FR2402995B1 - - Google Patents

Info

Publication number: FR2402995B1
Authority: FR; France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

FR7727469A

Other versions

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Thales SA

Original Assignee

Thomson CSF SA

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1977-09-12

Filing date

1977-09-12

Publication date

1980-12-26

1977-09-12 Application filed by Thomson CSF SA filed Critical Thomson CSF SA

1977-09-12 Priority to FR7727469A priority Critical patent/FR2402995A1/fr

1978-09-08 Priority to DE19782839215 priority patent/DE2839215A1/de

1978-09-11 Priority to GB7836298A priority patent/GB2004127B/en

1978-09-12 Priority to JP11212878A priority patent/JPS5450871A/ja

1979-04-06 Publication of FR2402995A1 publication Critical patent/FR2402995A1/fr

1980-12-26 Application granted granted Critical

1980-12-26 Publication of FR2402995B1 publication Critical patent/FR2402995B1/fr

Status Granted legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/701—Tape-automated bond [TAB] connectors
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/453—Leadframes comprising flexible metallic tapes
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
- H10W70/63—Vias, e.g. via plugs
- H10W70/635—Through-vias
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/688—Flexible insulating substrates
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
- H10W76/13—Containers comprising a conductive base serving as an interconnection
- H10W76/134—Containers comprising a conductive base serving as an interconnection having other interconnections parallel to the conductive base
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers

FR7727469A 1977-09-12 1977-09-12 Dispositif d'interconnexion de micro-circuits Granted FR2402995A1 (fr)

Priority Applications (4)

Application Number	Priority Date	Filing Date	Title
FR7727469A FR2402995A1 (fr)	1977-09-12	1977-09-12	Dispositif d'interconnexion de micro-circuits
DE19782839215 DE2839215A1 (de)	1977-09-12	1978-09-08	Anordnung zum verbinden von mikroschaltungen
GB7836298A GB2004127B (en)	1977-09-12	1978-09-11	Device for interconnecting microcircuits
JP11212878A JPS5450871A (en)	1977-09-12	1978-09-12	Device for interconnecting microocircuits

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
FR7727469A FR2402995A1 (fr)	1977-09-12	1977-09-12	Dispositif d'interconnexion de micro-circuits

Publications (2)

Publication Number	Publication Date
FR2402995A1 FR2402995A1 (fr)	1979-04-06
FR2402995B1 true FR2402995B1 (fr)	1980-12-26

Family

ID=9195259

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
FR7727469A Granted FR2402995A1 (fr)	1977-09-12	1977-09-12	Dispositif d'interconnexion de micro-circuits

Country Status (4)

Country	Link
JP (1)	JPS5450871A (fr)
DE (1)	DE2839215A1 (fr)
FR (1)	FR2402995A1 (fr)
GB (1)	GB2004127B (fr)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
EP0016522B1 (fr) *	1979-02-19	1982-12-22	Fujitsu Limited	Dispositif semi-conducteur et procédé pour sa fabrication
US4320438A (en)	1980-05-15	1982-03-16	Cts Corporation	Multi-layer ceramic package
EP0409290A3 (en) *	1984-02-21	1991-12-18	Mosaic Systems, Inc.	Wafer scale package system and header and method of manufacture thereof
JPS6298737A (ja) *	1985-10-25	1987-05-08	Sharp Corp	半導体装置の交換方法
JPH01503663A (ja) *	1986-05-01	1989-12-07	ハネウエル・インコーポレーテツド	多重集積回路相互接続装置
WO1988002210A1 (fr) *	1986-09-15	1988-03-24	Baysage Pty. Ltd.	Dispositif d'isolation electrique
GB2204184A (en) *	1987-04-29	1988-11-02	Stanley Bracey	Mounting electronic components on substrates
US4933810A (en) *	1987-04-30	1990-06-12	Honeywell Inc.	Integrated circuit interconnector
US4989317A (en) *	1988-11-21	1991-02-05	Hewlett-Packard Company	Method for making tab circuit electrical connector supporting multiple components thereon
US4981817A (en) *	1988-12-29	1991-01-01	International Business Machines Corporation	Tab method for implementing dynamic chip burn-in
US5164888A (en) *	1988-12-29	1992-11-17	International Business Machines	Method and structure for implementing dynamic chip burn-in
WO1991000618A1 (fr) *	1989-07-03	1991-01-10	General Electric Company	Systemes electroniques disposes dans un environnement soumis a des efforts importants
JP3985016B2 (ja) *	1997-10-31	2007-10-03	沖電気工業株式会社	半導体装置

1977
- 1977-09-12 FR FR7727469A patent/FR2402995A1/fr active Granted
1978
- 1978-09-08 DE DE19782839215 patent/DE2839215A1/de not_active Withdrawn
- 1978-09-11 GB GB7836298A patent/GB2004127B/en not_active Expired
- 1978-09-12 JP JP11212878A patent/JPS5450871A/ja active Pending

Also Published As

Publication number	Publication date
GB2004127B (en)	1982-07-14
JPS5450871A (en)	1979-04-21
FR2402995A1 (fr)	1979-04-06
DE2839215A1 (de)	1979-03-22
GB2004127A (en)	1979-03-21

Legal Events

Date	Code	Title	Description
1985-07-26	ST	Notification of lapse

Publication	Publication Date	Title
FR2378878B1 (fr)	1981-05-22
FR2377962B1 (fr)	1985-04-26
FR2377628B1 (fr)	1981-09-11
FR2379062B1 (fr)	1984-01-27
FR2402995B1 (fr)	1980-12-26
FR2378398B1 (fr)	1982-04-02
FR2377827B1 (fr)	1984-08-24
FR2377894B1 (fr)	1980-02-15
FR2377695B1 (fr)	1980-11-21
FR2377371B1 (fr)	1981-08-07
FR2378593B1 (fr)	1981-05-08
FR2378444B1 (fr)	1983-12-09
FR2377312B1 (fr)	1981-01-09
FR2376851B1 (fr)	1983-01-28
CS189326B1 (fr)	1979-04-30
BG25852A1 (fr)	1979-01-12
BG25838A1 (fr)	1979-01-12
CH655935B (fr)	1986-05-30
CH604394A5 (fr)	1978-09-15
CH604081A5 (fr)	1978-08-31
BG26492A1 (fr)	1979-04-12
BG25860A1 (fr)	1979-01-12
BG25855A1 (fr)	1979-01-12
BG25853A1 (fr)	1979-01-12
BG25845A1 (fr)	1979-01-12