-26 1989-05-19 Lam Plan Sa Dispositif et procede de polissage
JPH01121114U (fr) * 1988-02-04 1989-08-16
JPH07108815B2 (ja) * 1988-02-22 1995-11-22 日本特殊陶業株式会社 窒化珪素質焼結体の製造方法
US5399528A (en) * 1989-06-01 1995-03-21 Leibovitz; Jacques Multi-layer fabrication in integrated circuit systems
GB9121309D0 (en) * 1991-10-08 1991-11-20 Inventive Plastic Products Lim Injection molding machine
US5225034A (en) * 1992-06-04 1993-07-06 Micron Technology, Inc. Method of chemical mechanical polishing predominantly copper containing metal layers in semiconductor processing
US5360509A (en) * 1993-03-08 1994-11-01 Gi Corporation Low cost method of fabricating epitaxial semiconductor devices
US6248651B1 (en) 1998-06-24 2001-06-19 General Semiconductor, Inc. Low cost method of fabricating transient voltage suppressor semiconductor devices or the like
US6328872B1 (en) * 1999-04-03 2001-12-11 Nutool, Inc. Method and apparatus for plating and polishing a semiconductor substrate
US6409904B1 (en) * 1998-12-01 2002-06-25 Nutool, Inc. Method and apparatus for depositing and controlling the texture of a thin film
US7204917B2 (en) * 1998-12-01 2007-04-17 Novellus Systems, Inc. Workpiece surface influencing device designs for electrochemical mechanical processing and method of using the same
US6341998B1 (en) 1999-11-04 2002-01-29 Vlsi Technology, Inc. Integrated circuit (IC) plating deposition system and method
US20090020437A1 (en) * 2000-02-23 2009-01-22 Basol Bulent M Method and system for controlled material removal by electrochemical polishing
WO2002023613A2 (fr) * 2000-09-15 2002-03-21 Rodel Holdings, Inc. Systeme de planarisation et de polissage chimiomecaniques utilise pour le depot de metal
US6530824B2 (en) 2001-03-09 2003-03-11 Rodel Holdings, Inc. Method and composition for polishing by CMP
FR2914925B1 (fr) * 2007-04-13 2009-06-05 Altis Semiconductor Snc Solution utilisee dans la fabrication d'un materiau semi-conducteur poreux et procede de fabrication dudit materiau
JP5287982B2 (ja) 2009-04-13 2013-09-11 株式会社Ｓｕｍｃｏ シリコンエピタキシャルウェーハの製造方法
JP5381304B2 (ja) 2009-05-08 2014-01-08 株式会社Ｓｕｍｃｏ シリコンエピタキシャルウェーハの製造方法
GB201117279D0 (en) * 2011-10-06 2011-11-16 Nexeon Ltd Etched silicon structures, method of forming etched silicon structures and uses thereof

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3224904A (en) * 1963-03-18 1965-12-21 Bell Telephone Labor Inc Semiconductor surface cleaning
US3342652A (en) * 1964-04-02 1967-09-19 Ibm Chemical polishing of a semi-conductor substrate

Also Published As

Publication number Publication date
GB1168536A (en) 1969-10-29
US3436259A (en) 1969-04-01
DE1621473A1 (de) 1970-07-23
DE1621473B2 (de) 1971-09-30

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