FR2221815B1 - - Google Patents

Info

Publication number
FR2221815B1
FR2221815B1 FR7409052A FR7409052A FR2221815B1 FR 2221815 B1 FR2221815 B1 FR 2221815B1 FR 7409052 A FR7409052 A FR 7409052A FR 7409052 A FR7409052 A FR 7409052A FR 2221815 B1 FR2221815 B1 FR 2221815B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7409052A
Other languages
French (fr)
Other versions
FR2221815A1 (2
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of FR2221815A1 publication Critical patent/FR2221815A1/fr
Application granted granted Critical
Publication of FR2221815B1 publication Critical patent/FR2221815B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0421—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7621—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting two or more semiconductor substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
FR7409052A 1973-03-16 1974-03-18 Expired FR2221815B1 (2)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2313096A DE2313096A1 (de) 1973-03-16 1973-03-16 Probenhalterung fuer das aetzen von duennen schichten

Publications (2)

Publication Number Publication Date
FR2221815A1 FR2221815A1 (2) 1974-10-11
FR2221815B1 true FR2221815B1 (2) 1978-06-09

Family

ID=5874944

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7409052A Expired FR2221815B1 (2) 1973-03-16 1974-03-18

Country Status (4)

Country Link
JP (1) JPS5536070B2 (2)
DE (1) DE2313096A1 (2)
FR (1) FR2221815B1 (2)
GB (1) GB1461464A (2)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2316723A1 (fr) * 1975-07-03 1977-01-28 Zaitseva Aita Dispositif d'amenee de pieces en vue de leur traitement par un faisceau d'ions
GB2119236A (en) * 1982-03-26 1983-11-16 Philips Electronic Associated Magazine and disc holders for supporting discs in the magazine
JPS61134378U (2) * 1985-02-13 1986-08-21
FR2701463B1 (fr) * 1993-02-15 1995-05-05 Alain Gentric Dispositif de sélection pour amener un objet, par exemple un substrat, à une station de traitement.
DE102005021831A1 (de) * 2005-05-11 2006-11-23 Mühlbauer Ag Vorrichtung zum Transportieren von Plättchen
AT510606B1 (de) 2011-02-09 2012-05-15 Leica Mikrosysteme Gmbh Vorrichtung und verfahren zur probenpräparation

Also Published As

Publication number Publication date
DE2313096A1 (de) 1974-09-26
JPS5536070B2 (2) 1980-09-18
FR2221815A1 (2) 1974-10-11
JPS49127298A (2) 1974-12-05
GB1461464A (en) 1977-01-13

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Legal Events

Date Code Title Description
ST Notification of lapse