JPS49127298A - - Google Patents

Info

Publication number
JPS49127298A
JPS49127298A JP49029273A JP2927374A JPS49127298A JP S49127298 A JPS49127298 A JP S49127298A JP 49029273 A JP49029273 A JP 49029273A JP 2927374 A JP2927374 A JP 2927374A JP S49127298 A JPS49127298 A JP S49127298A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP49029273A
Other languages
Japanese (ja)
Other versions
JPS5536070B2 (2
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS49127298A publication Critical patent/JPS49127298A/ja
Publication of JPS5536070B2 publication Critical patent/JPS5536070B2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04Apparatus for manufacture or treatment
    • H10P72/0402Apparatus for fluid treatment
    • H10P72/0418Apparatus for fluid treatment for etching
    • H10P72/0421Apparatus for fluid treatment for etching for drying etching
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7621Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting two or more semiconductor substrates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • ing And Chemical Polishing (AREA)
  • Welding Or Cutting Using Electron Beams (AREA)
  • Drying Of Semiconductors (AREA)
JP2927374A 1973-03-16 1974-03-15 Expired JPS5536070B2 (2)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2313096A DE2313096A1 (de) 1973-03-16 1973-03-16 Probenhalterung fuer das aetzen von duennen schichten

Publications (2)

Publication Number Publication Date
JPS49127298A true JPS49127298A (2) 1974-12-05
JPS5536070B2 JPS5536070B2 (2) 1980-09-18

Family

ID=5874944

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2927374A Expired JPS5536070B2 (2) 1973-03-16 1974-03-15

Country Status (4)

Country Link
JP (1) JPS5536070B2 (2)
DE (1) DE2313096A1 (2)
FR (1) FR2221815B1 (2)
GB (1) GB1461464A (2)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2316723A1 (fr) * 1975-07-03 1977-01-28 Zaitseva Aita Dispositif d'amenee de pieces en vue de leur traitement par un faisceau d'ions
GB2119236A (en) * 1982-03-26 1983-11-16 Philips Electronic Associated Magazine and disc holders for supporting discs in the magazine
JPS61134378U (2) * 1985-02-13 1986-08-21
FR2701463B1 (fr) * 1993-02-15 1995-05-05 Alain Gentric Dispositif de sélection pour amener un objet, par exemple un substrat, à une station de traitement.
DE102005021831A1 (de) * 2005-05-11 2006-11-23 Mühlbauer Ag Vorrichtung zum Transportieren von Plättchen
AT510606B1 (de) 2011-02-09 2012-05-15 Leica Mikrosysteme Gmbh Vorrichtung und verfahren zur probenpräparation

Also Published As

Publication number Publication date
DE2313096A1 (de) 1974-09-26
JPS5536070B2 (2) 1980-09-18
FR2221815A1 (2) 1974-10-11
FR2221815B1 (2) 1978-06-09
GB1461464A (en) 1977-01-13

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