FR2379911B2 - - Google Patents

Info

Publication number
FR2379911B2
FR2379911B2 FR7703185A FR7703185A FR2379911B2 FR 2379911 B2 FR2379911 B2 FR 2379911B2 FR 7703185 A FR7703185 A FR 7703185A FR 7703185 A FR7703185 A FR 7703185A FR 2379911 B2 FR2379911 B2 FR 2379911B2
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7703185A
Other languages
French (fr)
Other versions
FR2379911A2 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alstom SA
Original Assignee
Alsthom Atlantique SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from FR7533171A external-priority patent/FR2366697A1/fr
Application filed by Alsthom Atlantique SA filed Critical Alsthom Atlantique SA
Priority to FR7703185A priority Critical patent/FR2379911A2/fr
Publication of FR2379911A2 publication Critical patent/FR2379911A2/fr
Application granted granted Critical
Publication of FR2379911B2 publication Critical patent/FR2379911B2/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/20—Conductive package substrates serving as an interconnection, e.g. metal plates
    • H10W70/24—Conductive package substrates serving as an interconnection, e.g. metal plates characterised by materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/137—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being directly on the semiconductor body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
FR7703185A 1975-10-30 1977-02-04 Semi-conducteur de puissance non encapsule Granted FR2379911A2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR7703185A FR2379911A2 (fr) 1975-10-30 1977-02-04 Semi-conducteur de puissance non encapsule

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR7533171A FR2366697A1 (fr) 1975-10-30 1975-10-30 Semi-conducteur de puissance non encapsule
FR7703185A FR2379911A2 (fr) 1975-10-30 1977-02-04 Semi-conducteur de puissance non encapsule

Publications (2)

Publication Number Publication Date
FR2379911A2 FR2379911A2 (fr) 1978-09-01
FR2379911B2 true FR2379911B2 (2) 1982-01-08

Family

ID=34227837

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7703185A Granted FR2379911A2 (fr) 1975-10-30 1977-02-04 Semi-conducteur de puissance non encapsule

Country Status (1)

Country Link
FR (1) FR2379911A2 (2)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2634300B2 (ja) * 1990-05-24 1997-07-23 三菱電機株式会社 半導体装置

Also Published As

Publication number Publication date
FR2379911A2 (fr) 1978-09-01

Similar Documents

Publication Publication Date Title
IN146225B (2)
JPS5635566B2 (2)
JPS5643465B2 (2)
IN145641B (2)
JPS5230304Y2 (2)
JPS5510800Y2 (2)
FR2379911B2 (2)
JPS5263840U (2)
JPS5441515Y2 (2)
JPS5425904B2 (2)
JPS5152372Y1 (2)
JPS5264174U (2)
JPS5243577U (2)
JPS5251911U (2)
JPS5187277U (2)
JPS5257119U (2)
JPS51102632U (2)
JPS5288110U (2)
CH596617A5 (2)
BG22665A1 (2)
CH603817A5 (2)
CH603717A5 (2)
CH603552A5 (2)
CH603178A5 (2)
CH602504A5 (2)