FR1543300A - Boîtier pour dispositif semi-conducteur à forte dissipation calorifique - Google Patents

Boîtier pour dispositif semi-conducteur à forte dissipation calorifique

Info

Publication number
FR1543300A
FR1543300A FR117683A FR117683A FR1543300A FR 1543300 A FR1543300 A FR 1543300A FR 117683 A FR117683 A FR 117683A FR 117683 A FR117683 A FR 117683A FR 1543300 A FR1543300 A FR 1543300A
Authority
FR
France
Prior art keywords
semiconductor device
heat dissipation
high heat
device package
dissipation semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR117683A
Other languages
English (en)
Inventor
Henri Thouvenin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RADIOTECHNIQUE COPRIM RTC
Original Assignee
RADIOTECHNIQUE COPRIM RTC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RADIOTECHNIQUE COPRIM RTC filed Critical RADIOTECHNIQUE COPRIM RTC
Priority to FR117683A priority Critical patent/FR1543300A/fr
Priority to NL6811325A priority patent/NL6811325A/xx
Priority to DE19681801164 priority patent/DE1801164A1/de
Application granted granted Critical
Publication of FR1543300A publication Critical patent/FR1543300A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/134—Containers comprising a conductive base serving as an interconnection having other interconnections parallel to the conductive base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/461—Leadframes specially adapted for cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/153—Containers comprising an insulating or insulated base having interconnections in passages through the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
FR117683A 1967-08-11 1967-08-11 Boîtier pour dispositif semi-conducteur à forte dissipation calorifique Expired FR1543300A (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FR117683A FR1543300A (fr) 1967-08-11 1967-08-11 Boîtier pour dispositif semi-conducteur à forte dissipation calorifique
NL6811325A NL6811325A (fr) 1967-08-11 1968-08-09
DE19681801164 DE1801164A1 (de) 1967-08-11 1968-10-04 Vakuumdichte Huelle,in der wenigstens ein Waerme entwickelndes Halbleiterelement untergebracht ist

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR117683A FR1543300A (fr) 1967-08-11 1967-08-11 Boîtier pour dispositif semi-conducteur à forte dissipation calorifique
DE19681801164 DE1801164A1 (de) 1967-08-11 1968-10-04 Vakuumdichte Huelle,in der wenigstens ein Waerme entwickelndes Halbleiterelement untergebracht ist

Publications (1)

Publication Number Publication Date
FR1543300A true FR1543300A (fr) 1968-10-25

Family

ID=25756212

Family Applications (1)

Application Number Title Priority Date Filing Date
FR117683A Expired FR1543300A (fr) 1967-08-11 1967-08-11 Boîtier pour dispositif semi-conducteur à forte dissipation calorifique

Country Status (3)

Country Link
DE (1) DE1801164A1 (fr)
FR (1) FR1543300A (fr)
NL (1) NL6811325A (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3641401A (en) * 1971-03-10 1972-02-08 American Lava Corp Leadless ceramic package for integrated circuits
EP0087159B1 (fr) * 1982-02-24 1987-05-06 Cimsa Sintra Traversée électrique de boîtier de circuit hybride et connecteurs complementaires
CN105470705A (zh) * 2015-12-28 2016-04-06 泰州市航宇电器有限公司 一种用于快速插拔的可焊接混合金属封装外壳

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5116258B2 (fr) * 1971-10-30 1976-05-22

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3641401A (en) * 1971-03-10 1972-02-08 American Lava Corp Leadless ceramic package for integrated circuits
EP0087159B1 (fr) * 1982-02-24 1987-05-06 Cimsa Sintra Traversée électrique de boîtier de circuit hybride et connecteurs complementaires
CN105470705A (zh) * 2015-12-28 2016-04-06 泰州市航宇电器有限公司 一种用于快速插拔的可焊接混合金属封装外壳
CN105470705B (zh) * 2015-12-28 2018-02-23 泰州市航宇电器有限公司 一种用于快速插拔的可焊接混合金属封装外壳

Also Published As

Publication number Publication date
DE1801164A1 (de) 1970-04-16
NL6811325A (fr) 1969-02-13

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