JPS5450871A - Device for interconnecting microocircuits - Google Patents

Device for interconnecting microocircuits

Info

Publication number
JPS5450871A
JPS5450871A JP11212878A JP11212878A JPS5450871A JP S5450871 A JPS5450871 A JP S5450871A JP 11212878 A JP11212878 A JP 11212878A JP 11212878 A JP11212878 A JP 11212878A JP S5450871 A JPS5450871 A JP S5450871A
Authority
JP
Japan
Prior art keywords
microocircuits
interconnecting
interconnecting microocircuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11212878A
Other languages
English (en)
Japanese (ja)
Inventor
Beruniyooru Kuroodo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Publication of JPS5450871A publication Critical patent/JPS5450871A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/453—Leadframes comprising flexible metallic tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/134—Containers comprising a conductive base serving as an interconnection having other interconnections parallel to the conductive base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Led Device Packages (AREA)
  • Wire Bonding (AREA)
JP11212878A 1977-09-12 1978-09-12 Device for interconnecting microocircuits Pending JPS5450871A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7727469A FR2402995A1 (fr) 1977-09-12 1977-09-12 Dispositif d'interconnexion de micro-circuits

Publications (1)

Publication Number Publication Date
JPS5450871A true JPS5450871A (en) 1979-04-21

Family

ID=9195259

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11212878A Pending JPS5450871A (en) 1977-09-12 1978-09-12 Device for interconnecting microocircuits

Country Status (4)

Country Link
JP (1) JPS5450871A (fr)
DE (1) DE2839215A1 (fr)
FR (1) FR2402995A1 (fr)
GB (1) GB2004127B (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01503663A (ja) * 1986-05-01 1989-12-07 ハネウエル・インコーポレーテツド 多重集積回路相互接続装置

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0016522B1 (fr) * 1979-02-19 1982-12-22 Fujitsu Limited Dispositif semi-conducteur et procédé pour sa fabrication
US4320438A (en) 1980-05-15 1982-03-16 Cts Corporation Multi-layer ceramic package
EP0409290A3 (en) * 1984-02-21 1991-12-18 Mosaic Systems, Inc. Wafer scale package system and header and method of manufacture thereof
JPS6298737A (ja) * 1985-10-25 1987-05-08 Sharp Corp 半導体装置の交換方法
WO1988002210A1 (fr) * 1986-09-15 1988-03-24 Baysage Pty. Ltd. Dispositif d'isolation electrique
GB2204184A (en) * 1987-04-29 1988-11-02 Stanley Bracey Mounting electronic components on substrates
US4933810A (en) * 1987-04-30 1990-06-12 Honeywell Inc. Integrated circuit interconnector
US4989317A (en) * 1988-11-21 1991-02-05 Hewlett-Packard Company Method for making tab circuit electrical connector supporting multiple components thereon
US4981817A (en) * 1988-12-29 1991-01-01 International Business Machines Corporation Tab method for implementing dynamic chip burn-in
US5164888A (en) * 1988-12-29 1992-11-17 International Business Machines Method and structure for implementing dynamic chip burn-in
WO1991000618A1 (fr) * 1989-07-03 1991-01-10 General Electric Company Systemes electroniques disposes dans un environnement soumis a des efforts importants
JP3985016B2 (ja) * 1997-10-31 2007-10-03 沖電気工業株式会社 半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01503663A (ja) * 1986-05-01 1989-12-07 ハネウエル・インコーポレーテツド 多重集積回路相互接続装置

Also Published As

Publication number Publication date
FR2402995B1 (fr) 1980-12-26
GB2004127B (en) 1982-07-14
FR2402995A1 (fr) 1979-04-06
DE2839215A1 (de) 1979-03-22
GB2004127A (en) 1979-03-21

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