FR2379911A2 - Semi-conducteur de puissance non encapsule - Google Patents

Semi-conducteur de puissance non encapsule

Info

Publication number
FR2379911A2
FR2379911A2 FR7703185A FR7703185A FR2379911A2 FR 2379911 A2 FR2379911 A2 FR 2379911A2 FR 7703185 A FR7703185 A FR 7703185A FR 7703185 A FR7703185 A FR 7703185A FR 2379911 A2 FR2379911 A2 FR 2379911A2
Authority
FR
France
Prior art keywords
epoxy
semiconductor device
protective layer
silicon substrate
substrate surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7703185A
Other languages
English (en)
French (fr)
Other versions
FR2379911B2 (2
Inventor
Bernard Legrand
Alain Rouyrre
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alstom SA
Original Assignee
Alsthom Atlantique SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from FR7533171A external-priority patent/FR2366697A1/fr
Application filed by Alsthom Atlantique SA filed Critical Alsthom Atlantique SA
Priority to FR7703185A priority Critical patent/FR2379911A2/fr
Publication of FR2379911A2 publication Critical patent/FR2379911A2/fr
Application granted granted Critical
Publication of FR2379911B2 publication Critical patent/FR2379911B2/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/20—Conductive package substrates serving as an interconnection, e.g. metal plates
    • H10W70/24—Conductive package substrates serving as an interconnection, e.g. metal plates characterised by materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/137—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being directly on the semiconductor body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
FR7703185A 1975-10-30 1977-02-04 Semi-conducteur de puissance non encapsule Granted FR2379911A2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR7703185A FR2379911A2 (fr) 1975-10-30 1977-02-04 Semi-conducteur de puissance non encapsule

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR7533171A FR2366697A1 (fr) 1975-10-30 1975-10-30 Semi-conducteur de puissance non encapsule
FR7703185A FR2379911A2 (fr) 1975-10-30 1977-02-04 Semi-conducteur de puissance non encapsule

Publications (2)

Publication Number Publication Date
FR2379911A2 true FR2379911A2 (fr) 1978-09-01
FR2379911B2 FR2379911B2 (2) 1982-01-08

Family

ID=34227837

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7703185A Granted FR2379911A2 (fr) 1975-10-30 1977-02-04 Semi-conducteur de puissance non encapsule

Country Status (1)

Country Link
FR (1) FR2379911A2 (2)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2662542A1 (fr) * 1990-05-24 1991-11-29 Mitsubishi Electric Corp Dispositif a semiconducteurs comportant un motif metallise.

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2662542A1 (fr) * 1990-05-24 1991-11-29 Mitsubishi Electric Corp Dispositif a semiconducteurs comportant un motif metallise.

Also Published As

Publication number Publication date
FR2379911B2 (2) 1982-01-08

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